Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device

ABSTRACT

A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.

CROSS REFERENCE OF RELATED APPLICATION

This is a U.S. National Stage under 35 U.S.C. 371 of the InternationalApplication Number PCT/CN2016/103247, filed Oct. 25, 2016, which claimspriority to Chinese application number 201610183447.6, filed Mar. 28,2016, Chinese application number 201620246631.6, filed Mar. 28, 2016,Chinese application number 201610278035.0, filed Apr. 28, 2016, Chineseapplication number 201620373323.X, filed Apr. 28, 2016, Chineseapplication number 201610668807.1, filed Aug. 12, 2016, Chineseapplication number 201620875383.1, filed Aug. 12, 2016, Chineseapplication number 201620875381.2, filed Aug. 12, 2016, Chineseapplication number 201610669214.7, filed Aug. 12, 2016, Chineseapplication number 201620876056.8, filed Aug. 12, 2016, and Chineseapplication number 201620875781.3, filed Aug. 12, 2016.

BACKGROUND OF THE PRESENT INVENTION Field of Invention

The present invention relates to optical imaging, and more particularlyto a camera module and its molded photosensitive assembly andmanufacturing method, and an electronic device thereof.

Description of Related Arts

In recent years, camera module for acquiring images has become more andmore widely used in many electronic devices such as personal electronicproducts, automotive products, medical products and so on. For example,the camera module is one of the standard accessories in portableelectronic devices such as smart phones and tablet computers. The cameramodule in portable electronic devices can not only capture images butalso enable portable electronic devices to have more functions such asreal-time video calls. With the increasingly thinner and lighterrequirements for portable electronic devices, and the higher imagingquality requirements of the camera module, more stringent requirementsare focused on the overall size of the camera module and the imagingcapabilities of the camera module. In other words, with the trend ofdevelopment in portable electronic devices, the imaging capability ofthe camera module needs to be improved and enhanced with reducing theoverall size of the camera module.

It is well known that the improvement of the imaging capability of thecamera module is based on the configuration of a photosensitive elementwith a larger imaging area and more passive electronic components suchas driving resistors and capacitors. Mainly because the camera moduleneeds to be configured by photosensitive element with larger imagingarea and more passive electronic components, it has to improve thepackaging process of the camera module to reduce the overall size of thecamera module. The conventional packaging process used for the cameramodule is a COB (Chip On Board) packaging process, that is, a circuitboard, a photosensitive element, a supporter, and the like of the cameramodule are respectively fabricated. Then, the passive electroniccomponents, photosensitive element and the supporter are sequentiallydisposed to be packaged on the circuit board. In order to ensure theimaging quality of the camera module, it is necessary to fill gluebetween every two elements, for example, filling glue between thesupporter and the circuit board to package the supporter on the circuitboard and leveling the supporter with the circuit board. Therefore, thesize of the camera module can not be effectively reduced in the COBpackaging process and the packaging efficiency of the camera module isrelatively low.

In order to solve these problems, a molding process is introduced intothe field of camera module, which allows the supporter of the cameramodule to be integrally formed on the circuit board duringmanufacturing. In this way, not only the size of the camera module canbe effectively reduced, it can also reduce manufacturing errors of thecamera module to improve the imaging quality. However, there are stillsome shortcomings in introducing the molding process into the field ofthe camera module directly.

Firstly, the photosensitive element of the camera module mounted on thecircuit board is electrically connected with the circuit board through aplurality of wires. Usually, the two ends of one of the wires arerespectively soldered to the photosensitive element and the circuitboard. And limited by the bonding process and the properties of thewire, after the two ends of the wire are soldered to the photosensitiveelement and the wire board, the wire is curved upwardly and protrudedfrom the upper surface of the photosensitive element. During the moldingprocess of the camera module, an upper mold of a set of molds is presseddownwardly, and the surface of the upper mold may press a protrudingportion of the wire that may cause deformation of the wire. Once thewire is deformed, the wire is difficult to return to its original shapewhen the upper mold is removed.

Secondly, when the molding material for forming the supporter is addedinto a molding cavity inside the molds and solidified in the moldingcavity to form the supporter, the deformed wire is preferred to bewrapped inside the supporter to be maintained in the deformed shape. Theability to transmit electrical signals between the photosensitiveelement and the circuit board of the deformed wire is greatly reduced,so that the imaging capability and imaging efficiency of the cameramodule are adversely affected. More importantly, when the wire isdeformed by the pressing surface of the upper mold, the deformationdirection and degree of deformation of the wire are uncontrollable.Therefore, two adjacent deformed wires may come in contact with eachother that would cause a short-circuit, which leads to increasing thedefect rate of the camera module. In addition, after the photosensitiveelement is mounted on the circuit board, a gap is formed between thephotosensitive element and the circuit board. During the moldingprocess, the molding material in fluid is capable of entering the gapformed between the photosensitive element and the circuit board, so thatthe mounting relationship between the photosensitive element and thecircuit board is changed. Once the mounting relationship between thephotosensitive element and the circuit board is changed, it inevitablycauses inclination between the photosensitive element and the circuitboard which adversely affects the imaging quality of the camera module.

SUMMARY OF THE PRESENT INVENTION

The invention is advantageous in that it provides a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the molded photosensitive assemblyprovides a supporting member which is capable of avoiding an upper moldof a molding-die pressing on a wire connected between a photosensitiveelement and a circuit board of the molded photosensitive assembly, so asto prevent the wire from being deformed by being pressed during moldingprocess.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein during the molding process, when theupper mold of the molding-die is matched on a lower mold while apressing surface of the upper mold touched on the top surface of thesupporting member, the upper mold is supported by the supporting memberupwardly, in order to avoid the pressure of the upper mold applyingdirectly on the wire, so as to prevent the wire from being pressed anddeformed.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein during the molding process, when theupper mold of the molding-die is matched on a lower mold while apressing surface of the upper mold touched on the top surface of thesupporting member, the upper mold is supported by the supporting memberupwardly so as to form a safety distance between the pressing surface ofthe upper mold and the wire and prevent the pressing surface of theupper mold from directly contacting the wire.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is made ofelastic material and thus the supporting member is capable of absorbingan impact force generated when the pressing surface of the upper moldpressing on the top surface of the supporting member, so as to avoid thephotosensitive element, the circuit board, the wires, and the electroniccomponents being damaged when the upper mold and the lower mold of themolding-die are closed.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is formed by anelastic material, when the upper mold is pressing the supporting member,a top surface of the supporting member is capable of avoiding any gapformed between the top surface of the supporting member and the pressingsurface of the upper mold by way of deformation, so as to prevent flashoccurred at the position of a light window of a module base whileforming the module base of the molded photosensitive assembly, whichfacilitates the yield while packaging and ensures the imaging quality ofthe camera module.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is formed froman elastic material, when the upper mold is pressing the supportingmember, the top surface of the supporting member is capable of avoidingany gap formed between the top surface of the supporting member and thepressing surface of the upper mold by way of deformation, so as to avoidthe molding material of the module base entering the connecting positionof the top surface of the supporting member and the pressing surface ofthe upper mold into the photosensitive area of the photosensitiveelement to cause contamination or damage. That is, during the moldingprocess, the photosensitive area of the photosensitive element is in aclosed environment.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is formed froman inflexible material, and the pressing surface of the upper mold ofthe molding-die is provided with a covering film. When the pressingsurface of the upper mold is pressed against the top surface of thesupporting member, the covering film is positioned between the pressingsurface of the upper mold and the top surface of the supporting member.On one hand, the covering film can prevent a gap from being formedbetween the pressing surface of the upper mold and the supportingmember, and on the other hand, the covering film can avoid thephotosensitive element, the circuit board, the wires, and electroniccomponents being damaged when the upper mold and the lower mold of themolding-die is closed.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is formed in aninflexible material, and the pressing surface of the upper mold of themolding-die is provided with a covering film. When the pressing surfaceof the upper mold is pressed against the top surface of the supportingmember, the supporting member is remained in shape, for preventing thewires from being deformed to protect the effective electrical propertiesof the wires.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is disposedalong a non-photosensitive area of the photosensitive element. Duringthe molding process, the supporting member is capable of preventing themolding material from entering the photosensitive area of thephotosensitive element through the connecting position of the supportingmember and non-photosensitive area of the photosensitive element tocontaminate or damage the photosensitive area of the photosensitiveelement.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is disposed tocover the connecting position of the wire and the photosensitive elementand the connecting position of the wire and the circuit board, so thatthe supporting member isolates every connecting position with themolding material during the molding process for making the connectingposition more reliable.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is positioned ina molding cavity formed between the upper mold and the lower mold of themolding-die, so that the supporting member is capable of blocking theflowing molding material from impinging on the wire when the moldingmaterial is injected into the molding cavity to be solidified to formthe molded base.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is pre-mountedon the circuit board and the photosensitive element, so that thesupporting member can keep the photosensitive element and the circuitboard from being displaced while the molding material is filled into themolding cavity to be solidified to form the molded base.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is disposed tocover at least a part of the non-photosensitive area of thephotosensitive element, so as to avoid the molding material contactingwith the photosensitive area of the photosensitive element that preventsthe photosensitive area of the photosensitive element from beingcontaminated or damaged.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is disposed tocover at least a part of the photosensitive element and the circuitboard, so that the gap formed between the photosensitive element and thecircuit board is sealed by the supporting member for preventing theflowing molten molding material from entering between the photosensitiveelement and the circuit board during the molding process.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is arranged tocover and enclose the wires so as to maintain the wires in apredetermined optimal effective condition by the supporting member.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is provided tocover the wires to avoid stray light being generated inside the cameramodule to affect the captured imaging quality of the camera moduleduring the using of the camera module subsequently.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member has a viscositythat can adhere contaminants, such as solder powder generated when theelectronic components are mounted on the circuit board, before themolded base is molded, adapted for preventing contaminants from thephotosensitive area of the photosensitive element.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein both connecting ends of each of thewires are respectively connected to a chip connector of thephotosensitive element and a circuit connector of the circuit board,wherein the top surface of the supporting member is higher than the chipconnector of the photosensitive element, so that the chip connector ofthe photosensitive element is not effected when the molding-die isoperated in the molding process.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is arranged tocover the chip connector of the photosensitive element, adapted forpreventing the molding material from contacting the chip connector ofthe photosensitive element during the molding process, so as to protectthe chip connector of the photosensitive element.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the supporting member is disposedoutside the chip connector of the photosensitive element, for preventingthe molding material from contacting the chip connector of thephotosensitive element during the molding process, so as to protect thechip connector of the photosensitive element.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the camera module provides a supporterhaving at least two mounting passages for mounting at least two driversor lens holders respectively in the at least two mounting passages ofthe supporter to maintain the coaxiality of the optical lenses forforming an array camera module.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the camera module provides at leastone filter member, and the filter member is held between thephotosensitive element and the optical lens and configured to filter thestray light from the optical lens entering into the interior of thearray camera module for improving the imaging quality of the arraycamera module.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the camera module provides aprotective frame which is disposed on an outer peripheral of thephotosensitive area of the photosensitive element for preventing themolding material adapted for forming an integrated package holder in themolding process from damaging the photosensitive area of thephotosensitive element.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the protective frame prevents flashingbeing formed inside the integrated package holder during the molding ofthe integrated package holder.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the protective frame is disposed onthe outer peripheral of the filter member, wherein the protective frameprevents “flashing” being formed inside the integrated package holderduring the molding formation of the integrated package holder.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the protective frame is protrudedlyprovided on an outer peripheral of a photosensitive area of thephotosensitive element, so that the photosensitive element will notdirectly contact with the molding-die by means of the integrated packageholder, so as to prevent the photosensitive area of the photosensitiveelement from being pressed to be damaged or scratched.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the protective frame has apredetermined elasticity to provide a buffering ability, wherein theprotective frame can be sufficiently in contact with the molding-dieunder pressing pressure so as to provide a sealing effect that isolatesthe photosensitive area of the photosensitive element from the externalenvironment to prevent damage to the photosensitive area of thephotosensitive element during the molding of the integrated packageholder.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the protective frame has apredetermined elasticity to provide a buffering ability for reducing therequirement for the flatness of the camera module and reducing theassembly requirements of the various units of the camera module.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the protective frame is molded tooverlappedly arrange on the photosensitive element to improve themanufacturing efficiency of the camera module.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the surface of the upper mold of themolding-die is provided with a covering film which can provideadditional protection to the photosensitive element when the molds ofthe molding-die is applying pressure thereto, wherein the covering filmalso facilitates mold unloading and increases sealing ability whileavoiding burr formation.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein a portion of the molding-die,corresponding to the position of the photosensitive area of thephotosensitive element, can be made and designed in a concave manner toensure a safe distance defined between the photosensitive area of thephotosensitive element and the molding-die, adapted for further reducingadverse influence on the photosensitive element.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the protective frame is covered with aprotective film to facilitate the setting of the protective frame to thephotosensitive element. In addition, the protective film may alsoisolate the photosensitive area of the photosensitive element to theexternal environment.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the camera module comprises at leastone insulating member provided at a periphery around at least aphotosensitive area of the photosensitive element and an integralencapsulating support structure formed to enclose, case and/or wrap up anon-photosensitive area of the photosensitive element, the circuit boardand the bonding wires therebetween, wherein the insulating member isprovided to prevent the molding material of the integral encapsulatingsupport structure, before it is solidified, from flowing to thephotosensitive area of the photosensitive element during the formationprocess of the integral encapsulating support structure.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the insulating member is protruded onthe photosensitive element to enable a bottom surface of an upper moldof the molding-die to contact with the insulating member. In otherwords, the insulating member can provide a cushioning effect and avoidthe bottom surface of the upper mold of the molding-die from directlycontacting with the photosensitive element, so as to protect thephotosensitive area of the photosensitive element from being damaged bythe applied pressure of the upper mold of the molding-die.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the insulating member can prevent themolding material of the integral encapsulating support structure, beforeit is solidified, from flowing from the non-photosensitive area to thephotosensitive area of the photosensitive element. In addition, when theintegral encapsulating support structure is formed and solidified, theinsulating member is able to prevent any burr from forming at the side,toward the photosensitive element, of the integral encapsulating supportstructure, so as to increase the product yield rate of the cameramodule.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the insulating member may haveelasticity and flexibility that allows the insulating member to deformaccording to the gap formed between the upper mold of the molding-dieand the photosensitive element. Therefore, the photosensitive area ofthe photosensitive element is insulated from external environment by theinsulating member, so that the molding material of the integralencapsulating support structure is prevented from entering thephotosensitive area of the photosensitive element through the gap formedbetween the upper mold of the molding-die and the photosensitiveelement, so as to ensure the reliability of the camera module during themanufacturing process of the camera module.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the insulating member is provided tohave a stickiness for sticking pollutant such as dusts, so as to enhancethe imaging quality of the camera module by reducing the dirty spot ofthe photosensitive area of the photosensitive element.

Another advantage of the invention is to provide a camera module, amolded photosensitive assembly thereof, a manufacturing method thereof,and an electronic device, wherein the camera module comprises at leastone filter member which can be provided on the filter member, whereinthe integral encapsulating support structure which encloses, casesand/or wraps up the circuit board and an outer area of the filter memberafter it is formed and solidified, so that the integral encapsulatingsupport structure, the filter member, the photosensitive element, andthe circuit board are connected with each other to form an integralbody. In addition, the insulating member substantially prevents themolding material from entering the inner effective function area of thefilter member and prevents the filter member from being damaged duringthe mold pressing process.

According to the present invention, the foregoing and other objects andadvantages are attained by a molded photosensitive assembly of a cameramodule, which comprises:

-   -   at least one supporting member formed of a first substance;    -   at least one photosensitive element;    -   at least one circuit board;    -   at least one set of wires, wherein two ends of each of the at        least one set of wires are respectively connected to a chip        connector of each of the photosensitive element and a circuit        connector of each of the circuit board; and    -   at least one molded base formed of a second substance, wherein        each of the at least one molded base respectively comprises a        molded body and has at least one light window, wherein during        the molded body is molding by a molding-die in molding process,        the photosensitive element and the wires are protected by said        supporting member, wherein the photosensitive area of the        photosensitive element is correspondingly disposed at said light        window.

According to an embodiment of the present invention, each of the atleast one supporting members comprises a frame-shaped supporting bodyand has at least one through hole, the supporting body is covered with apart of the non-photosensitive area of the photosensitive element,wherein the photosensitive area of the photosensitive element isdisposed corresponding to the through hole, wherein the supporting bodyhas a top surface, an inner surface and an outer surface, wherein thetop surface of the supporting body is extended inwardly and outwardlyconnecting the inner surface and the outer surface, wherein the throughhole is formed by the inner surface, wherein the pressing surface of themolding-die and the top surface of the supporting body are in contactduring the molding process.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned on an inside and anoutside of the chip-connecting portion, wherein at least part of thechip-inner portion is covered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned on an inside and anoutside of the chip-connecting portion, wherein at least part of thechip-inner portion and at least part of the chip-connecting portion arecovered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned on an inside and anoutside of the chip-connecting portion, wherein at least part of thechip-inner portion, at least part of the chip-connecting portion and atleast part of the chip-outer portion are covered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned on an inside and anoutside of the chip-connecting portion, wherein at least part of thechip-outer portion and at least part of the chip-connecting portion arecovered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned on an inside and anoutside of the chip-connecting portion, wherein at least part of thechip-outer portion is covered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned on an inside and anoutside of the chip-connecting portion, wherein at least part of thechip-connecting portion is covered by the supporting body.

According to an embodiment of the present invention, each of thesupporting member comprises a frame-shaped supporting body and having athrough hole, wherein at least a part of a periphery area of the circuitboard is covered by the supporting body, wherein the photosensitive areaof the photosensitive element is correspondingly disposed at the throughhole, wherein the supporting body has a top surface, an inner surfaceand an outer surface, wherein the top surface of the supporting body isextended inwardly and outwardly to connect with the inner surface andthe outer surface respectively, wherein the through hole is formed inthe inner surface, wherein the pressing surface of the molding-die is incontact with the top surface of the supporting body during the moldingprocess.

According to an embodiment of the present invention, at least a part ofthe photosensitive element is covered by the supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the non-photosensitive area of the photosensitiveelement comprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein the chip connector of the photosensitiveelement is disposed on the chip-connecting portion, wherein thechip-inner portion and the chip-outer portion are respectivelypositioned on an inside and an outside of the chip-connecting portion,wherein at least part of the circuit-inner portion and at least part ofthe chip-outer portion are covered by the supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the non-photosensitive area of the photosensitiveelement comprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein the chip connector of the photosensitiveelement is disposed on the chip-connecting portion, wherein thechip-inner portion and the chip-outer portion are respectivelypositioned on an inside and an outside of the chip-connecting portion,wherein at least part of the circuit-inner portion, the chip-outerportion and at least part of the chip-connecting portion are covered bythe supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the non-photosensitive area of the photosensitiveelement comprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein the chip connector of the photosensitiveelement is disposed on the chip-connecting portion, wherein thechip-inner portion and the chip-outer portion are respectivelypositioned on an inside and an outside of the chip-connecting portion,wherein at least part of the circuit-inner portion, the chip-outerportion, the chip-connecting portion and at least part of the chip-innerportion are covered by the supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the non-photosensitive area of the photosensitiveelement comprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein the chip connector of the photosensitiveelement is disposed on the chip-connecting portion, wherein thechip-inner portion and the chip-outer portion are respectivelypositioned on an inside and an outside of the chip-connecting portion,wherein at least part of the chip-connecting portion, the circuit-innerportion and at least part of the chip-outer portion are covered by thesupporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the non-photosensitive area of the photosensitiveelement comprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein the chip connector of the photosensitiveelement is disposed on the chip-connecting portion, wherein thechip-inner portion and the chip-outer portion are respectivelypositioned on an inside and an outside of the chip-connecting portion,wherein at least part of the chip-outer portion, the circuit-connectingportion, the chip-inner portion and at least part of the chip-outerportion are covered by the supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the non-photosensitive area of the photosensitiveelement comprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein the chip connector of the photosensitiveelement is disposed on the chip-connecting portion, wherein thechip-inner portion and the chip-outer portion are respectivelypositioned on an inside and an outside of the chip-connecting portion,wherein at least part of the circuit-connecting portion, thecircuit-inner portion, the chip-outer portion and at least part of thechip-connecting portion are covered by the supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the non-photosensitive area of the photosensitiveelement comprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein the chip connector of the photosensitiveelement is disposed on the chip-connecting portion, wherein thechip-inner portion and the chip-outer portion are respectivelypositioned on an inside and an outside of the chip-connecting portion,wherein at least part of the circuit-connecting portion, thecircuit-inner portion, the chip-outer portion, the chip-connectingportion and at least part of the chip-inner portion are covered by thesupporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the non-photosensitive area of the photosensitiveelement comprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein the chip connector of the photosensitiveelement is disposed on the chip-connecting portion, wherein thechip-inner portion and the chip-outer portion are respectivelypositioned on an inside and an outside of the chip-connecting portion,wherein at least part of the circuit-outer portion, thecircuit-connecting portion, the circuit-inner portion, the chip-outerportion and at least part of the chip-connecting portion are covered bythe supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the non-photosensitive area of the photosensitiveelement comprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein the chip connector of the photosensitiveelement is disposed on the chip-connecting portion, wherein thechip-inner portion and the chip-outer portion are respectivelypositioned on an inside and an outside of the chip-connecting portion,wherein at least part of the circuit-outer portion, thecircuit-connecting portion, the circuit-inner portion, the chip-outerportion, the chip-connecting portion and at least part of the chip-innerportion are covered by the supporting body.

According to an embodiment of the present invention, the outer surfaceof the supporting body is covered by the molded body.

According to an embodiment of the present invention, at least a part ofthe top surface of the supporting body is covered by the molded body.

According to an embodiment of the present invention, the height of thesupporting member is higher than or equal to the height at which thewires protrudes upwardly.

According to an embodiment of the present invention, the height of thesupporting member is lower than the height at which the wires protrudesupwardly.

According to an embodiment of the present invention, the supportingmember has a predetermined elasticity.

According to an embodiment of the present invention, the supportingmember has an adhesive ability.

According to an embodiment of the present invention, the Shore hardnessrange of the supporting member is A50-A80, wherein the elastic modulusrange of the supporting member is 0.1 Gpa-1 Gpa.

According to the present invention, the foregoing and other objects andadvantages are also attained by a molded photosensitive module of acamera module, comprising:

-   -   at least one photosensitive element;    -   at least one circuit board;    -   at least one set of wires, wherein two ends of each of the at        least one set of wires are respectively connected to a chip        connector of each of the at least one photosensitive element and        a circuit connector of each of the at least one circuit board;    -   at least one supporting member, wherein each of the at least one        supporting member is configured to cover at least a part of each        of the at least one set of wires; and    -   at least one molded base, wherein each of at least one molded        base comprises a molded body and has at least one light window,        wherein the periphery area of the circuit board and at least a        part of the supporting member is covered by the molded body        after molded, wherein, the photosensitive area of each of the at        least one photosensitive element respectively is correspondingly        disposed to the light window of each of the at least one molded        base.

According to an embodiment of the present invention, the supportingmember comprises a supporting body and a through hole, wherein thesupporting body has a top surface, an inner surface and an outersurface, wherein the top surface of the supporting body is extendedinwardly and outwardly to connect to the inner surface and the outersurface, wherein the through hole is formed by the inner surface,wherein the supporting body is disposed to cover at least a part of thewires, wherein the photosensitive element is correspondingly disposed atthe through hole, and the outer surface of the supporting body iscovered by the molded body.

According to an embodiment of the present invention, the molded basefurther comprises at least a part of the top surface of the supportingbody.

According to the present invention, the foregoing and other objects andadvantages are further attained by a camera module with a moldedphotosensitive assembly, comprising:

at least one optical lens; and

at least one molded photosensitive assembly, wherein each of the atleast one molded photosensitive assembly further comprises:

a supporting member formed by the first substance;

a photosensitive element;

a circuit board;

a set of wires, wherein the two ends of each of the set of wires arerespectively connected to a chip connector of the photosensitive elementand a circuit connector of the circuit board; and

a molded base formed of a second substance, wherein the molded basecomprises a molded body and has a light window, wherein during themolding process by a molding-die to mold the molded body, the supportingmember is configured to prevent a pressing surface of the molding-diefrom being pressed against the wires, wherein a photosensitive area ofthe photosensitive element is correspondingly disposed at the lightwindow, wherein each of the at least two optical lenses is respectivelydisposed at each of the photosensitive path of the photosensitiveelement of the molded photosensitive assembly.

According to an embodiment of the present invention, the camera modulefurther comprises at least one driver, wherein each of the at least twooptical lenses is respectively mounted on each of the at least onedriver, wherein each of the at least one driver is mounted to the topsurface of the molded body of the photosensitive element.

According to an embodiment of the present invention, the camera modulefurther comprises at least one filter member, wherein each of the atleast one filter member is disposed between each of the optical lensesand each of the photosensitive elements of the molded photosensitiveassembly.

According to an embodiment of the present invention, each of the filtermembers is respectively mounted on a top surface of the molded body ofeach of the molded photosensitive assembly.

According to an embodiment of the present invention, the top surface ofthe molded body has an inner surface and an outer surface and the innersurface is positioned at a lower plane than the outer surface, wherein arecess is formed on the molded body, wherein the filter member ismounted on the inner surface of the molded body and is positioned in therecess, wherein the driver is mounted on the outside surface of themolded body.

According to an embodiment of the present invention, the camera modulefurther comprises at least one supporting member, wherein each of thefilter member is mounted on each of the at least one supporting member,wherein each of the at least one supporting member is mounted on the topsurface of the molded body, wherein the filter members are respectivelydisposed between the at least two optical lenses and the photosensitiveelements of the molded photosensitive assembly.

According to the present invention, the foregoing and other objects andadvantages are attained by a camera module with a molded photosensitiveassembly, which comprises:

at least one optical lens; and

at least one molded photosensitive assembly, wherein each of the atleast one molded photosensitive assembly further comprises:

a photosensitive element;

a circuit board;

a set of wires, wherein the two ends of each of the set of wires arerespectively connected to a chip connector of the photosensitive elementand a circuit connector of the circuit board;

a supporting member, wherein the supporting member is disposed to coverat least a part of each of the set of wires; and

a molded base, wherein the molded base comprises a molded body and has alight window, wherein an periphery area of the circuit board and atleast a part of the supporting member is covered by the molded bodyafter molded, wherein the photosensitive area of each of thephotosensitive elements is corresponding to the light window of themolded base, wherein each of the at least two optical lenses is disposedon the respective photosensitive path of the photosensitive element ofthe at least one molded photosensitive assembly.

According to an embodiment of the present invention, the camera moduleis a fixed focus camera module or a zoom camera module.

According to the present invention, the foregoing and other objects andadvantages are attained by an electronic device, which comprises:

an electronic device body; and

at least one camera module, wherein each of the at least one cameramodule is disposed on the electronic device body for acquiring images,wherein each of the at least one camera module comprises at least oneoptical lens and at least one molded photosensitive assembly, whereinthe at least one molded photosensitive assembly comprises:

a supporting member, a photosensitive element, a circuit board, a set ofwires, a supporting member and a molded base, wherein the two ends ofeach of the a set of wires are respectively connected to a chipconnector of the photosensitive element and a circuit connector of thecircuit board, wherein the supporting member is arranged to cover atleast a part of each of the set of wires wherein the molded basecomprises a molded body and has a light window, wherein a periphery areaof the circuit board and at least a part of the supporting member arecovered by the molded body after molded, wherein the photosensitive areaof each of the photosensitive elements is positioned corresponding tothe light window of the molded base, wherein each of the at least twooptical lenses is disposed on the respective photosensitive path of thephotosensitive element of the at least one molded photosensitiveassembly.

According to the present invention, the foregoing and other objects andadvantages are attained by a manufacturing method of a moldedphotosensitive assembly, comprising the following steps:

(a) electrically connecting a photosensitive element and a circuit boardthrough a set of wires;

(b) placing the photosensitive element and the circuit board on an uppermold or a lower mold of a molding-die;

(c) when the upper mold and the lower mold are closed, supporting theupper mold upwardly by a supporting member to prevent a pressing surfaceof the upper mold from being pressed against each of the set of thewires; and

(d) adding a molten molding material to a molding cavity formed betweenthe upper mold and the lower mold to form a molded base after themolding material is solidified and cured, wherein the molded basecomprises a molded body and has at least one light window, wherein atleast a part of a periphery area of the circuit board and at least apart of the supporting member are covered by the molded body.

According to an embodiment of the present invention, in the step (c),when the pressing surface of the upper mold is pressed against the topsurface of the supporting body, the top surface of the supporting bodyis deformed to closely press on the pressing surface of the uppersurface, so that the photosensitive area of the photosensitive elementis in a sealed environment, wherein in the step (d), the supporting bodyprevents the molding material from entering the sealing environment, sothat the outer surface of the supporting body is covered by the moldingmaterial formed the molded body after curing, and the light window isformed on an inner surface of the supporting body.

According to the present invention, the foregoing and other objects andadvantages are attained by a method of manufacturing a moldedphotosensitive assembly, comprising the steps of:

(A) connecting a photosensitive element and a circuit board through aset of wires;

(B) covering at least a part of the set of wires by a supporting memberto form a molded photosensitive assembly semi-finished product;

(C) placing the molded photosensitive assembly semi-finished product onan upper mold or a lower mold of a molding-die, wherein the upper moldis supported by the supporting member when the upper mold and the lowermold are closed to prevent a pressing surface of the upper mold frombeing pressed against the set of wires; and

(D) adding a fluid-state molding material to a molding cavity formedbetween the upper mold and the lower mold to form a molded base afterthe molding material is solidified and cured, wherein at least a part ofa periphery area of the circuit board and at least a part of thesupporting member are covered by the molded body, wherein thephotosensitive area of the photosensitive element is positionedcorresponding to the light window.

According to the present invention, the foregoing and other objects andadvantages are attained by a method of manufacturing a moldedphotosensitive assembly, comprising the steps of:

(i) mounting a photosensitive element on a circuit board, and conductingthe photosensitive element and the circuit board through at least oneset of wires;

(ii) pre-fixing the photosensitive element and the circuit board by asupporting member to obtain a molded photosensitive assemblysemi-finished product, whereby the supporting member prevents a gap frombeing formed between the photosensitive element and the circuit board;

(iii) placing the molded photosensitive assembly semi-finished producton an upper mold or a lower mold of a molding-die to form an annularmolding cavity between the upper mold and the lower mold when the uppermold and the lower mold are closed by clamping; and

(iv) adding a fluid state molding material to the annular molding cavityto form the molded base after the molding material is cured, wherein themolded base comprises a molded body and has a light window, wherein atleast a part of a periphery area of the circuit board and at least apart of the supporting member are covered by the molded body, whereinthe photosensitive area of the photosensitive element is positionedcorresponding to the light window.

According to the present invention, the foregoing and other objects andadvantages are attained by a method of manufacturing a moldedphotosensitive assembly, comprising the steps of:

(a) connecting a chip connector of a photosensitive element and acircuit connector of a circuit board through a set of wires;

(b) placing the photosensitive element and the circuit board on an uppermold or a lower mold of a molding-die to form an annular molding cavitybetween the lower mold and the upper mold when the upper mold and thelower mold are clamped and closed;

(c) when a fluid state molding material is added to the annular moldingcavity, reducing an impact force generated by the molding material witha supporting member positioned in the annular molding cavity by blockingthe molding material; and

(d) forming a molded base after the molding material is solidified andcured, wherein the molded base comprises a molded body and has a lightwindow, wherein a periphery area of the circuit board, the supportingmember, the supporting member and at least a part of thenon-photosensitive area of the photosensitive element are covered by themolded body.

According to the present invention, the foregoing and other objects andadvantages are attained by a molded photosensitive assembly, comprising:

at least one supporting member formed by a first substance;

at least one circuit board, wherein each of the at least one circuitboard has at least one chip mounting area;

at least two photosensitive elements, wherein the at least twophotosensitive elements are respectively mounted on the at least onechip mounting area of the at least one circuit board;

at least two sets of wires, wherein two ends of each of the at least twosets of wires are respectively connected to a chip connector of each ofthe at least two photosensitive elements and a circuit connector of theat least one circuit board; and

a molded base formed by a second substance, wherein the molded basecomprises a molded body and has at least two light windows, wherein thewires, the circuit board and the at least two photosensitive elementsare protected by the supporting member when and after the molded body ismolded, wherein the molded body is integrally coupled to at least a partof each of the circuit boards, and the photosensitive areas of thephotosensitive elements are respectively positioned correspond to thelight windows of the molded base.

According to an embodiment of the present invention, the mold assemblycomprises two supporting members, one circuit board, two photosensitiveelements, and the two sets of the wires, wherein the circuit board hastwo chip mounting areas.

According to an embodiment of the present invention, the mold assemblycomprises two supporting members, one circuit board, two photosensitiveelements, and two sets of the wires, wherein each of the circuit boardshas one chip mounting area.

According to an embodiment of the present invention, the moldedphotosensitive assembly further comprises at least one electroniccomponent, wherein the circuit board has a periphery area, wherein theperiphery area and the chip mounting area are integrally molded, whereineach of the at least one electronic component is mounted on theperiphery area, wherein the supporting member is positioned between theat least one electrical component and the photosensitive area of thephotosensitive element.

According to an embodiment of the present invention, the supportingmember comprises a frame-shaped supporting body and has a through hole,wherein the supporting body is provided outside of the photosensitivearea of the photosensitive element, wherein the photosensitive area ofthe photosensitive element is correspondingly disposed at the throughhole, wherein at least a part of the supporting body is covered by themolded body.

According to an embodiment of the present invention, the supporting bodyhas a top surface, an inner surface and an outer surface, wherein thetop surface is extended inwardly and outwardly to the inner surface andthe outer surface respectively, wherein the through hole is formed bythe inner surface, wherein at least the outer surface of the supportingbody is covered by the molded body.

According to an embodiment of the present invention, the supporting bodyhas a top surface, an inner surface and an outer surface, wherein thetop surface is extended respectively inwardly and outwardly to the innersurface and the outer surface, wherein the through hole is formed by theinner surface, wherein the outer surface of the supporting body and atleast a part of the top surface are covered by the molded body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned an inside and an outsideof the chip-connecting portion, wherein at least part of the chip-innerportion of the photosensitive element is covered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned an inside and an outsideof the chip-connecting portion, wherein at least part of thechip-connecting portion of the photosensitive element is covered by thesupporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned an inside and an outsideof the chip-connecting portion, wherein at least part of the chip-outerportion of the photosensitive element is covered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned an inside and an outsideof the chip-connecting portion, wherein at least part of the chip-innerportion and at least part of the chip-connecting portion of thephotosensitive element are covered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned an inside and an outsideof the chip-connecting portion, wherein at least part of the chip-outerportion and at least part of the chip-connecting portion of thephotosensitive element are covered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned an inside and an outsideof the chip-connecting portion, wherein at least part of the chip-innerportion, the chip-connecting portion and at least part of the chip-outerportion of the photosensitive element are covered by the supportingbody.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein at least part of the circuit-inner portion is coveredby the supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein at least part of the circuit-connecting portion iscovered by the supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein at least part of the circuit-outer portion is coveredby the supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein at least part of the circuit-inner portion and at leastpart of the circuit-connecting portion are covered by the supportingbody.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein the circuit-outer portion and at least part of thecircuit-connecting portion are covered by the supporting body.

According to an embodiment of the present invention, the periphery areaof the circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein at least part of the circuit-inner portion, thecircuit-connecting portion and at least part of the circuit-outerportion are covered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned on an inside and anoutside of the chip-connecting portion, wherein the periphery area ofthe circuit board comprises a circuit-inner portion, acircuit-connecting portion, and a circuit-outer portion, wherein thecircuit connector is disposed on the circuit-connecting portion, whereinthe circuit-inner portion and the circuit-outer portion are respectivelypositioned at an inner side and an outer side of the circuit-connectingportion, wherein at least part of the circuit-inner portion and at leastpart of the chip-outer portion are covered by the supporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned an inside and an outsideof the chip-connecting portion, wherein the periphery area of thecircuit board comprises a circuit-inner portion, a circuit-connectingportion, and a circuit-outer portion, wherein the circuit connector isdisposed on the circuit-connecting portion, wherein the circuit-innerportion and the circuit-outer portion are respectively positioned at aninner side and an outer side of the circuit-connecting portion, whereinthe circuit-inner portion, at least part of the circuit-connectingportion and at least part of the chip-outer portion are covered by thesupporting body.

According to an embodiment of the present invention, thenon-photosensitive area of the photosensitive element comprises achip-inner portion, a chip-connecting portion and a chip-outer portion,wherein the chip connector of the photosensitive element is disposed onthe chip-connecting portion, wherein the chip-inner portion and thechip-outer portion are respectively positioned an inside and an outsideof the chip-connecting portion, wherein the periphery area of thecircuit board comprises a circuit-inner portion, a circuit-connectingportion, and a circuit-outer portion, wherein the circuit connector isdisposed on the circuit-connecting portion, wherein the circuit-innerportion and the circuit-outer portion are respectively positioned at aninner side and an outer side of the circuit-connecting portion, whereinthe circuit-inner portion, the circuit-connecting portion, at least partof the circuit-outer portion and at least part of the chip-outer portionare covered by the supporting body.

According to an embodiment of the present invention, at least a part ofthe chip-connecting portion of the photosensitive element is covered bythe supporting body.

According to an embodiment of the present invention, at least a part ofthe chip-connecting portion of the photosensitive element is covered bythe supporting body.

According to an embodiment of the present invention, at least a part ofthe chip-connecting portion of the photosensitive element is covered bythe supporting body.

According to an embodiment of the present invention, at least a part ofthe chip-inner portion of the photosensitive element is covered by thesupporting body.

According to an embodiment of the present invention, at least a part ofthe chip-inner portion of the photosensitive element is covered by thesupporting body.

According to an embodiment of the present invention, at least a part ofthe chip-inner portion of the photosensitive element is covered by thesupporting body.

According to the present invention, the foregoing and other objects andadvantages are attained by an array camera module, comprising:

at least two optical lenses; and

a molded photosensitive assembly, which comprises:

at least one supporting member formed by a first substance;

at least one circuit board, wherein each of the at least one circuitboard has at least one chip mounting area;

at least two photosensitive elements, wherein each of the at least twophotosensitive elements is mounted on the at least one chip mountingarea of the at least one circuit board;

at least two sets of wires, wherein two ends of each of the at least twosets of wires are respectively connected to a chip connector of each ofthe at least two photosensitive elements and a circuit connector of theat least one circuit board; and

a molded base formed by a second substance, wherein the module basecomprises a molded body and has at least two light windows, wherein thewires, the circuit board and the at least two photosensitive elementsare protected by the supporting member when and after the molded body ismolded, wherein the molded body is integrally coupled to at least a partof each of the circuit boards, and the photosensitive areas of the atleast two photosensitive elements are respectively positionedcorresponding to the at least two light windows of the molded base,wherein the at least two optical lenses are disposed on twophotosensitive paths of the at least two photosensitive elementsrespectively, wherein a light path is provided by each of the opticalwindows for the respective optical lens and the photosensitive element.

According to an embodiment of the present invention, the array cameramodule further comprises at least two drivers, wherein the at least twooptical lenses are mounted on the at least two drivers respectively,which each of the at least two drivers is mounted on the top surface ofthe molded body.

According to an embodiment of the present invention, the array cameramodule further comprises at least one driver and at least onelens-barrel, wherein at least one of the at least two optical lenses ismounted on the at least one driver and the at least one lens-barrel,wherein the at least one driver and the at least one lens-barrel arerespectively positioned at different positions on the top surface of themolded body.

According to an embodiment of the present invention, the array cameramodule further comprises at least two lens-barrels, wherein each of theat least two lens-barrels is integrally formed on the top surface of themolded body, wherein the at least two optical lenses are respectivelymounted into the at least two lens-barrels. Or, the array camera modulefurther comprises at least two lens-barrels, wherein at least one of theat least two lens-barrels is integrally formed on a top surface of themolded body, and the other of the at least two lens-barrels is mountedon the top surface of the molded body, wherein the at least two opticallenses are mounted on the at least two lens-barrels respectively. Or,the array camera module comprises two lens-barrels mounted on the topsurface of the molded body, wherein the at least two optical lenses arerespectively mounted on the two lens-barrels.

According to an embodiment of the present invention, the array cameramodule further comprises at least one filter member, wherein the atleast one filter member is mounted on the top surface of the moldedbody, so that the at least one filter member is held between one of theat least two optical lenses and one of the at least two photosensitiveelements.

According to an embodiment of the present invention, the top surface ofthe molded body has at least two inner surfaces and an outer surface,wherein the at least one filter member is mounted on one of the at leasttwo inner surfaces, wherein the at least two drivers are mounted atdifferent positions on the outer surface of the molded body.

According to an embodiment of the present invention, the plane of theinner surface of the molded body is below the plane of the outer surfaceto form at least one recess on the molded body for the respective filtermember positioned therein.

According to an embodiment of the present invention, the supportingmember comprises a frame-shaped supporting body and has a through hole,wherein the supporting body is provided outside of the photosensitivearea of the photosensitive element, wherein the photosensitive area ofthe photosensitive element is correspondingly disposed in the throughhole, wherein a part of the supporting body is covered by the moldedbody.

According to an embodiment of the present invention, part of theperiphery area of the circuit board is covered by the supporting body.

According to an embodiment of the present invention, at least a part ofthe non-photosensitive area of the photosensitive element is covered bythe supporting body.

According to an embodiment of the present invention, a part of theperiphery area of the circuit board and at least a part of thenon-photosensitive area of the photosensitive element are covered by thesupporting body.

According to an embodiment of the present invention, the array cameramodule further comprises at least one supporting member and at least onefilter member, wherein the at least one filter member is mounted on theat least one supporting member, wherein the at least one supportingmember is mounted on the top surface of the molded body such that the atleast one filter member is held between the respective optical lens andthe respective photosensitive element.

According to the present invention, the foregoing and other objects andadvantages are attained by an electronic device, comprising:

an electronic device body; and

the array camera module, wherein the array camera module is disposed onthe electronic device body for acquiring an image.

According to the present invention, the foregoing and other objects andadvantages are attained by a camera module, which comprises:

at least one circuit board;

at least one optical lens;

at least one protective frame;

at least one photosensitive chip, wherein the protective frame isconvexly disposed on an outer peripheral of the photosensitive area ofthe photosensitive chip; and

at least one integrated package holder, wherein the integrated packageholder is arranged to wrap the circuit board and the non-photosensitivearea of the photosensitive chip so as to integrate the integratedpackage holder, the circuit board and the photosensitive chip, whereinthe optical lens is disposed in a photosensitive path of thephotosensitive chip while the photosensitive chip is electricallyconnected to the circuit board.

According to an embodiment of the present invention, a size of an innerside of the protective frame is larger than or equal to a size of thephotosensitive area of the photosensitive chip.

According to an embodiment of the present invention, a size of an outerside of the protective frame is less than or equal to a size of thephotosensitive chip.

According to an embodiment of the present invention, the protectiveframe has a predetermined elasticity.

According to an embodiment of the present invention, the camera modulefurther comprises a cementing layer, wherein the cementing layer isdisposed between the protective frame and an outer peripheral of thephotosensitive area of the photosensitive chip to connect the protectiveframe and the outer peripheral of the photosensitive area of thephotosensitive chip.

According to an embodiment of the present invention, the integratedpackage holder is further configured to wrap an outer side of theprotective frame.

According to an embodiment of the present invention, the camera modulefurther comprises a lens holding member, wherein the lens holding memberis provided on the integrated package holder, wherein the optical lensis disposed on the lens holding member.

According to an embodiment of the present invention, the lens holdingmember is integrally formed with the integrated package holder.

According to an embodiment of the present invention, the lens holdingmember is a motor which is electrically connected to the circuit board.

According to an embodiment of the present invention, the camera modulefurther comprises a filter member, wherein the filter member is disposedon top of the integrated package holder such that the filter member ispositioned between the photosensitive chip and the optical lens.

According to the present invention, the foregoing and other objects andadvantages are attained by a camera module, which comprises:

at least one circuit board;

at least one optical lens;

at least one protective frame;

at least one photosensitive chip;

at least one filter member, wherein the filter member is disposed on thephotosensitive chip in an overlapping manner, wherein the protectiveframe is disposed on an outer peripheral of the filter member; and

at least one integrated package holder, wherein the integrated packageholder is arranged to cover an outer peripheral of the filter member andthe circuit board, such that the integrated package holder, the filtermember, the photosensitive chip, and the circuit board are integrallyformed, wherein the optical lens is disposed in a photosensitive path ofthe photosensitive chip, wherein the photosensitive chip is electricallyconnected to the circuit board.

According to an embodiment of the present invention, a size of an innerside of the protective frame is greater than or equal to a size of thephotosensitive area of the photosensitive chip, so that the protectiveframe is disposed away from the photosensitive area of thephotosensitive chip.

According to an embodiment of the present invention, the protectiveframe has a predetermined elasticity.

According to an embodiment of the present invention, the camera modulefurther comprises a cementing layer, wherein the cementing layer isdisposed between the protective frame and the filter member to connectthe protective frame and the outer peripheral of the filter member.

According to an embodiment of the present invention, the integratedpackage holder is further arranged to wrap an outer side of theprotective frame.

According to an embodiment of the present invention, the camera modulefurther comprises a lens holding member, wherein the lens holding memberis provided on the integrated package holder and the optical lens isdisposed on the lens holding member.

According to an embodiment of the present invention, the lens holdingmember is integrally formed with the integrated package holder.

According to the present invention, the foregoing and other objects andadvantages are attained by a method of manufacturing a camera module,comprising the following steps:

(a) connecting at least one photosensitive chip with at least onecircuit board in an electrically conductive manner;

(b) providing at least one protective frame which is disposed on anouter peripheral of the photosensitive area of the photosensitive chip;

(c) pressing a protective surface of an upper mold of a molding-die tothe protective frame to isolate the photosensitive area with thenon-photosensitive area of the photosensitive chip;

(d) wrapping the circuit board and the non-photosensitive area of thephotosensitive chip by a molding material filled in the molding-die toform an integrated package holder integrating with the photosensitivechip and the circuit board after the molding material is solidified andcured; and

(e) providing at least one optical lens which is disposed in aphotosensitive path of the photosensitive chip to form the cameramodule.

According to an embodiment of the present invention, in the step (b), aprotective film is provided on an upper portion of the protective framesuch that the protective film is correspondingly disposed to thephotosensitive area of the photosensitive chip, wherein after the step(d), the protective film is removed from the protective frame.

According to an embodiment of the present invention, a recess is formedin a part of the upper mold of the molding-die corresponding to thephotosensitive area, wherein in the step (c), the pressing surface ofthe upper mold is kept with a safe distance from the photosensitive areaof the photosensitive chip.

According to an embodiment of the present invention, a covering film isprovided on the pressing surface of the upper mold of the molding-die.

According to an embodiment of the present invention, in the step (d), anouter surface of the protective frame is covered by the molding materialto integrally form the integrated package holder with the photosensitivechip, the circuit board, and the protective frame.

According to an embodiment of the present invention, before the step(e), the method further comprises a step of:

attaching at least one filter member to the top of the integratedpackage holder, wherein the filter member is held between thephotosensitive chip and the optical lens.

According to an embodiment of the present invention, in the step (b), acementing layer is formed between the outer peripheral of the protectiveframe and the photosensitive area of the photosensitive chip, whereinthe cementing layer is connected with the protective frame and the outerperipheral of the photosensitive chip.

According to an embodiment of the present invention, the protectiveframe and/or the outer peripheral of the photosensitive chip is coveredwith a glue to form the cementing layer after the glue curing.

According to an embodiment of the present invention, the glue is curedby heat or UV light.

According to the present invention, the foregoing and other objects andadvantages are attained by a method of manufacturing a camera module,which comprises the following steps:

(A) connecting at least one photosensitive chip and at least one circuitboard in an electrically conductive manner;

(B) overlapping a filter member on the photosensitive chip;

(C) providing at least one protective frame, wherein the protectiveframe is disposed on an outer peripheral of the filter member;

(D) pressing the protective frame through the pressing surface of anupper mold of a molding-die to isolate the inner region and the outerperipheral of the filter member;

(E) wrapping the circuit board and the outer peripheral of the filtermember by a molding material filled in the molding-die to form anintegrated package holder combined with a filter member, thephotosensitive chip and the circuit board after the molding material issolidified and cured; and

(F) providing at least one optical lens, wherein the optical lens isdisposed in the photosensitive path of the photosensitive chip to formthe camera module.

According to an embodiment of the present invention, in the step (E),the molding material further comprises an outer surface of theprotective frame to form an integrated package holder combined with thefilter member, the photosensitive chip and the circuit board after themolding material is solidified and cured.

According to an embodiment of the present invention, in order to achievethe above objectives and advantages and other advantages, a cameramodule is provided, which comprises:

at least a circuit board;

at least one optical lens;

at least one insulating member;

at least one photosensitive element having a photosensitive area and anon-photosensitive area provided thereon;

at least one insulating member provided around the periphery of at leastthe photosensitive area of the photosensitive element for insulating thephotosensitive area from the non-photosensitive area; and

at least one integral encapsulating support structure integrallyenclosing, casing and/or covering the circuit board and at least a partof the non-photosensitive area of the photosensitive element, whereinthe integral encapsulating support structure, the photosensitive elementand the circuit board are combined to form an integral structure,wherein the optical lens is installed along a photosensitive path of thephotosensitive element and the photosensitive element is electricallyconnected with the circuit board.

According to an embodiment of the present invention, the camera modulefurther comprises a camera lens holding member, wherein the camera lensholding member is provided on the integral encapsulating supportstructure and the optical lens is supported on the camera lens holdingmember.

According to an embodiment of the present invention, the integralencapsulating support structure integrally is extended to form thecamera lens holding member.

According to an embodiment of the present invention, the camera modulefurther comprises at least a driver such as a motor, wherein the driveris installed on the integral encapsulating support structure and iselectrically connected with the circuit board, wherein the optical lensis installed on the driver.

According to an embodiment of the present invention, the camera modulefurther comprises at least one filter member, wherein the filter memberis disposed on top of the integral encapsulating support structure.

According to an embodiment of the present invention, the camera modulefurther comprises a set of electrical components such asresistance-capacitance components, wherein the resistance-capacitancecomponents are attached on the circuit board, wherein the integralencapsulating support structure encloses, cases, and/or wraps up theresistance-capacitance components and the bonding wires therein.

According to an embodiment of the present invention, the insulatingmember is formed by solidified elastic material such as solidifiedadhesive, rubber, silicon, and polyester material.

According to an embodiment of the present invention, the material thatformed the insulating member is preferably to further have a stickinessafter solidification, so as to stick dust within the camera module.Certainly, in other embodiments, the material may also have nostickiness after solidification. The present invention shall not belimited with this feature.

According to an embodiment of the present invention, the insulatingmember formed by solidified material has a predetermined elasticity.

According to an embodiment of the present invention, the integralencapsulating support structure is covered by the peripheral surface ofthe insulating member.

According to another aspect of the present invention, the presentinvention provides a camera module, which comprises:

at least one circuit board;

at least one optical lens;

at least one insulating member;

at least one photosensitive element and at least one filter member,wherein the filter member is provided above the photosensitive element,wherein the insulating member is disposed on the periphery of the filtermember; and

an integral encapsulating support structure, wherein the integralencapsulating support structure encloses, cases and/or wraps up thecircuit board and an outer area of the filter member, so that when theintegral encapsulating support structure is formed, the integralencapsulating support structure, the filter member, the photosensitiveelement, and the circuit board integrally combine together to form anintegral structure, wherein the optical lens is supported along aphotosensitive path of the photosensitive element, wherein thephotosensitive element is electrically connected with the circuit board.

According to an embodiment of the present invention, the presentinvention also provides a manufacturing method of camera module, whereinthe manufacturing method comprises the following steps:

(a) electrically connecting at least one photosensitive element with atleast one circuit board;

(b) placing the circuit board and the photosensitive element in amolding-die;

(c) providing an insulating member between the photosensitive elementand a bottom surface of an upper mold of the molding-die, wherein theinsulating member is positioned around the periphery around at least thephotosensitive area of the photosensitive element;

(d) enclosing, casing and/or wrapping up the circuit board and anon-photosensitive area of the photosensitive element and the circuitboard by a molding material added in the molding-die, so as to form anintegral encapsulating support structure after the molding material issolidified that integrally combines the photosensitive element and thecircuit board to form an integral structure; and

(e) providing at least one optical lens, wherein the optical lens issupported along a photosensitive path of the photosensitive element,whereby the camera module is manufactured.

According to an embodiment of the present invention, an inner recess isformed in the upper mold of the molding-die at an area corresponding tothe photosensitive element. According to an embodiment of the presentinvention, a covering film is provided on a bottom surface of the uppermold of the molding-die.

According to an embodiment of the present invention, in the step (d),the molding material encloses, cases and is covered by the circuitboard.

According to an embodiment of the present invention, the integralencapsulating support structure is formed to enclose and cover thenon-photosensitive area of the photosensitive element positioned outsidethe insulating member and an outer peripheral surface of the insulatingmember.

According to an embodiment of the present invention, in the above steps,an insulating material is applied along the periphery of thephotosensitive element to form the insulating member on the periphery ofthe photosensitive element after the insulating member is solidified.

According to an embodiment of the present invention, glue or sprayadhesive is used as the insulating member in the above step (c).

According to an embodiment of the present invention, the integralencapsulating support structure is made by injection molding,compression molding or pressing mold technology.

According to an embodiment of the present invention, the adhesive to beused as the insulating member is solidified by damp, heat, UV(Ultraviolet) lighting, or other solidifying reaction.

According to an embodiment of the present invention, the camera modulecan be fixed focus camera module or zoom camera module.

According to another aspect of the present invention, the presentinvention also provides a manufacturing method of camera module, whereinthe manufacturing method comprises the following steps:

(A) electrically connecting at least one photosensitive element with atleast one circuit board;

(B) overlapping a filter member with the photosensitive element;

(C) placing the circuit board, the photosensitive element and the filtermember in a molding-die;

(D) providing an insulating member between the optical filter and abottom surface of an upper mold of the molding-die, wherein theinsulating member is positioned at an outer peripheral edge of theoptical filter;

(E) enclosing, casing and/or wrapping up the circuit board and theperipheral edge of the filter member by molding material filled in themolding-die to form an integral encapsulating support structure thatintegrally combines with the filter member, the photosensitive elementand the circuit board after the molding material is solidified; and

(F) providing at least one optical lens, wherein the optical lens issupported along a photosensitive path of the photosensitive element,whereby the camera module is manufactured.

Still further objects and advantages will become apparent from aconsideration of the ensuing description and drawings.

These and other objectives, features, and advantages of the presentinvention will become apparent from the following detailed description,the drawings, and the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of one of the manufacturing steps of a cameramodule according to a preferred embodiment of the present invention,illustrating that the photosensitive element of the camera module ismounted on the circuit board and the non-photosensitive area of thephotosensitive element is connected with the circuit board by a set ofwires.

FIGS. 2A and 2B are a schematic view of one of the manufacturing stepsof the camera module according to the above preferred embodiment of thepresent invention, illustrating that the supporting member of the cameramodule is disposed in the non-photosensitive area of the photosensitiveelement.

FIG. 3A is a schematic diagram of one of the manufacturing steps of thecamera module according to the above preferred embodiment of the presentinvention, illustrating that the circuit board, the photosensitiveelement and the supporting member are placed in the molding-die betweenthe upper mold and the lower mold, and the upper mold is pressed againstthe supporting member.

FIG. 3B is a schematic view of an alternative mode of one of themanufacturing steps of the camera module according to the abovepreferred embodiment of the present invention, illustrating that thecircuit board, the photosensitive element and the supporting member areplaced in a molding cavity between the upper mold and the lower mold ofthe molding-die, and a covering film is disposed between the pressingsurface of the upper mold and the supporting member.

FIG. 4 is a schematic view of one of the manufacturing steps of thecamera module according to the above preferred embodiment of the presentinvention, illustrating that a molding material for forming the moldedbase of the camera module is filled in the molding cavity formed betweenthe upper mold and the lower mold.

FIG. 5 is a perspective view of one of the manufacturing steps of thecamera module according to the above preferred embodiment of the presentinvention, illustrating that the molding material is solidified andcured to form the molded base.

FIG. 6 is a schematic view of one of the manufacturing steps of thecamera module according to the above preferred embodiment of the presentinvention, illustrating that a filter member of the camera module ismounted on the molded base.

FIG. 7 is a schematic view of one of the manufacturing steps of thecamera module according to the above preferred embodiment of the presentinvention, illustrating that an optical lens of the camera module ismounted on a driver, wherein the driver is mounted on the molded base tomanufacture the camera module.

FIG. 8 is a schematic view of an alternative mode of the camera moduleaccording to the above preferred embodiment of the present invention.

FIG. 9A is a schematic view of a first alternative mode of a moldedphotosensitive assembly of the camera module according to the abovepreferred embodiment of the present invention.

FIG. 9B is a schematic view of a second alternative mode of the moldedphotosensitive assembly of the camera module according to the abovepreferred embodiment of the present invention.

FIG. 9C is a schematic view of a third alternative mode of the moldedphotosensitive assembly of the camera module according to the abovepreferred embodiment of the present invention.

FIG. 10A is a schematic view of a fourth alternative mode of the moldedphotosensitive assembly of the camera module according to the abovepreferred embodiment of the present invention.

FIG. 10B is a schematic view of a fifth alternative mode of the moldedphotosensitive assembly of the camera module according to the abovepreferred embodiment of the present invention.

FIG. 11 is a schematic view of a sixth alternative mode of the moldedphotosensitive assembly of the camera module according to the abovepreferred embodiment of the present invention.

FIG. 12 is a schematic view of an alternative mode of the camera moduleaccording to the above preferred embodiment of the present invention.

FIG. 13 is a schematic view of an alternative mode of the camera moduleaccording to the above preferred embodiment of the present invention.

FIG. 14 is a block diagram of the camera module according to the abovepreferred embodiment of the present invention, illustrating anelectronic device.

FIG. 15 is a perspective sectional view of one of the manufacturingsteps of an array camera module according to a preferred embodiment ofthe present invention, illustrating that the photosensitive elements ofan array camera module is mounted on the chip mounting area of thecircuit board, and the chip connector of the photosensitive element andthe circuit connector of the circuit board are electrically connected bya set of wires, wherein the circuit board is an integrated circuitboard.

FIG. 16 is a perspective sectional view of one of the manufacturingsteps of the array camera module according to the above preferredembodiment of the present invention, illustrating that a supporting bodyof the array camera module is disposed to cover at least a part of thenon-photosensitive area of the photosensitive element to form a moldedphotosensitive assembly semi-finished product.

FIG. 17A is a perspective sectional view of one of the manufacturingsteps of the array camera module according to the above preferredembodiment of the present invention, illustrating that the moldedphotosensitive assembly semi-finished product is placed between an uppermold and a lower mold of the molding-die, wherein the pressing surfaceof the upper mold is in contact with the top surface of the supportingbody.

FIG. 17B is a perspective sectional view of one of the manufacturingsteps of the array camera module according to the above preferredembodiment of the present invention, illustrating that a covering filmis provided on the pressing surface of the upper mold, wherein thecovering film is positioned between the pressing surface of the uppermold and the top surface of the supporting body when the pressingsurface of the upper mold is pressed against the top surface of thesupporting body.

FIG. 18 is a perspective sectional view of one of the manufacturingsteps of the array camera module according to the above preferredembodiment of the present invention, illustrating that a moldingmaterial is added to a molding cavity formed between the upper mold andthe lower mold.

FIG. 19 is a perspective sectional view of one of the manufacturingsteps of the array camera module according to the above preferredembodiment of the present invention, illustrating that a moldedphotosensitive assembly of the array camera module is formed after themolding material is solidified and cured.

FIG. 20 is a perspective sectional view of one of the manufacturingsteps of the array camera module according to the above preferredembodiment of the present invention, illustrating that a filter memberis mounted on the top surface of the molded base.

FIG. 21 is a perspective sectional view of one of the manufacturingsteps of the array camera module according to the above preferredembodiment of the present invention, illustrating that an optical lensof the array camera module is mounted on a driver, wherein the driver ismounted on the top surface of the module base.

FIG. 22 is a perspective sectional view of one of the manufacturingsteps of the array camera module according to the above preferredembodiment of the present invention, illustrating that each of thedriver is respectively mounted on a mounting space of a supporter of thearray camera module to form the array camera module.

FIG. 23 is a perspective view of the array camera module according tothe above preferred embodiment of the present invention.

FIG. 24 is a perspective view of an alternative mode of the array cameramodule according to the above preferred embodiment of the presentinvention.

FIG. 25 is a perspective view of an alternative mode of the array cameramodule according to the above preferred embodiment of the presentinvention.

FIG. 26 is a perspective view of an alternative mode of the array cameramodule according to the above preferred embodiment of the presentinvention.

FIG. 27A is a perspective view of an alternative mode of the arraycamera module according to the above preferred embodiment of the presentinvention.

FIG. 27B is a perspective view of an alternative mode of the arraycamera module according to the above preferred embodiment of the presentinvention.

FIG. 28A is a perspective view of an alternative mode of the moldedphotosensitive assembly semi-finished product of the array camera moduleaccording to the above preferred embodiment of the present invention,illustrating that at least a part of the periphery area of the circuitboard and the chip-outer portion, the chip-connecting portion and atleast a part of the chip-inner portion of the non-photosensitive area ofthe photosensitive element are covered by the supporting body.

FIG. 28B is a perspective view of an alternative mode of the moldedphotosensitive assembly semi-finished product of the array camera moduleaccording to the above preferred embodiment of the present invention,illustrating that at least a part of the periphery area of the circuitboard and the chip-outer portion and at least a part of thechip-connecting portion the non-photosensitive area of thephotosensitive element are covered by the supporting body.

FIG. 28C is a perspective view of an alternative mode of the moldedphotosensitive assembly semi-finished product of the array camera moduleaccording to the above preferred embodiment of the present invention,illustrating that at least a part of the periphery area of the circuitboard and at least a part of the chip-outer portion of thenon-photosensitive area of the photosensitive element are covered by thesupporting body.

FIG. 28D is a perspective view of an alternative mode of the moldedphotosensitive assembly semi-finished product of the array camera moduleaccording to the above preferred embodiment of the present invention,illustrating that at least a part of the periphery area of the circuitboard is covered by the supporting body.

FIG. 28E is a perspective view of an alternative mode of the moldedphotosensitive assembly semi-finished product of the array camera moduleaccording to the above preferred embodiment of the present invention,illustrating that at least a part of the periphery area of the circuitboard is covered by the supporting body.

FIG. 29 is a sectional view of an alternative mode of the moldedphotosensitive element of the array camera module according to the abovepreferred embodiment of the present invention, illustrating that themolded base is covered by the outer surface of the supporting body.

FIG. 30 is a sectional perspective view of the array camera moduleaccording to another preferred embodiment of the present invention.

FIG. 31 is a sectional perspective view of the array camera moduleaccording to another preferred embodiment of the present invention.

FIG. 32 is a sectional perspective view of the array camera moduleaccording to another preferred embodiment of the present invention.

FIG. 33 is a schematic view of an electronic device with the arraycamera module according to another preferred embodiment of the presentinvention.

FIG. 34A is a sectional view of the camera module according to anotherpreferred embodiment of the present invention.

FIG. 34B is a sectional view of an alternative mode of the camera moduleaccording to the above preferred embodiment of the present invention.

FIG. 35 is a perspective view of the circuit board, the photosensitiveelement and the protective frame of the camera module according to theabove preferred embodiment of the present invention.

FIG. 36A is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 36B is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 36C is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 36D is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 36E is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 36F is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 37A is a sectional view of an alternative mode of one of themanufacturing steps in FIG. 36C of the array camera module according tothe above preferred embodiment of the present invention.

FIG. 37B is a sectional view of an alternative mode of one of themanufacturing steps in FIG. 36D of the array camera module according tothe above preferred embodiment of the present invention.

FIG. 38 is a sectional view of an alternative mode of one of themanufacturing steps in FIG. 36D of the array camera module according tothe above preferred embodiment of the present invention.

FIG. 39A is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 39B is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 39C is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 39D is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 39E is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 39F is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 39G is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 40 is a sectional view of the camera module according to anotherpreferred embodiment of the present invention.

FIG. 41 is a perspective view illustrating the circuit board, thephotosensitive element and the protective frame of the camera moduleaccording to the above preferred embodiment of the present invention.

FIG. 42A is sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 42B is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 42C is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 42D is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 42E is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 42F is a sectional view of one of the manufacturing steps of thearray camera module according to the above preferred embodiment of thepresent invention.

FIG. 43 is a diagram showing the internal configuration of the cameramodule part according to a preferred embodiment of the invention takenalong the intermediate position.

FIG. 44 is a sectional view of the camera module according to anotherpreferred embodiment of the present invention.

FIG. 45 is an enlarged sectional view of on the position S in FIG. 44.

FIG. 46 is a sectional view of the camera module according to anotherpreferred embodiment of the present invention.

FIG. 47 is an enlarged sectional view of on the position S′ in FIG. 46.

FIG. 48 is a sectional view of a first step of a manufacturing method ofthe array camera module according to the above preferred embodiment ofthe present invention.

FIG. 49 is a sectional view of a second step of the above manufacturingmethod of the array camera module according to the above preferredembodiment of the present invention.

FIG. 50 is a sectional view of a third step of the above manufacturingmethod of the array camera module according to the above preferredembodiment of the present invention.

FIG. 51 is a sectional view of a first step of another manufacturingmethod of the array camera module according to the above preferredembodiment of the present invention.

FIG. 52 is a sectional view of a second step of the above manufacturingmethod of the array camera module according to the above preferredembodiment of the present invention.

FIG. 53 is a sectional view of a third step of the above manufacturingmethod of the array camera module according to the above preferredembodiment of the present invention.

FIG. 54 is a sectional view of a first step of a manufacturing method ofthe array camera module according to the above preferred embodiment ofthe present invention.

FIG. 55 is a sectional view of a second step of the above manufacturingmethod of the array camera module according to the above preferredembodiment of the present invention.

FIG. 56 is a sectional view illustrating a manufacturing method of thearray camera module according to another preferred embodiment of thepresent invention

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The following description is disclosed to enable any person skilled inthe art to make and use the present invention. Preferred embodiments areprovided in the following description only as examples and modificationswill be apparent to one skilled in the art. The general principlesdefined in the following description would be applied to otherembodiments, alternatives, modifications, equivalents, and applicationswithout departing from the spirit and scope of the present invention.

According to FIGS. 1 to 7 of the drawings of the present invention, acamera module according to a preferred embodiment of the presentinvention is illustrated, wherein the camera module comprises at leastone optical lens 10 and at least one molded photosensitive assembly 20.The at least one molded photosensitive element 20 further comprises aphotosensitive element 21, a circuit board 22, a molded base 23, and aset of wires 24, wherein each of the wires 24 has two ends extended tobe connected to a non-photosensitive area of the photosensitive element21 and the circuit board 22, wherein the molded base 23 is integrallymolded with the circuit board 22, so that the molded base 23 and thecircuit board 22 are formed in an integrated structure, and the at leastone optical lens 10 is disposed in a photosensitive path of thephotosensitive element 21 of the molded photosensitive element 20. Lightreflected by an object enters the inside of the camera module from theoptical lens 10 to be received and photoelectrically converted by thephotosensitive element 21 subsequently, for obtaining an image about theobject.

It is worth to mention that the photosensitive element 21 has a set ofchip connectors 211, and the circuit board 22 has a set of circuitconnectors 221, wherein two ends of each of the wires 24 can berespectively connected to the respective chip connector 211 of thephotosensitive element 21 and the respective circuit connector 221 ofthe circuit board 22 in such a manner that the photosensitive element 21and the circuit board 22 are electrically connected. For example, in thepresent invention, each of the chip connectors 211 of the photosensitiveelement 21 and each of the circuit connectors 221 of the circuit board22 may be a pad. That is, each of the chip connectors 211 of thephotosensitive element 21 and each of the circuit connectors 221 of thecircuit board 22 may be in a round shape for connecting with the twoends of each of the wires 24 to connect the respective chip connector211 of the photosensitive element 21 and the respective circuitconnector 221 of the circuit board 22. For another example in thepresent invention, each of the chip connectors 211 of the photosensitiveelement 21 and each of the circuit connectors 221 of the circuit board22 may be in spherical shape, such as solder paste or the like. A soldermaterial is placed on the photosensitive element 21 and the circuitboard 22 to form the chip connector 211 of the photosensitive element 21and the circuit connector 221 of the circuit board 22. Nevertheless, theshape of the chip connector 211 of the photosensitive element 21 and thecircuit connector 221 of the circuit board 22 is not limited in thepresent invention.

The photosensitive element 21 comprises a photosensitive area 212 and anon-photosensitive area 213, wherein the photosensitive area 212 and thenon-photosensitive area 213 of the photosensitive element 21 areintegrally formed, wherein the photosensitive area 212 is positioned inthe middle of photosensitive element 21 and the non-photosensitive area213 is positioned at the periphery of the photosensitive element 21,wherein the photosensitive area 212 is circularly surrounded by thesurrounding non-photosensitive area 213. After the light reflected bythe object enters the inside of the camera module from the optical lens10, it can be received and photoelectrically converted by thephotosensitive area 212 of the photosensitive element 21 to obtain animage associated with the object.

One skilled in the art will understand that each of the chip connectors211 of the photosensitive element 21 is disposed in thenon-photosensitive area 213 of the photosensitive element 21. Inaddition, the non-photosensitive area 213 of the photosensitive element21 has a chip-inner portion 2131, a chip-connecting portion 2132, and achip-outer portion 2133, wherein the photosensitive area 212 issurrounded by the chip-inner portion 2131. Both sides of thechip-connecting portion 2132 are respectively extended and connected tothe chip-inner portion 2131 and the chip-outer portion 2133. That is,from a position where the chip connector 211 is disposed to a positionof the periphery of the photosensitive area 212 to thenon-photosensitive area 213 is defined as the chip-inner portion 2131,wherein an area where the chip connector 211 is disposed on thenon-photosensitive area 213 is defined as the chip-connecting portion2132, wherein an area from the position where the chip connector 211 isdisposed on the non-photosensitive area 213 to the outer periphery ofthe photosensitive element 21 is defined as the chip-outer portion 2132.In other words, from the top view of the photosensitive element 21, inorder from the outer periphery to the inside, the photosensitive element21 is formed by the chip-outer portion 2133, the chip-connecting portion2132, the chip-inner portion 2131, and the photosensitive area 212.

In addition, the circuit board 22 comprises a flat chip mounting area222 and a periphery area 223, wherein the periphery area 223 isintegrally formed with the chip mounting area 222, and the peripheryarea 223 is positioned near the periphery of the mounting area 222. Thechip mounting area 222 is adapted to mount the photosensitive element 21thereon, and the circuit connector 221 is disposed on the periphery area223. The periphery area 223 of the circuit board 22 has a circuit-innerportion 2231, a circuit-connecting portion 2232, and a circuit-outerportion 2233. The chip mounting area 222 is surrounded by thecircuit-inner portion 2231. The two sides of the circuit-connectingportion 2232 are respectively extended and connected to thecircuit-inner portion 2231 and the circuit-outer portion 2233. That is,an area from a position where the board connector 221 is disposed on theperiphery area 223 to a position of the periphery of the chip mountingarea 222 is defined as the circuit-inner portion 2231, an area of theperiphery area 223 where the circuit connector 221 is disposed isdefined as the circuit-connecting portion 2232, and an area from theposition where the circuit connector 221 is disposed on the peripheryarea 223 to the outer edge of the periphery area 223 is defined as thecircuit-outer portion 2233. In other words, from the top view of thecircuit board 22, in order from the inside to the outer edge, thecircuit board 22 is formed by the circuit-outer portion 2233, thecircuit-connecting portion 2232, the circuit-inner portion 2231, and thechip mounting area 222. The type of the wires 24 is not limited in thecamera module of the present invention. For example, in one specificexample, the wires 24 each may be implemented as a gold wire, that is ina manner of connecting gold wires between the photosensitive element 21and the circuit board 22, so that the optical signal after convertinginto an electrical signal in the photosensitive element 21 can befurther transmitted to the circuit board 22 through the wires 24. Oneskilled in the art will understand that in other examples of the cameramodule, the wire 24 can be implemented as a silver wire, a copper wire,or the like that the material can realize transferring the electricalsignal between the photosensitive element 21 and the circuit board 22.

In addition, in one example, the camera module can be implemented as afixed focus camera module, wherein the optical lens 10 is held in thephotosensitive path of the photosensitive element 21 by a lens holdermounted on the molded base 23 of the camera module.

In another example, the camera module can be implemented as a zoomcamera module, wherein the focal length of the camera module is adjustedby changing the distance between the optical lens 10 and thephotosensitive element 21. Specifically, in the example shown in FIG. 7,the camera module further comprises at least one driver 30, wherein theoptical lens 10 is disposed correspondingly to the at least one driver30, wherein the driver 30 is mounted on the molded base 23 and iselectrically and respectively connected to the circuit board 22 to drivethe optical lens 10 to move along the photosensitive path of thephotosensitive element 21 by the driver 30 after transmitting power andcontrol signals with the circuit board 22 to the driver 30, therebyadjusting the focal length of the camera module. That is, the opticallens 10 is drivably disposed with respect to the driver 30.

It is worth to mention that the type of the driver 30 of the cameramodule is not limited in the present invention. For example, in oneexample, the driver 30 can be implemented as a drive unit, such as avoice coil motor, to move the optical lens 10 along the photosensitivepath of the photosensitive element 21, wherein the driver 30 is capableof receiving electrical power and control signals to be in anoperational state.

Furthermore, according to FIG. 7, the camera module further comprises atleast one filter member 40, wherein the at least one filter member 40 ismounted on each of the molded base 23 and positioned in thephotosensitive path of each of the photosensitive elements 21. The lightreflected by the object enters the inside of the camera module from theoptical lens 10 and is filtered by the filter member 40 to be receivedand photoelectrically converted by the photosensitive element 21. Thatis, the filter member 40 can filter stray light reflected by the objectfrom the optical lens 10 into the interior of the camera module, such asan infrared light. In such a manner, the imaging quality of the cameramodule is improved.

One skilled in the art will understand that in different examples of thecamera module, the filter members 40 can be implemented with differenttypes, for example, the filter members 40 can be implemented as infraredcutoff filters, full transmissive spectral filters, and other filters ora combination of multiple types of filters. For example, the filtermember 40 can be implemented as a combination of an infrared cutofffilter and a full transmissive filter that is the infrared cutoff filterand the full transmissive spectral filter can be selectively switched tobe positioned along the photosensitive path of the photosensitiveelement 21. For example, in an environment where light is sufficientduring daytime, the infrared cutoff filter may be chosen in thephotosensitive path of the photosensitive element 21 to filter infraredrays reflected by the object entering the camera module. When the cameramodule is used in a dark environment, such as a dark night, thefull-transmission spectral filter can be chosen in the photosensitivepath of the photosensitive element 21 to allow the infrared part of thelight reflected by the object entering the camera module.

According to FIG. 7, the molded photosensitive assembly 20 of the cameramodule further comprises a supporting member 25, wherein the supportingmember 25 is disposed on the non-photosensitive area 213 of thephotosensitive element 21 before the molded base 23 is molded. After themolded base 23 is molded, the circuit board 22, the non-photosensitivearea 213 of the photosensitive element 21, and a part of the supportingmember 25 is covered by the molded base 23 to form the moldedphotosensitive assembly 20, wherein the supporting member 25 caneffectively improve the product yield of the camera module and improvethe imaging quality of the camera module. In the following description,features and advantages of the supporting member 25 will be furtherillustrated and disclosed.

Furthermore, the supporting member 25 has a top surface 2501, an innersurface 2502 and an outer surface 2503, wherein the two sides of the topsurface 2501 are respectively connected to the inner surface 2502 andthe outer surface 2503. It is worth mentioning that the side of thesupporting member 25 facing the photosensitive element 21 is defined asthe inner surface 2502 of the supporting member 25 and the side of thesupporting members 25 facing the circuit board 22 is defined as theouter surface 2503 of the supporting member 25.

According to FIG. 7, the molded photosensitive assembly 20 of the cameramodule further comprises a plurality of electronic components 26,wherein each of the electronic components 26 can be mounted on theperiphery area 223 of the circuit board 22 by a process such as SMT(Surface Mount Technology). Preferably, each of the electroniccomponents 26 is mounted on the circuit-outer portion 2233 of theperiphery area 223. The photosensitive element 21 and each of theelectronic components 26 may be mounted on the same side or oppositesides of the circuit board 22. For example, the photosensitive element21 and each of the electronic components 26 are mounted on the same sideof the circuit board 22, the photosensitive element 21 is mounted on thechip mounting area 222 of the circuit board 22, and each of theelectronic components 26 is mounted on the periphery area 223 of thecircuit board 22. After the molded base 23 is integrally molded to thecircuit board 22, each of the electronic components 26 is covered by themolded base 23 to be isolated from the adjacent electronic components26. Even the distance between two of the adjacent electronic components26 is relatively close, the molded base 23 can prevent the adjacentelectronic components 26 from contacting or interfering with each otherby isolating the adjacent electronic components 26 with thephotosensitive element 21 in the camera module of the present invention.And in a manner that the electronic components 26 are covered by themolded base 23, it can also be avoided the electronic contaminantsgenerated on the surface of the electronic components 226 fromcontaminating the photosensitive area 212 of the photosensitive element21, thereby reducing the size of the camera module and improving theimaging quality of the camera module. That is, the circuit board 22 in asmall area can be mounted with more electronic components 26 of thecamera module of the present invention by covering the electroniccomponents 26 by the molded base 23. It is worth mentioning that thetypes of the electronic component 26 include, but are not limited to,resistor, capacitor, driving device, and the like.

In addition, it will be understood by one skilled in the art that,although the single camera module is taken as an example to disclose themanufacturing steps of the camera module and the manufacturing steps ofthe molded photosensitive assembly 20 as shown in FIG. 1 to FIG. 7, thecamera module can also be implemented as a dual lens camera module or anarray camera module as shown in FIG. 8, in which the invention shouldnot be limited to the number of molded photosensitive assembly of thecamera module.

The manufacturing steps of the camera module and the manufacturing stepsof the molded photosensitive assembly 20 are illustrated as shown inFIGS. 1 to 7.

According to FIG. 1, the photosensitive element 21 is mounted on thechip mounting area 222 of the circuit board 22, and each of the chipconnectors 211 of the non-photosensitive area 213 of the photosensitiveelement 21 and the circuit connectors 221 on the periphery area 223 ofthe circuit board 22 are connected by a set of the wires 24respectively. Furthermore, each of the electronic components 26 ismounted on the circuit-outer portion 2233 of the periphery area 223 ofthe circuit board 22. That is, both ends of the wires 24 arerespectively connected to the photosensitive element 21 and the circuitboard 22, wherein each of the wires 24 upwardly protrudes on the surfaceof the photosensitive element 21. It can be understood that, limited tothe wire bonding process of connecting the photosensitive element 21 andthe circuit board 22 with the wires 24 and the characteristics of thewires 24 themselves. After the two ends of the wires 24 are respectivelyconnected to the respective chip connector 211 of the non-photosensitivearea 213 of the photosensitive element 21 and the respective circuitconnector 221 of the periphery area 223 of the circuit board 22, thewires 24 need to be in an arc shape to be protruded on the upper surfaceof the photosensitive element 21. In addition, maintaining the arc shapeof each of the wires 24 in a curved state facilitates the ability totransmit the electrical signals between the photosensitive element 21and the circuit board 22. Each of the wires 24 is arranged between thephotosensitive element 21 and the circuit board 22, for example, beequally spaced. One skilled in the art will understand that during theprocess of manufacturing the camera module and during using of thecamera module, maintaining each of the wires 24 in this initial statehas advantages for ensuring the ability of the wires 24 transmitting theelectrical signals between the photosensitive element 21 and the circuitboard 22 so as to ensure the image quality of the camera module.

It is to be mentioned that, in the camera module of the presentinvention, the wire bonding direction of the wires 24 is not limited.For example, the wire bonding direction of the wire wires 24 may be fromthe photosensitive element 21 to the circuit board 22, or from thecircuit board 22 to the photosensitive element 21.

One skilled in the art will understand that although one of thephotosensitive elements 21 is mounted on one of the circuit boards 22 asan example in FIG. 1, as illustrated in the manufacturing steps and themanufacturing steps of the camera module of the present invention areexplained. In another example of the manufacturing steps of the moldedphotosensitive assembly 20 of the camera module, a plurality of thephotosensitive elements 21 may be mounted on different positions of oneof the circuit board 22 to be subsequently fabricated in a duel lenscamera module or an array camera module. In another example, a pluralityof the circuit boards 22 may be pieced together to form one of thecircuit board, and then each of the photosensitive element 21 isrespectively mounted on one of the pieced circuit board correspondinglyto the position of the circuit board 22, so as to separate the piecedcircuit board later. The invention is not limited in this way.

According to FIGS. 2A and 2B, the supporting member 25 is disposed onthe non-photosensitive area 213 of the photosensitive element 21, so asto form a molded photosensitive assembly semi-finished product by thephotosensitive element 21, the circuit board 22, and the supportingmember 25, wherein the supporting member 25 is provided to cover thechip-inner portion 2131, the chip-connecting portion 2232, and thechip-outer portion 2233 of the non-photosensitive area 213 of thephotosensitive element 21. In other words. The supporting member 25 cancover a part of each of the wires 24 to enable the wires 24 to bewrapped during manufacturing the camera module and during the molding ofthe photosensitive element 20 to improve the imaging quality of thecamera module by protecting the good electrical properties of the wires24. One skilled in the art will understand that in this embodiment ofthe camera module of the present invention, the chip connector 211 ofthe photosensitive element 21 is covered by the supporting member 25.

Furthermore, the supporting member 25 comprises a frame-shapedsupporting body 251 and has a through hole 252, wherein the supportingbody 251 is disposed on the non-photosensitive area 213 of thephotosensitive element 21 to make the photosensitive area 212 of thephotosensitive element 21 corresponding to the through hole 252 of thesupporting member 25, so that the supporting body 251 can protect thephotosensitive area 212 of the photosensitive element 21 during amolding process. The molded base 23 covers the outer surface 2503 of thesupporting body 251 and at least a part of the top surface 2501 aftermolded. It is worth mentioning that the inner surface 2502 of thesupporting member 25 forms the through hole 252 of the supporting member25.

Preferably, the chip-inner portion 2131, the chip-connecting portion2132, and the chip-outer portion 2133 of the photosensitive element 21are covered by the supporting body 251, that is the supporting body 251can cover the chip connector 211 of the supporting body such that thesupporting body 251 can prevent the wires 24 and the connection positionof the chip connector 211 from contacting the molding material forforming the molded base 23 to avoid the wires 24 being detached from thechip connector 211. It can be understood that when the supporting body251 covers the wires 24 and the connection position of the chipconnector 211, the supporting body 251 can isolate the wires 24 and theconnection position of the chip connector 211 for preventing deformationof the end portion of each of the wires 24 connecting the chip connector211 and detaching of the wires 24 from the chip connector 211 causing bythe molding material during a molding process. In one embodiment, thesupporting body 251 may be formed by a cured glue applied in thenon-photosensitive area 213 of the photosensitive element 21, so thatthe supporting body 251 has a predetermined elasticity, wherein afterthe supporting body 251 is formed, the inner surface 2502 of thesupporting body 251 forms the through hole 252 while the photosensitivearea 212 of the photosensitive element 21 is positioned corresponding tothe through hole 252. In addition, the supporting body 251 formed by theglue after cured may also have a viscosity for adhering contaminant suchas dust subsequently, thereby preventing the contaminants fromcontaminating the photosensitive area 212 of the photosensitive element21 to cause the stain point in the photosensitive area 212 of thephotosensitive element 21 so as to further ensure the image quality ofthe camera module. For example, the supporting body 251 is disposedbetween the photosensitive area 212 of the photosensitive element 21 andthe electronic component 26, thereby preventing contamination bycontaminants, such as the solder powder generated during the electroniccomponent 26 is mounted on the circuit board 22 from contaminating thephotosensitive area 212 of the photosensitive element 21 in a way thatthe solder powder may be adhered by the supporting body 251.

Preferably, the supporting body 251 may cover the non-photosensitivearea 213 of the photosensitive element 21 in a gel state and be formedafter cured to prevent covering the non-photosensitive area 213 of thephotosensitive element 21 flowing to contaminate the photosensitive area212 of the photosensitive element 21. In other words, the glue has goodplasticity and self-setting properties before cured to form thesupporting body 251, so that the glue is not deformed during applying tothe non-photosensitive area 213 of the photosensitive element 21 andcuring. One skilled in the art will understand that the supporting body251 formed by the glue can cover the wires 24 by applying the glue in agel state to the non-photosensitive area 213 of the photosensitiveelement 21 to prevent damaging the wires 24 during applying of the glueto the non-photosensitive area 213 of the photosensitive element 21.

According to FIG. 3A, during the molding process, the molding materialis solidified and cured by a molding-die 100 to form the molded base 23which is at least integrally molded on the circuit board 22, such thatthe method can reduce the size of the camera module and reduce theassembly error of the camera module, thereby making the structure of thecamera module more compact and improving the imaging quality of thecamera module.

Specifically, the molding-die 100 comprises the upper mold 101 and thelower mold 102, wherein at least one of the upper mold 101 and the lowermold 102 can be moved to make the upper mold 101 and the lower mold 102being operated to close the upper mold 101 and the lower mold 102 by amold clamping operation, wherein at least one molding cavity 103 isformed between the upper mold 101 and the lower mold 102 and the moldingmaterial is filled in the molding cavity 103 to form the molded base 23after solidifying and curing. For example, in one embodiment, the lowermold 102 is generally fixed, and the upper mold 101 can be movedrelative to the lower mold 102 along at least a guiding rod to face thelower mold 102 to be clamped when the upper mold 101 is moved, therebyforming the molding cavity 103 between the upper mold 101 and the lowermold 102, and the molding-die 100 can be demolded while the upper mold101 moving away from the lower mold 102. Or, in another example, theupper mold 101 is fixed, and the lower mold 102 can be moved relative tothe upper mold 101 along the guiding rod to be clamped toward the uppermold 101, thereby forming the molding cavity 103 between the lower mold102 and the upper mold 101, and that the molding-die 100 can be demoldedwhile the lower mold 102 moving away from the upper mold 101.

The photosensitive element 21 and the circuit board 22 are electricallyconnected by a set of the wires 24 and the supporting body 251 is formedin the non-photosensitive area 213 of the photosensitive element 21 atto cover at least a part of each of the wires 24 to forming the moldedphotosensitive assembly semi-finished product. Place the moldedphotosensitive assembly semi-finished product on the lower mold 102 ofthe molding-die 100, and operate the upper mold 101 of the molding-die100 and/or the lower mold 102 to clamp the upper mold 101 and/or thelower mold 102 to form the molding cavity 103 therebetween, wherein thephotosensitive element 21, the circuit board 22 and the supportingmember 25 are respectively partially in contact with the molding cavity103 of the molding-die 100, wherein the pressing surface 1011 of theupper mold 101 is in contact with the top surface 2501 of the supportingbody 251. The upper mold 101 is supported upwardly by the supportingbody 251 to prevent the pressing surface 1011 of the upper mold 101 frombeing pressed against the wires 24. For example, in this specificexample of the present invention as illustrated in FIG. 7, the outsideof the circuit board 22, the non-photosensitive area of thephotosensitive element 21, and a part of the supporting member 25 arepositioned in the molding cavity 103 of the molding-die 100 such thatwhen the molded base 23 is molded in the molding cavity 103, the moldedbase 23 covers the outside of the circuit board 22, thenon-photosensitive area of the photosensitive element 21, and a portionof the supporting member 25.

Therefore, it will be understood by one skilled in the art that themolding cavity 103 of the molding-die 100 may be an annular space toform a ring shape after the molding material is filled and cured in themolding cavity 103.

It is worth mentioning that the supporting body 251 has a predeterminedelasticity so that when the molding-die 100 is closed and clamped formolding, the instantaneous impact force generated by the pressingsurface 1011 of the upper mold 101 of the molding-die 100 against thetop surface 2501 of the supporting body 251 is absorbed by thesupporting body 251 to prevent the impact force from being furthertransmitted to the photosensitive element 21, thereby preventing thephotosensitive element 21 from being damaged or avoiding thephotosensitive element 21 being displaced relative to the circuit board22 due to the impact force. One skilled in the art will understand thatthe supporting body 251 absorbs the impact force to prevent the impactforce from being further transmitted to the photosensitive element 21,and also ensures that the flatness of the photosensitive element 21mounted on the circuit board 22 is not affected, thereby ensuring theimage quality of the camera module.

It is worth to mention that the supporting body 251 has a Shore hardnessranging from A50 to A80 and an elastic modulus ranging from 0.1 GPa to 1GPa.

Preferably, in the example of the present invention as shown in FIG. 7,the height of the supporting body 251 may be implemented to be higherthan or equal to the height of each of the wires 24 protruded upwardly.In the mold clamping operation of the molding-die 100, when the pressingsurface 1011 of the upper mold 101 of the molding-die 100 is in contactwith the top surface 2501 of the supporting body 251, the supportingbody 251 can support the upper mold 101 upwardly which prevents theupper mold 101 from being pressed against the wires 24. For example, inone example, the height of the supporting body 251 is equal to theheight of each of the wires 24 protruded upwardly, so that when theupper mold 101 and the lower mold 102 of the molding-die 100 are closedand clamped, the supporting body 251 supports the upper mold 101upwardly so that the pressing surface 1011 of the upper mold 101 cancontact the wires 24, but the pressing surface 1011 of the upper mold101 does not press on the wire 24. In another example, the height of thesupporting body 251 is higher than the height of each of the wires 24protruded upwardly, so that when the upper mold 101 and the lower mold102 of the molding-die 100 are closing and clamping, the supporting body251 supports the upper mold 101 in an upward direction, so that thepressing surface 1011 of the upper mold 101 will not contact with thewires 24, thereby avoiding the pressing surface 1011 of the upper mold101 being pressed on the wires 24. That is, the supporting body 251 cansupport the upper mold 101 in an upward direction to maintain a safedistance between the pressing surface 1011 of the upper mold 101 and thewires 24.

In addition, the supporting body 251 has a predetermined elasticity, andafter the upper mold 101 and the lower mold 102 of the molding-die 100are closed and clamped during molding, the pressing surface 1011 of theupper mold 101 is in contact with the top surface 2501 of the supportingbody 251, wherein the pressure of the pressing surface 1011 of the uppermold 101 applied to the top surface 2501 of the supporting body 251 cancause slight deformation of the supporting body 251 for preventing a gapfrom being formed between the pressing surface 1011 of the upper mold101 and the top surface 2501 of the supporting body 251. That is, theupper mold 101 of the molding module 100 can be closely matched with thesupporting body 251 such that the photosensitive area of thephotosensitive element 21 corresponding to the through hole 252 of thesupporting member 25 is remained in a sealed environment to prevent themolding material entering the sealed environment to contaminate thephotosensitive area of the photosensitive element 21 during the moldingprocess.

FIG. 3B shows an alternative mode of the embodiment of the moldedphotosensitive assembly 20 of the present invention, wherein thesupporting member 25 can be made of a hard material. That is, when thesupporting body 251 of the supporting member 25 is formed on at least apart of the non-photosensitive area 213 of the photosensitive element21, and the pressing surface 1011 of the upper mold 101 of themolding-die 100 is pressed against the top surface 2501 of thesupporting body 251 without deformation to ensure good electricalproperties of the wires 24, thereby ensuring the yield of the cameramodule in the subsequent process and further ensuring the imagingquality of the camera module.

It is worth to mention that the supporting body 251 has a Shore hardnessgreater than D70 and a modulus of elasticity greater than 1 Fpa.

The molding-die 100 further comprises a covering film 106 adapted to bepositioned between the pressing surface 1011 of the upper mold 101 andthe top surfaces 2501 of the supporting body 251 during the closing andclamping of the upper mold 101 and the lower mold 102. Preferably, thecovering film 106 may be placed on the pressing surface 1011 of theupper mold 101 before the upper mold 101 and the lower mold 102 areclosed and clamped. The covering film 106 is disposed between thepressing surface 1011 of the upper mold 101 and the supporting body 251and, on the one hand, a gap can be prevented being formed between thepressing surface 1011 of the upper mold 101 and the supporting body 251,such that the covering film 106 can absorb the impact force generated bythe upper mold 101 and the clamped lower mold 102, thereby avoiding thephotosensitive element 21, the circuit board 22, and the wires 24 beingdamaged when the upper mold 101 and the lower mold 102 is closed andclamped.

According to FIG. 4, after the molten molding material is added into themolding cavity 103 of the molding-die 100, the molding material fillsthe entire molding cavity 103 where the photosensitive element 21 isdisposed. The supporting body 251 formed on the non-photosensitive area213 of the photosensitive element 21 can prevent the molding materialfrom entering from a connection position of the supporting body 251 andthe non-photosensitive area 213 of the photosensitive element 21 intothe photosensitive area 212 of the photosensitive element 21. Inaddition, the supporting body 251 can prevent any gap formed between thepressing surface 1011 of the upper mold 101 and the top surface 2501 ofthe supporting body 251 due to deformation, thereby preventing themolding material entering into the sealing environment from a connectionposition of the top surface 2501 of the supporting body 251 and thepressing surface 1011 of the upper mold 101, that can avoid occurrenceof “flashing” after the molding material is solidified.

It is worth to mention that the molding material in fluid form accordingto the present invention may be a liquid material or a solid particulatematerial or a mixed material of liquid and solid particles. It can beunderstood that whether the molding material is implemented as a liquidmaterial or implemented as a solid particulate material or as a liquidand solid particulate mixed material, after being added into the moldingcavity 103 of the molding-die 100, the molding material can besolidified and cured to form the molded base 23. For example, in thisspecific example of the invention, the flowing molding material isembodied as a liquid thermosetting material, wherein the moldingmaterial is solidified and cured after being filled in the moldingcavity 103 of the molding-die 100 to form the molded base 23. It isworth mentioning that, when the molding material is added into themolding cavity 103 of the molding-die 100, the manner of how the flowingmolding material is solidified and cured is not limited in the presentinvention.

According to FIG. 5, the supporting body 251 is disposed on thenon-photosensitive area 213 of the photosensitive element 21, whereinafter the molding material is added into the molding cavity 103 of themolding-die 100, the supporting body 251 can prevent the moldingmaterial from entering the photosensitive area 212 of the photosensitiveelement 21, so that after the molding material is solidified and curedto form the molded base 23, a light window 231 of the molded base 23 isformed with respect to the photosensitive area 212 of the photosensitiveelement 21. Accordingly, the light window 231 of the molded base 23allows light to pass through and to be received by the photosensitiveelement 21, wherein the photosensitive area 212 receives and performsphotoelectric conversion. That is, the molding material filled in themolding cavity 103 of the molding-die 100 forms a molded body 232 of themolded base 23 and the light window 231 is formed in a middle portion ofthe molded base 23 after curing. In other words, the molded base 23comprises the molded body 232 and has the light window 231, whichprovides a light path between the optical lens 10 and the photosensitiveelement 21. After the light reflected by an object enters the interiorof the camera module from the optical lens 10, it is photoelectricallyconverted through the light window 231 of the molded base 23 and isreceived by the photosensitive area 212 of the photosensitive element21.

It is worth mentioning that, after the molded base 23 is formed, themolded base 23 covers each of the electronic components 26, therebyisolating each of the electronic components 26 by the molded base 23.The electronic components 26 and the photosensitive element 21 areisolated by the molded base 23 in such a manner that, even the adjacentelectronic components 26 are relatively close with each other, themolded base 23 can also prevent the adjacent electronic components 26from contacting with each other and the contaminants generated by theelectronic components 26 from contaminating the photosensitive area ofthe photosensitive element 21 to improve the imaging quality of thecamera module.

According to FIG. 6, the filter member 40 is mounted on the top surfaceof the molded base 23, such that the light window 231 of the molded base23 is sealed by the filter member 40. Therefore, the light from theoptical lens entering the inside of the camera module can be furtherfiltered by the filter member 40 to improve the imaging quality of thecamera module.

Furthermore, the top surface of the molded base 23 forms an innersurface 233 and an outer surface 234, wherein in one example, the innersurface 233 and the outer surface 234 of the molded base 23 are on thesame level. The top surface of the molded base 23 is formed into a wholeflat plane, wherein the filter member 40 is mounted on the inner surface233 of the molded base 23, wherein the driver 30 or the lens holder ismounted on the outer surface 234 of the molded base 23, or the opticallens 10 is directly mounted on the outer surface 234 of the molded base23. In another example, the inner surface 233 of the molded base 23 maybe positioned lower than the plane in which the outer surface 234 ispositioned, thereby the top surface of the molded base 23 forms astepped shape. A surface in which the inner surface 233 of the moldedbase 23 is positioned lower than a plane in which the outer surface 234is positioned forms a recess 235 of the molded base 23, wherein thefilter member 40 mounted on the inner surface 233 of the molded base 23is received in the recess 235 of the molded base 23 and the driver 30 ismounted on the outer surface 234 of the molded base 23, such that theoptical lens 10 mounted on the driver 30 is further held in thephotosensitive path of the photosensitive element 21, as shown in FIG.7, thereby the camera module is manufactured.

According to FIG. 9A, a first alternative mode of the above embodimentof the camera module of the present invention is illustrated, which isdifferent from the above-described embodiment of the camera module ofthe present invention that each of the wires 24 of the plasticphotosensitive element 20 is entirely covered inside the supporting body251 of the camera module of the present invention.

Specifically, the supporting body 251 covers at least a part of thechip-inner portion 2131, the chip-connecting portion 2132, thechip-outer portion 2133, the circuit-inner portion 2231, thecircuit-connecting portion 2232, and at least a part of thecircuit-outer portion 2233, wherein the supporting body 251 not onlycovers an extended portion of the wires 24 but also covers theconnection positions of the wires 24 and the photosensitive element 21and the chip connector 211 as well as the connection positions of thecircuit connector 221 of the circuit board 22 and the wires 24, so as topre-fix the wires 24 by the supporting body 251. Thus, in the subsequentmolding process to form the molded base 23, while the upper mold 101 andthe lower mold 102 of the molding-die 100 are closed and clamped, thepressing surface 1011 of the upper mold 101 is in contact with the topsurface 2501 of the supporting body 251 to prevent the pressing surface1011 of the upper mold 101 from directly pressing the wires 24, therebypreventing the wires 24 from being stressed to be deformed or damaged.

In addition, the wires 24 are entirely covered inside the supportingbody 251, so that the supporting body 251 can prevent the moldingmaterial from being direct contact with the wires 24 when the moldingmaterial is added into the molding cavity 103 formed between the uppermold 101 and the lower mold 102 to prevent the molding material withhigh temperature and rapid flowing to damage the wires 24. Preferably,the supporting body 251 has good heat insulation to prevent thetemperature of the molding material from transferring to the wires 24.More preferably, a height of the supporting body 251 is higher than aheight of the protruding portion of each of the wires 24, so that thesupporting body 251 supports the upper mold 101 in an upward directionduring the molding process. A safety distance is reserved between thepressing surface 1011 and the protruding portion of each of the wires24.

And, the supporting body 251 covers the chip-outer portion 2133 of thephotosensitive element 21 and the circuit-inner portion 2231 of thecircuit board 22 to cover the mounting position of the photosensitiveelement 21 mounted on the circuit board 22 by the supporting body 251,such that the supporting body 251 can not only pre-fix thephotosensitive element 21 and the circuit board 22, but also prevent therespective portions of the photosensitive element 21 and the circuitboard 22 from being displaced due to uneven force during the moldingprocess. In addition, the supporting body 251 can also prevent themolding material from contacting the mounting position of thephotosensitive element 21 to the circuit board 22 which ensures theflatness of the photosensitive element 21 to improve the image qualityof the camera module.

One skilled in the art should understand that the supporting body 251 isdisposed along the mounting position of the photosensitive element 21and the circuit board 22, so that the supporting body 251 is in a squareshape. Therefore, the supporting body 251 is capable of preventing themolding material from entering the photosensitive area 212 of thephotosensitive element 21 during the molding process, thereby formingthe molded body 232 covering the edge region 223 of the circuit board 22and the outer surface 2503 of the supporting body 251 and the lightwindow 231 formed in the middle of the molded body 232 by the moldingmaterial after curing. The photosensitive area 212 of the photosensitiveelement 21 is positioned corresponding to the light window 231 of themolded base 23 such that the light window 231 provides a light path fromthe optical lens 10 to the photosensitive element 21. Preferably, themolded body 232 covers the periphery area 223 of the circuit board 22,the outer surface 2503 of the supporting body 251, and at least a partof the top surface 2501 after molded.

In a second alternative mode of the embodiment of the camera module ofthe present invention as shown in FIG. 9B, the supporting body 251covers the chip-outer portion 2133 of the photosensitive element 21 andat least a part of the circuit-inner portion 2231, thecircuit-connecting portion 2232, and the circuit-outer portion 2233 ofthe circuit board 22. That is, in the example of the camera module asshown in FIG. 9B, the supporting body 251 may not cover thechip-connecting portion 2132 of the photosensitive element 21.

In a third alternative mode of the embodiment of the camera module ofthe present invention as shown in FIG. 9C, the supporting body 251covers the chip-connecting portion 2132 and the chip-outer portion 2133of the photosensitive element 21, and the circuit-inner portion 2231 andthe circuit-connecting portion 2232 of the circuit board 22. That is, inthis alternative mode of the embodiment of the camera module of thepresent invention as shown in FIG. 9C, the supporting body 251 may notcover the chip-inner portion 2131 of the photosensitive element 21 andthe circuit-outer portion 2233 of the circuit board 22. That is, in thealternative modes of the embodiments of the camera module as shown inFIGS. 9A, 9B, and 9C, the supporting body 251 can simultaneously coverthe photosensitive element 21 and a mounting position of the circuitboard 22 to pre-fix the photosensitive element 21 and the circuit board22 by the supporting body 251, and avoid the mounting position of thephotosensitive element 21 and the circuit board 22 generating a slit bythe supporting body 251, so that the supporting body 251 can prevent therespective portion of the photosensitive element 21 and the circuitboard 22 from being displaced due to uneven force during the moldingprocess, and the molding material from entering between thephotosensitive element 21 and the circuit board 22 to ensure theflatness of the photosensitive element 21.

According to FIG. 10A, a fourth alternative mode of the embodiment ofthe camera module of the present invention is illustrated, wherein thesupporting body 251 covers the circuit-inner portion 2231 of theperiphery area 223 of the circuit board 22, at least a part of thecircuit-connecting portion 2232 and at least a part of the circuit-outerportion 2233. That is, the supporting body 251 covers the circuitconnector 221 of the circuit board 22 during molding. On the one hand,the wires 24 is pre-fixed by the supporting body 251, and the wires 24and the circuit connector 221 are prevented from coming into contactwith the molding material by means of the supporting body 251, therebythe wires 24 are prevented from falling off from the circuit connector221.

According to FIG. 10B, a fifth alternative mode of the embodiment of thecamera module of the present invention is illustrated, wherein thesupporting body 251 covers only the chip-inner portion 2131 of thephotosensitive element 21 to be molded. In the molding process, thesupporting body 251 blocks the molding material from entering thephotosensitive area 212 of the photosensitive element 21, therebyforming the molded body 232 covering the periphery area 223 of thecircuit board 22 and chip-outer portion 2133 of the photosensitiveelement 21 and the chip-connecting portion 2132 after the moldingmaterial is solidified and cured. The light window 231 is formed at aposition with respect to the photosensitive area 212 of thephotosensitive element 21.

According to FIG. 11, a sixth alternative mode of the embodiment of thecamera module of the present invention is illustrated, which isdifferent from the above-described embodiment of the present inventionin that the molded body 232 is not covered with the top surface 2501 ofthe supporting body 251 after molded. For example, in this particularexample as illustrated in FIG. 11, the molded body 232 covers theperiphery area 223 of the circuit board 22 and the outer surface 2503 ofthe supporting body 251 after molded.

It is to be mentioned that, although the embodiments in which the heightof the supporting body 251 is higher than the height of the protrudingportion of each of the wires 24 are shown in FIGS. 1 to 11, in otheralternative modes of the present invention, the height of the supportingbody 251 may also be equal to the height of the protruding portion ofeach of the wires 24, or that the height of the supporting body 251 mayalso be lower than each of the height of the protruding portion of thewires 24 as long as, during the molding process, the pressing surface1011 of the upper mold 101 of the molding-die 100 is in contact with thetop surface of the supporting body 251 and the pressing surface of themold 101 is not directly pressed against each of the wires 24.

FIG. 12 shows an alternative mode of the above embodiment of the cameramodule, wherein the filter member 40 is not directly mounted on themodule body 232, but at least one holder 70 is provided by the cameramodule, wherein the filter member 40 is mounted on the holder 70 and theholder 70 is mounted on the top surface of the molded body 232, suchthat the filter member 40 is held and positioned between the opticallens 10 and the photosensitive element 21. Accordingly, the size of thefilter member 40 can be reduced and the height of the camera module isreduced correspondingly too.

Furthermore, the top surface of the molded body 232 can be a flatsurface, so that after the molded base 23 is molded, the holder 70 isfirstly mounted on the top surface of the molded body 232, and then thedriver 30 or the lens barrel 60 is mounted on the holder 70. That is,the driver 30 or the lens barrel 60 may not be directly mounted on thetop surface of the molded body 232 but may be mounted on the holder 70.

FIG. 13 shows another alternative mode of the above embodiment of thecamera module, wherein the top surface of the molded body 232 has arecess 235 and the holder 70 mounted on the top surface of the moldedbody 232 is received in the recess 235 to further reduce the height ofthe camera module. In this situation, the driver 30 or the lens barrel60 can be directly mounted on the top surface of molded body 232.

However, it will be understood by one skilled in the art that, in otheralternative modes of the camera module of the present invention, theoptical lens 10 may also be directly mounted on the top surface of themolded body 232 or the optical lens 10 can also be directly mounted onthe top surface of the holder 70. According to another aspect of thepresent invention, a manufacturing method of a molded photosensitiveassembly 20 is provided, which comprises the steps of:

(a) electrically connecting a photosensitive element 21 and a circuitboard 22 through a set of wires 24;

(b) placing the photosensitive element 21 and the circuit board 22 in anupper mold 101 or a lower mold 102 of a molding-die 100;

(c) in the process of closing and clamping the upper mold 101 and thelower mold 102 of the molding-die 100, supporting the upper mold 101 inan upward direction by a supporting member 25 to prevent the pressingsurface 1011 of the upper mold 101 from being pressed against each setof the wires 24; and

(d) adding a fluid molding material into a molding cavity 103 formedbetween the upper mold 101 and the lower mold 102 of the molding-die 100to form a molded base 23 after the molding material is cured, whereinthe molded base 23 comprises a molded body 232 and has a light window231, wherein at least a part of an periphery area 223 of the circuitboard 22 and at least a part of the supporting member 25 is covered bythe molded body 232.

According to another aspect of the present invention, the presentinvention further provides a manufacturing method of a moldedphotosensitive assembly 20, wherein the manufacturing method comprisesthe steps of:

(A) electrically connecting a photosensitive element 21 and a circuitboard 22 by a set of wires 24;

(B) covering at least a partial of the wires 24 by a supporting member25 to form a molded photosensitive assembly semi-finished product;

(C) placing the molded photosensitive assembly semi-finished product inan upper mold 101 or a lower mold 102 of a molding-die 100, wherein thesupporting member 25 is upwardly supporting the upper mold 101 toprevent the pressing surface 1011 of the upper mold 101 from beingpressed against the wire 24 during the closing and clamping process ofthe upper mold 101 and the lower mold 102; and

(D) adding a fluid molding material into a molding cavity 103 formedbetween the upper mold 101 and the lower mold 102 to form a molded base23 after the molding material is solidified and cured, wherein themolded base 23 comprises a molded body 232 and has a light window 231,wherein the molded body 232 covers an periphery area 223 of the circuitboard 22 and at least a part of the supporting member 25, wherein thephotosensitive area 212 of the photosensitive element of 21 faces thelight window 231.

According to another aspect of the present invention, the presentinvention provides a manufacturing method of a molded photosensitiveelement, wherein the manufacturing method comprises the steps of:

(a) mounting a photosensitive element 21 on a circuit board 22 andelectrically conducting the photosensitive element 21 and the circuitboard 22 through at least one set of wires 24;

(b) pre-fixing the photosensitive element 21 and the circuit board 22 bya supporting member 25 to obtain a molded photosensitive assemblysemi-finished product, wherein the supporting member 25 prevents a gapformed between the photosensitive element 21 and the circuit board 22;

(c) placing the molded photosensitive assembly semi-finished product inan upper mold 101 or a lower mold 102 of a molding-die 100 which formsan annular molding cavity 103 between the upper mold 101 and the lowermold 102 when the upper mold 101 and the lower mold 102 are closed andclamped; and

(d) adding a fluid molding material to the molding cavity 103 to formthe molded base 23 after the molding material is solidified and cured,wherein the molded base 23 comprises a molded body 232 and has a lightwindow 231, wherein at least a part of a periphery area 223 of thecircuit board 22 and at least a part of the supporting member 25 arecovered by the molded body 232, wherein the photosensitive area 212 ofthe photosensitive element 21 is positioned corresponding to the lightwindow 231.

According to another aspect of the present invention, the presentinvention provides a manufacturing method of a molded photosensitiveelement, wherein the manufacturing method comprises the steps of:

(A) electrically connecting to a chip connector 211 of a photosensitiveelement 21 and a circuit connector 221 of a circuit board 22 through aset of wires 24;

(B) placing the photosensitive element 21 and the circuit board 22 on anupper mold 101 or a lower mold 102 of a molding-die 100 which forms anannular molding cavity 103 between the upper mold 101 and the lower mold102 when the upper mold 101 and the lower mold 102 are closed andclamped;

(C) when a fluid molding material is added to the molding cavity 103,reducing the impact force towards the wires 24 generated by the moldingmaterial with a supporting member 25 positioned in the molding cavity103 to block the molding material; and

(D) forming a molded base 23 after the molding material is solidifiedand cured, wherein the molded base 23 comprises a molded body 232 andhas a light window 231, wherein a periphery area 223 of the circuitboard 22, the supporting member 25 and at least a part of thenon-photosensitive area 213 of the photosensitive element 21 are coveredby said molded body 232.

The present invention further provides an electronic device, wherein theelectronic device comprises an electronic device body 200 and at leastone camera module, wherein the at least one camera module is disposed onthe electronic device body 200 for obtaining graphics. The at least onecamera module further comprises at least one optical lens 10, at leastone molded photosensitive assembly 20 comprising a supporting member 25,a photosensitive element 21, a circuit board 22, a set of wires 24, anda molded base 23, wherein both ends of each of the wires 24 areconnected respectively to the chip connector 211 of the photosensitiveelement 21 and the board connector 221 of the circuit board 22, whereinthe molded base 23 comprises a molded body 232 and has a light window231, wherein during the molding process with a molding-die 100 to moldand form the molded body 232, the supporting member 25 prevents thepressing surface 1011 of the molding-die 100 from being pressed againstthe wires 24, wherein the photosensitive area 212 of the photosensitiveelement 21 is positioned corresponding to the light window 231, whereinthe at least one optical lens 10 is disposed in the respectivephotosensitive path of the photosensitive element 21.

According to FIGS. 15 to 23 of the drawings of the present invention, anarray camera module according to a preferred embodiment of the presentinvention is illustrated, wherein the array camera module comprises atleast two optical lenses 10A and a molded photosensitive assembly 20A,wherein the molded photosensitive assembly 20A further comprises atleast two photosensitive elements 21A, a circuit board 22A, a moldedbase 23A, and at least two sets of wires 24A.

Each of the photosensitive elements 21A comprises a set of chipconnectors 211A, a photosensitive area 212A, and a non-photosensitivearea 213A, wherein the photosensitive area 212A and thenon-photosensitive area 213A are integrally formed, wherein thephotosensitive area 212A is positioned in the middle of thephotosensitive element 21A and the non-photosensitive area 213A ispositioned at a periphery of the photosensitive element 21A, wherein thenon-photosensitive area 213A is arranged surrounding the photosensitivearea 212A and the chip connector 211A is disposed on thenon-photosensitive area 213A.

Correspondingly, the circuit board 22A comprises at least two sets ofcircuit connectors 221A, at least two flat chip mounting areas 222A anda periphery area 223A, wherein the periphery area 223A is integratedwith each of the chip mounting areas 222A. The periphery area 223A isformed around each of the chip mounting areas 222A, and the boardconnectors 221A are disposed in the periphery area 223A.

Each of the wires 24A respectively has a chip-connecting end 241A and acircuit-connecting end 242A, wherein each of the wires 24A is extendedin a curved manner between the chip-connecting end 241A and thecircuit-connecting end 242A.

The photosensitive elements 21A are respectively mounted on the chipmounting areas 222A of the circuit board 22A, wherein thechip-connecting end 241A of each of the wires 24A is connected to therespective chip connector 211A of the photosensitive element 21A and thecircuit-connecting end 242A of each of the wires 24A is connected to therespective circuit connector 221A of the circuit board 22A, wherein atleast the periphery area 223A of the molded base 23A is integrated withthe circuit board 22A to form the molded photosensitive assembly 20A,wherein the optical lenses 10A are respectively disposed inphotosensitive paths of the photosensitive elements 21A of the moldedphotosensitive assembly 20A. Light reflected by the object enters theinside of the array camera module from the optical lenses 10A to besubsequently received and photoelectrically converted by thephotosensitive areas 212A of the photosensitive elements 21Arespectively for obtaining image about the object.

In an example of the array camera module of the present invention, thechip connectors 211A of the photosensitive elements 21A and the circuitconnectors 221A of the circuit board 22A each can be an electricalconnection pad. That is, the chip connectors 211A of the photosensitiveelements 21A and the circuit connectors 221A of the circuit board 22Aeach may be in a disk shape for connecting the chip-connecting ends 241Aof the wires 24A to the chip connectors 211A of the photosensitiveelements 21A respectively and connecting the circuit-connecting ends242A of the wires 24A to the circuit connectors 221A of the circuitboard 22A respectively. In the array camera module of the presentinvention, in another example, the chip connectors 211A of thephotosensitive elements 21A and the circuit connectors 221A of thecircuit board 22A each may be in a spherical shape, wherein, forexample, solder paste or other solder material is spotted on thenon-photosensitive area 213A of each of the photosensitive elements 21Aand the periphery area 223A of the circuit board 22A to form the chipconnector 211A of each of the photosensitive elements 21A and each ofthe circuit connectors 221A of the circuit board 22A. Nevertheless, itwill be understood by one skilled in the art that the chip connectors211A of the photosensitive elements 21A or the circuit connectors 221Aof the circuit board 22A are not intended to limit the presentinvention. That is, in other examples, the chip connectors 211A of thephotosensitive elements 21A and the circuit connectors 221A of thecircuit board 22A may be in other shapes not being mentioned above.

The non-photosensitive area 213A of each of the photosensitive elements21A further has a chip-inner portion 2131A, a chip-connecting portion2132A and a chip-outer portion 2133A, wherein the chip connector 211A isdisposed on the chip-connecting portion 2132A and the chip-inner portion2131A is provided surrounding the photosensitive area 212A, wherein bothsides of the chip-connecting portion 2132A are respectively extended andconnected to the chip-inner portion 2131A and the chip-outer portion2133A. That is, from a position where the chip connector 211A isdisposed to a position of the periphery of the photosensitive area 212Aof the non-photosensitive area 213A is defined as the chip-inner portion2131A, and an area where the chip connector 211A is disposed on thenon-photosensitive area 213A is defined as the chip-connecting portion2132A, and an area from the position where the chip connector 211Adisposed on the non-photosensitive area 213A to the outer periphery ofthe photosensitive element 21A is defined as the chip-outer portion2132A. In other words, from the top view of the photosensitive element21A, in order from the outer periphery to the inside, the photosensitiveelement 21A is formed by the chip-outer portion 2133A, thechip-connecting portion 2132A, the chip-inner portion 2131A, and thephotosensitive area 212A.

Similarly, the periphery area 223A of the circuit board 22A has acircuit-inner portion 2231A, a circuit-connecting portion 2232A and acircuit-outer portion 2233A. The chip mounting area 222A is surroundedby the circuit-inner portion 2231A. The two sides of thecircuit-connecting portion 2232A are respectively extended and connectedto the circuit-inner portion 2231A and the circuit-outer portion 2233A.That is, an area from a position where the board connector 221A disposedon the periphery area 223A to a position of the periphery of the chipmounting area 222A is defined as the circuit-inner portion 2231A, and anarea of the periphery area 223A where the circuit connector 221Adisposed is defined as the circuit-connecting portion 2232A, and an areafrom the position where the circuit connector 221A disposed on theperiphery area 223A to the outer edge of the periphery area 223A isdefined as the circuit-outer portion 2233A. It is worth to mention that,in the embodiment of the array camera module of the present invention,the circuit board 22A is an integrated board. Preferably, the chipmounting areas 222A are respectively disposed on the sides of thecircuit board 22A so that the circuit board 22A is symmetrical.

Furthermore, the type of the wires 24A is not limited in the cameramodule of the present invention. For example, in one specific example,each of the wires 24A may be implemented as a gold wire to be connectedbetween the photosensitive element 21A and the circuit board 22A, sothat the optical signal after converting into an electrical signal inthe photosensitive element 21A can be further transmitted to the circuitboard 22A through the wires 24A. One skilled in the art will understandthat in other examples of the camera module, the wires 24A can also beimplemented as a silver wire, a copper wire, or the like, that thematerial can transfer the electrical signal between the photosensitiveelement 21A and the circuit board 22A.

The array camera module may be a fixed focus camera module or a zoomcamera module. For example, the array camera module may have an opticalzooming capability under the premise of controlling a height dimensionto improve the imaging quality of the array camera module. Specifically,in the example of the array camera module as shown in FIG. 21, the arraycamera module further comprises at least two drivers 30A, wherein theoptical lenses 10A are mounted on the drivers 30A respectively while thedrivers 30A are mounted on a top surface of the molded base 23A, suchthat each of the optical lenses 10A is respectively held on thephotosensitive path of the respective photosensitive element 21A of therespective molded photosensitive element. Each of the drivers 30A iselectrically connected to the circuit board 22A to enable each of thedrivers 30A to drive the respective optical lens 10A to movereciprocatedly in the photosensitive path of the respectivephotosensitive element 21A after the circuit board 22A transmits powerand control signals to the drivers 30A for adjusting the focal length ofthe array camera module. That is, the optical lenses 10A can be disposedon the drivers 30A in a drivable manner respectively.

It is worth mentioning that the type of the drivers 30A of the cameramodule is not limited in the present invention. For example, in onespecific example, the driver 30A can be implemented as a drive unit,such as a voice coil motor, to move the optical lens 10 along thephotosensitive path of the photosensitive element 21A, wherein thedriver 30A is capable of receiving electrical power and control signalsto be in an operational state.

Further according to FIG. 20, the array camera module further comprisesat least one filter member 40A. For example, in an illustrative exampleof the present invention, the array camera module may comprise only onefilter member 40A which is mounted on a top surface of the molded base23A, wherein different positions of the filter member 40A are positionedrespectively corresponding to the photosensitive paths of thephotosensitive elements 21A. In another illustrating example, the arraycamera module may comprise at least two filter members 40A, wherein eachof the filter members 40A is mounted on a top surface of the molded base23A such that each of the filter members 40A is positioned correspondingto the photosensitive path of one of the photosensitive elements 21A.That is, each of the photosensitive elements 21A, each of the filtermembers 40A and each of the optical lenses 10A of the array cameramodule are arranged and aligned in a one-to-one correspondence.

When the array camera module is used, the light reflected by an objectenters the inside of the respective camera module from the optical lens10A and is filtered by the filter member 40A to be received andphotoelectrically converted by the photosensitive element 21Acorrespondingly. That is, the filter member 40A can filter stray lightreflected by the object from the optical lens 10A into the interior ofthe camera module, such as an infrared light. In such a manner, theimaging quality of the camera module is improved.

In addition, the filter member 40A may be directly mounted on the topsurface of the molded base 23A, or the filter member 40A may beassembled by first mounting the filter member 40A to a supporting memberand then mounting the supporting member on the top surface of the moldedbase 23A, such that the size of the filter member 40A can be reduced toreduce the manufacturing cost of the array camera module.

One skilled in the art will understand that, in different examples ofthe camera module, the filter members 40A can be implemented withdifferent types. For example, the filter members 40A can be implementedas infrared cutoff filters, a full transmissive spectral filter, andother filters, or a combination of multiple types of filters. Forexample, the filter member 40A can be implemented as a combination of aninfrared cutoff filter and a full transmissive filter, i.e. the infraredcutoff filter and the full transmissive spectral filter being able to beselectively switched to be positioned on the photosensitive path of thephotosensitive element 21A. For example, in an environment where lightis sufficient during daytime, the infrared cutoff filter may be chosento position in the photosensitive path of the photosensitive element 21Ato filter infrared rays reflected by the object entering the cameramodule, and that when the camera module is used in a dark environment,such as a dark night, the full-transmission spectral filter can bechosen to position in the photosensitive path of the photosensitiveelement 21A to allow the infrared part of the light reflected by theobject entering the camera module.

According to FIGS. 22 and 23, the array camera module further comprisesa supporter 50A, wherein the supporter 50A has at least two mountingspaces 51A which are respectively communicated with two side portions ofthe supporter 50A. That is, each of the mounting spaces 51A may formsone passage. The drivers 30A are respectively mounted to the mountingspaces 51A of the supporter 50A to maintain the drivers 30A in a stablestate by the supporter 50A, thereby ensuring that the optical lenses 10Aare coaxially mounted on the drivers 30A to increase the intensity ofthe array camera module to further improve the imaging quality of thearray camera module.

Preferably, after the drivers 30A are mounted to the mounting spaces 51Aof the supporter 50A respectively, a plurality of fillers is filledbetween the inner walls of the supporter 50A and the outer casings ofthe drivers 30A, so that each of the drivers 30A does not sway afterbeing mounted to the respective mounting space 51A of the supporter 50A.More preferably, the fillers filled between the outer casings of thedrivers 30A and the inner walls of the supporter 50A may be a glue.

The molded photosensitive assembly 20A further comprises at least onesupporting member 25A to protect the wires 24A and the photosensitiveelements 21A during the molding process. In an example of the invention,the number of supporting members 25A can be implemented as a minimum oftwo. Preferably, the number of the supporting members 25A is equal towith the number of the photosensitive elements 21A, and the supportingmembers 25A are respectively provided to cover the non-photosensitiveareas 213A of the photosensitive elements 21A before the molded base 23Ais molded. After the molded base 23A is molded, the molded base 23Acovers the periphery area 223A of the circuit board 22A, a part of thenon-photosensitive areas 213A of photosensitive elements 21A, and a partof the supporting member 25A to form the molded photosensitive assembly20A. The supporting member 25A can effectively improve the product yieldof the array camera module and improve the imaging quality of the arraycamera module. In other examples of the invention, the number ofsupporting members 25A can also be embodied as one, which will befurther explained later.

Each of the supporting members 25A comprises a frame-shaped supportingbody 251A and has a through hole 252A, wherein the supporting body 251Ais provided to cover at least a part of the non-photosensitive area 213Aof the respective photosensitive element 21A. The photosensitive area212A of each of the photosensitive elements 21A is positionedcorresponding to the through hole 252A of the respective supportingmember 25A. Preferably, the supporting body 251A covers at least a partof the chip-inner portion 2131A, the chip-connecting portion 2132A, andat least a part of the chip-outer portion 2133 of the non-photosensitivearea 213A of the photosensitive element 21A. Furthermore, the supportingbody 251A has a top surface 2501A, an inner surface 2502A and an outersurface 2503A, wherein both sides of the top surface 2501A are extendedinwardly and outwardly to be connected to the inner surface 2502A andthe outer surface 2503A respectively. In the present invention, the sideof the supporting body 251A facing the photosensitive area 212A isdefined as the inner surface 2502A of the supporting body 251A, and theside of the periphery area 223A facing the circuit board 22A is definedas the outer surface 2503A of the supporting body 251A. In thisembodiment, the molded base 23A covers the outer surface 2503A and atleast a part of the top surface 2501A of the supporting body 251A aftermolded.

In addition, the molded photosensitive assembly 20A of the camera modulefurther comprises a plurality of electronic components 26A, wherein eachof the electronic components 26A can be mounted on the periphery area223A of the circuit board 22A by a process such as SMT (Surface MountTechnology). Preferably, each of the electronic components 26A ismounted on the circuit-outer portion 2233A of the periphery area 223A.The photosensitive element 21A and the electronic components 26A may bemounted on the same side or opposite sides of the circuit board 22A. Forexample, in one specific example, the photosensitive element 21A and theelectronic components 26A are mounted on the same side of the circuitboard 22A, wherein the photosensitive element 21A is mounted on the chipmounting area 222A of the circuit board 22A and the electroniccomponents 26A are mounted on the periphery area 223A of the circuitboard 22A. After the molded base 23A is integrally molded on the circuitboard 22A, the electronic components 26A are covered by the molded base23A and isolated the spaces between the adjacent electronic components26A. Even a distance between any two of the adjacent electroniccomponents 26A are relatively close, the molded base 23A can prevent theadjacent electronic components 26A from contacting or interfering witheach other by isolating the adjacent electronic components 26A andisolating the electronic components 26A with the photosensitive element21A in the camera module of the present invention. Since the electroniccomponents 26A are covered by the molded base 23A, it can also avoidelectronic contaminants being gathered on the surface of the electroniccomponents 226A and contaminating the photosensitive area 212A of thephotosensitive element 21A. Accordingly, the size of the camera moduleis reduced and the imaging quality of the camera module is improved.That is, more the electronic components 26A can be mounted on a smallarea of the circuit board 2A of the camera module of the presentinvention by covering the electronic components 26A by the molded base23A. It is worth mentioning that the types of the electronic components26A include, but are not limited to, resistors, capacitors, drivingdevices, and the like.

According to FIG. 15 to FIG. 23, although the array camera module isimplemented as a dual lens camera module as an example in the followingdescription of the present invention, which the features and advantagesof the array camera module of the present invention are furtherclarified, one skilled in the art will understand that, in analternative mode of the embodiment of the array camera module of thepresent invention shown in FIG. 24, the array camera module may alsocomprise more optical lenses 10A.

The manufacturing method of the molded photosensitive assembly 20A ofthe array camera module is illustrated in FIGS. 15 to 19 and themanufacturing method of the array camera module with the moldedphotosensitive assembly 20A is further illustrated in FIGS. 20 to 22.

According to FIG. 15, two photosensitive elements 21A are respectivelymounted on two chip mounting areas 222A of the circuit board 22A in aone-to-one manner correspondingly, wherein a set of the chip connectors211A of each of the photosensitive elements 21A and two sets of theboard connectors 222 of the circuit board 22A are respectively connectedby a set of the wires 24A. Each of the electronic components 26A ismounted on the periphery area 233 of the circuit board 22A. Preferably,the electronic components 26A are mounted on the circuit-outer portion2233A of the periphery area 223A. More preferably, the electroniccomponents 26A are spaced apart from each other such that each of theelectronic components 26A does not interfere with another electroniccomponent 26A after the array camera module is manufactured.

Limited to the wire bonding process of the wire 24A and thecharacteristics of each of the wires 24A itself, after thechip-connecting end 241A and the circuit-connecting end 242A of each ofthe wires 24A are respectively connected to the chip connector 211A ofthe photosensitive element 21A and the board connector 221A of thecircuit board 22A, each of the wires 24A protrudes in an upwarddirection and forms a projection on the upper surface of thephotosensitive element 21A. One skilled in the art will understand thatmaintaining each of the wires 24A in an initial state during themanufacture and the use of the array camera module has advantageous forensuring good electrical power of the wires 24A which guarantees theimaging quality of the array camera module.

According to FIG. 16, each of the supporting bodies 251A is provided tocover at least a part of the non-photosensitive areas 213A of each ofthe photosensitive elements 21A, wherein the photosensitive area 212A ofeach of the photosensitive elements 21A is positioned corresponding tothe through hole 252A of each of the supporting members 25A, so thateach of the supporting members 25A, each of the photosensitive elements21A, the circuit board 22A, and each of the sets of wires 24A form amolded photosensitive assembly semi-finished product. In an example ofthe array camera module of the present invention, each of the supportingbodies 251A covers at least a part of the chip-outer portion 2133A, thechip-connecting portion 2132A, and at least part of the chip-innerportion 2133 of the photosensitive element 21A. That is, each of thesupporting bodies 251A can cover the connection position of thechip-connecting end 241A of the wires 24A and the chip connector 211A ofthe photosensitive element 21A during the molding process. Each of thesupporting bodies 251A can prevent the connection position of thechip-connecting end 241A of the wires 24A and the chip connector 211A ofthe respective photosensitive element 21A from coming into contact withthe molding material of the molded base 23A, thereby avoiding thechip-connecting end 241A of the wire 24A being detached from the chipconnector 211A of the photosensitive element 21A.

It can be understood that each of the supporting bodies 251A covers theconnection position of the chip-connecting end 241A of the wire 24A andthe chip connector 211A of the respective photosensitive element 21A, sothat the supporting bodies 251A isolate the chip-connecting ends 241A ofthe wires 24A and the chip connectors 211A of the photosensitiveelements 21A from the molding material, thereby preventing the moldingmaterial from causing the chip-connecting end 241A of each of the wires24A deformed or detached from the respective chip connector 211A duringa molding process.

In addition, the supporting bodies 251A cover a part of each of thewires 24A, thereby pre-fixing each of the wires 24A by the supportingbodies 251A to prevent the wires 24A being deformed during a moldingprocess. The supporting bodies 251A can prevent, in particular, theshort circuit caused by the mutual contact of the wires 24A due todeformation to ensure the yield of the array camera module after beingmanufactured.

In one embodiment, the supporting body 251A may be formed by disposing aglue in the non-photosensitive area 213A of the photosensitive element21A, wherein after the glue disposed in the non-photosensitive area 213Aof the photosensitive element 21A is cured, the cured glue forms thesupporting body 251A having a predetermined elasticity. After thesupporting body 251A is formed, the inner surface 2502A of thesupporting body 251A forms the through hole 252A and the photosensitivearea 212A of the photosensitive element 21A is arranged corresponding tothe through hole 252A. In addition, the supporting body 251A formed bythe cured glue may also have a viscosity for subsequently adheringcontaminants, such as dust, thereby preventing the contaminants fromcontaminating the photosensitive area 212A of the photosensitive element21A and causing stain point in the photosensitive area 212A of thephotosensitive element 21A, so as to further ensure the image quality ofthe camera module. For example, the supporting body 251A is disposedbetween the photosensitive area 212A of the photosensitive element 21Aand the electronic components 26A, thereby preventing contamination bycontaminants, such as the solder powder generated when the electroniccomponents 26A are mounted on the circuit board 22A, from contaminatingthe photosensitive area 212A of the photosensitive element 21A in a waythat the solder powder may be adhered by the supporting body 251A.

Preferably, the supporting body 251A can be formed after the glue in gelstate applied to the non-photosensitive area 213A of the photosensitiveelement 21A is cured so as to prevent any glue covered on thenon-photosensitive area 213A of the photosensitive element 21A fromflowing to contaminate the photosensitive area 212A of thephotosensitive element 21A. In other words, the glue for forming thesupporting body 251A should have good plasticity and self-settingproperties before cured, so that the glue will not deform duringapplying and curing on the non-photosensitive area 213A of thephotosensitive element 21A. One skilled in the art will understand thatafter the chip-connecting end 241A of each of the wires 24A is disposedto be connected to the chip connector 211A of the photosensitive element21A, after the glue in flowable gel state is applied to thenon-photosensitive area 213A of the photosensitive element 21A, thechip-connecting ends 241A of the wires 24A can be covered, and thesupporting body 251A covering the wires 24A is formed after the glue iscured for avoiding the wires 24A being damaged during the molding of thesupporting body 251A.

According to FIG. 17A, during the molding process, the molding materialis solidified and cured in a molding-die 100A to form the molded base23A which is at least integrally molded on the circuit board 22A, suchthat by means of the method of the invention, the size of the cameramodule can be reduced and the assembly error of the camera module canalso be reduced too, thereby making the structure of the camera modulemore compact and improving the imaging quality of the camera module.

Specifically, the molding-die 100A comprises an upper mold 101A and alower mold 102A, wherein at least one of the upper mold 101A and thelower mold 102A can be moved to operate and close the upper mold 101Aand the lower mold 102A in a mold clamping operation, wherein at leastone molding cavity 103A is formed between the upper mold 101A and thelower mold 102A, wherein the molding material is filled and added to themolding cavity 103A to form the molded base 23A after curing.

For example, in one embodiment, the lower mold 102A is generally fixedin stationary position, and the upper mold 101A is arranged movable inrelative to the lower mold 102A along one or more guiding rods, whereinthe upper and lower molds 101A, 102A can be closed and clamped when theupper mold 101A is moved towards the lower molds 102A, and the upper andlower modes 101A, 102A can be demolded when the upper mold 101A is movedaway from the lower mold 102A, wherein the molding cavity 103A is formedbetween the upper mold 101A and the lower mold 102A when the upper andlower molds 101A, 102A are closed and clamped. Or, in another example,the upper mold 101A is fixed in stationary position, and the lower mold102A can be arranged movable in relative to the upper mold 101A alongthe one or more guiding rods, wherein the upper and lower molds 101,102A can be closed and clamped when the lower mold 102A is moved towardthe upper mold 101A, and the upper and lower molds 101A, 102A can bedemolded when the lower mold 102A is moved away from the upper mold101A, wherein the molding cavity 103A is formed between the lower mold102A and the upper mold 101A when the upper and lower molds 101A, 102Aare closed and clamped.

After the molded photosensitive assembly semi-finished product is placedon the lower mold 102A or, alternatively, on the upper mold 101A, theupper mold 101A and the lower mold 102A are operated to being clampedand closed to make the molded photosensitive assembly semi-finishedproduct, so that the molded photosensitive assembly semi-finishedproduct is formed in each of the molding cavities 103A formed betweenthe upper mold 101A and the lower mold 102A, wherein the pressingsurface 1011A of the upper mold 101A is pressed against the top surface2501A of the respective supporting body 251A. The upper mold 101A isupwardly supported by the supporting body 251A for preventing thepressing surface 1011A of the upper mold 101A from directly pressing onthe wires 24A to protect the wires 24A from being damaged during themolding process, wherein at least the periphery area 223A of the circuitboard 22A in the molded photosensitive assembly semi-finished product ispositioned corresponding to the molding cavity 103A.

It is worth to mention that each of the mold cavities 103A is in anannular shape, and that the adjacent mold cavities 103A are communicatedwith each other so that after the molding material added in the moldingcavities 103A is cured, the molded base 23A is formed.

Preferably, the supporting body 251A has a predetermined elasticity sothat when the molding-die 100A is closed and clamped for molding, theinstantaneous impact force generated by the pressing surface 1011A ofthe upper mold 101A of the molding-die 100A while contacting with thetop surface 2501A of the supporting body 251A is absorbed by thesupporting body 251A to prevent the impact force from being furthertransmitted to the photosensitive element 21A, thereby preventing thephotosensitive element 21A from being damaged or avoiding thephotosensitive element 21A being displaced relative to the circuit board22A due to the impact force. One skilled in the art would understandthat the supporting body 251A absorbs the impact force to prevent theimpact force from being further transmitted to the photosensitiveelement 21A, and also ensures that the flatness of the photosensitiveelement 21A mounted on the circuit board 22A is not affected, therebyensuring the image quality of the camera module.

Preferably, in one example, the height of the supporting body 251A maybe embodied to be higher than the height at which the wires 24Aprotruded upwards, so that during the closing and clamping operation ofthe molding-die 100A, the pressing surface 1011A of the upper mold 101Acan be directly pressed against the top surface 2501A of the supportingbody 251A to prevent the pressing surface 1011A of the upper mold 101Afrom being pressed against the wires 24A by means of the upwardsupporting of the upper mold 101A by the top surface 2501A of thesupporting body 251A, i.e. a safety distance being provided between thewires 24A and the pressing surface 1011A of the upper mold 101A. Inanother example, the height of the supporting body 251A is equal to theheight at which the wire 24A protruded upwards, so that when themolding-die 100A is closed and clamped, the pressing surface 1011A ofthe upper mold 101A may be in contact with the wires 24A but thepressing surface 1011A of the upper mold 101A will still not be pressingagainst the wires 24A.

In addition, the supporting body 251A has a predetermined elasticityand, after the closing and clamping of the upper and lower molds 101A,102A, the pressing surface 1011A of the upper mold 101A is pressedagainst the top surface 2501A of the supporting body 251A. The topsurface 2501A of the supporting body 251A is slightly deformed forpreventing generation any gap between the pressing surface 1011A of theupper mold 101A and the top surface 2501A of the supporting body 251A.That is, the pressing surface 1011A of the upper mold 101A and the topsurface 2501A of the supporting body 251A are closely fitted, so thatthe photosensitive area 212A of the photosensitive element 21A ispositioned corresponding to the through hole 252A of the supportingmember 25A in a sealed environment, wherein the molding material wouldnot enter the sealing environment during the molding process to preventthe molding material from contaminating the photosensitive area 212A ofthe photosensitive element 21A. It is worth mentioning that thesupporting body 251A is preferred to have a Shore hardness ranging fromA50 to A80 and an elastic modulus ranging from 0.1 GPa to 1 GPa.

In addition, during the molding process, the pressing surface 1011A ofthe upper mold 101A and the top surface 2501A of the supporting body251A are preferred closely fitted to prevent the molding material fromentering the sealing environment, thereby after the molded base 23A isformed, the “flashing” can be avoided to ensure the product yield of thearray camera module.

FIG. 17B illustrates an alternative mode of the embodiment of the moldedphotosensitive assembly 20A of the array camera module of the presentinvention according to this method, wherein the supporting body 251A canalso be supported by a hard material. That is, when the pressing surface1011A of the upper mold 101A is pressed against the top surface 2501A ofthe supporting body 251A, the supporting body 251A may not be deformedfor ensuring the goodness of the wires 24A. The electrical propertiesfurther ensure the subsequent method yield of the camera module and theimaging quality of the camera module. It is worth mentioning that thesupporting body 251A is preferred to have a Shore hardness greater thanD70 and a modulus of elasticity greater than 1 Fpa.

The molding-die 100A further comprises a covering film 104A overlappedlydisposed on the pressing surface 1011A of the upper mold 101A, so thatwhen the molding-die 100A is closing and clamped during the moldingprocess, the covering film 104A is positioned between the pressingsurface 1011A of the upper mold 101A and the top surface 2501A of thesupporting body 251A, such that the photosensitive area 212A of thephotosensitive element 21A is maintained in the sealed environment.

It is worth mentioning that the covering film 104A positioned on theupper mold 101A and the top surface 2501A of the supporting body 251Acan prevent a gap being formed between the pressing surface 1011A of theupper mold 101A and the top surface 2501A of the supporting body 251A.On the other hand, the covering film 104A can absorb the impact forcegenerated from the pressing surface 1011A of the upper mold 101Apressing the top surface 2501A of the supporting body 251A that preventsthe impact force damaging the photosensitive element 21A, the circuitboard 22A, and the wire 24A.

In addition, the arrangement of the covering film 104A also facilitatesthe demolding of the molding-die 100A after the molded base 23A ismolded.

According to FIG. 18, after the molten molding material is added to eachof the molding cavities 103A of the molding-die 100A, the moldingmaterial is preferred to completely fill the entire molding cavity 103A,wherein at least a part of the supporting body 251A formed on thenon-photosensitive area 213A of the photosensitive element 21A canprevent the molding material from entering the sealed environment.Specifically, the supporting body 251A can prevent the molding materialfrom entering the sealing environment through the connection position ofthe supporting body 251A and the non-photosensitive area 213A of thephotosensitive element 21A, and can also prevent the molding material toenter the sealed environment by a connection position of the top surface2501A of the supporting body 251A and the pressing surface 1011A of theupper mold 101A.

It is worth mentioning that the molding material in fluid form accordingto the present invention may be a liquid material or a solid particulatematerial or a mixed material of liquid and solid particles, it can beunderstood that whether the molding material is implemented as a liquidmaterial or implemented as a solid particulate material or as a liquidand solid particulate mixed material, after being added to the moldingcavity 103A of the molding-die 100A, the molding material will besolidified and cured to form the molded base 23A. For example, in thisspecific example of the invention, the flowable molding material isembodied as a liquid thermosetting material, wherein the moldingmaterial added and filled in the molding cavity 103A of the molding-die100A will be solidified and cured to form the molded base 23A. It isworth to mention that, how the molding material added in the moldingcavity 103A of the molding-die 100A is solidified and cured should notlimit the scope of the present invention.

According to FIG. 19, when the molding material is added and filled inthe molding cavity 103A, the supporting body 251A prevents the moldingmaterial from entering the photosensitive area 212A of thephotosensitive element 21A, so that after the molded base 23A is formedby solidifying and curing of the molding material, the molded base 23Afurther forms at least two light windows 231A therein. The light windows231A are positioned corresponding to the photosensitive areas 212A andthe photosensitive elements 21A respectively. The optical lens 10A isprovided with a light path for the optical lens 10A and thephotosensitive element 21A through the light window 231A. The moldingmaterial forms a molded body 232A of the molded base 23A aftersolidifying and curing. And, in this embodiment, the molded body 232Acovers the periphery area 223A of the circuit board 22A and at least apart of the outer surface 2503A and the top surface 2501A of thesupporting body 251A to form the molded photosensitive assembly 20A. Inother words, the molded base 23A comprises one of the molded bodies 232Aand has at least two of the light windows 231A, and that the filtermember 40A and the driver 30A are subsequently mounted on the topsurface of the molded body 232A while the optical lens 10A mounted onthe driver 30A is held in the photosensitive path of the respectivephotosensitive element 21A.

It is worth mentioning that the molded body 232A integrally formed withthe periphery area 223A of the circuit board 22A further covers theelectronic components 26A for isolating the adjacent electroniccomponents 26A by the molded body 232A and isolating the electroniccomponents 26A and the photosensitive element 21A, such that even thoughthe distance between two adjacent electronic components 26A isrelatively close, the molded body 232A can prevent the adjacentelectronic components 26A from contacting or interfering with eachother, and that the molded body 232A can also prevent contaminantsgenerated by the electronic components 26A from contaminating thephotosensitive area 212A of the photosensitive element 21A to furtherimprove the imaging quality of the camera module.

In addition, in the present invention, since each of the electroniccomponents 26A is covered by the molded body 232A to prevent interferingwith the adjacent electronic components 26A, the distance between everytwo adjacent electronic components 26A can be further reduced.Therefore, even if the circuit board 22A having a smaller attachingarea, a larger number of the electronic components 26A can be mountedthereon, which improves the imaging quality of the array camera modulewith a size of the array camera module as small as possible. Moreover,in the present invention, the electronic components 26A and thephotosensitive element 21A are isolated by the material of the moldedbody 232A which covers all the electronic components 26A, so that eventhe distance between the photosensitive element 21A and the electroniccomponents 26A is relatively short, the photosensitive element 21A andthe electronic components 26A do not interfere with each other.Similarly, the printed circuit board 22A with a smaller area can bemounted with a larger photosensitive element 21A with largerphotosensitive area 212A thereon to improve the imaging quality of thearray camera module.

Preferably, the molded body 232A has good heat insulation so that heatgenerated by the photosensitive element 21A during photoelectricconversion is insulated from transmitting to the electronic components26A during the use of the array camera module, which ensures thereliability of the array camera module during operation.

According to FIG. 20 and FIG. 21, the filter member 40A is mounted onthe top surface of the molded base 23A such that the light window 231Aof the molded base 23A is sealed by the filter member 40A. Therefore,the light from the optical lens entering the inside of the camera modulecan be further filtered by the filter member 40A to improve the imagingquality of the camera module. As introduced above, although the featuresand advantages of the array camera module of the present invention areillustrated by taking two filter members 40A as an example in FIG. 20,one skilled in the art can understand that the array camera module mayalso comprise only one filter member 40A. After the filter member 40A ismounted on the top surface of the mold base 23A, the filter member 40Asimultaneously covers the light window 231A in such a manner that thephotosensitive area 212A of each of the photosensitive elements 21A maybe positioned corresponding to different positions of the filter member40A respectively.

Furthermore, the top surface of the molded base 23A comprises at leasttwo inner surfaces 233A and one outer surface 234A, wherein in oneexample, the inner surfaces 233A and the outer surface 234A are on thesame plane. The top surface of the molded base 23A is formed into acomplete whole plane, wherein the filter members 40A are mounted on theinner surfaces 233A of the molded base 23A respectively, wherein thelight windows 231A are enclosed by the filter members 40A respectivelyand the drivers 30 are mounted on different positions of the outersurface 234A of the molded base 23A to enable the filter member 40Apositioned between the optical lens 10A mounted on the driver 30A andthe photosensitive area 212A of the photosensitive element 21A. Inanother example, the inner surfaces 233A are positioned at a lower planethan the outer surface 234A to form at least two recesses 235A of themolded base 23A. The top surface of the molded base 23A has a steppedshape, and the filter members 40A mounted on the inner surface 233A ofthe molded base 23A are respectively positioned in the recesses 235A ofthe molded base 23A.

According to FIG. 22, the drivers 30A of the array camera module aremounted in the mounting spaces 51A of the supporter 50A respectively,and then a glue as a filler is filled between the outer casings of thedrivers 30A and the inner wall of the supporter 50A to ensure that eachof the drivers 30A does not sway when the array camera module is mountedor used, thereby ensuring the optical lenses 10A being coaxially mountedon the drivers 30A by the supporters 50A respectively, and thesupporters 50A can also strengthen the structure of the array cameramodule to improve the stability of the array camera module. It is worthto mention that, in one embodiment, only the driver 30A may be disposedin the mounting space 51A of the supporter 50A such that the supporter50A covers at least a part of the driver 30A. In another embodiment, thesupporter 50A may also further cover at least a part of the molded base23A, wherein the invention should not be limited herewith.

FIG. 25 illustrates a second alternative mode of the embodiment of thearray camera module. Unlike the above embodying mode of the preferredembodiment of the present invention, the array camera module comprisestwo circuit boards 22A, each of which comprises one chip mounting area222A and one periphery area 223A, wherein the photosensitive elements21A are respectively mounted on the chip mounting areas 222A the circuitboards 22A. During the molding process for forming the molded base 23A,the molded body 232A of the molded base 23A and at least a part of theperiphery area 223A of each of the circuit boards 22A are integrallyconnected. That is, in this alternative mode of the embodiment of thearray camera module of the present invention, the circuit boards 22A areseparable type circuit boards.

FIG. 26 illustrates a third alternative mode of the embodiment of thearray camera module, wherein the array camera module comprises at leastone lens-barrel 60A and at least one driver 30A, wherein the lens-barrel60A is extended integrally on the top surface of the molded base 23A andthe driver 30A is mounted on the top surface of the molded base 23A,wherein the lens-barrel 60A and the driver 30A are respectively adaptedto mount the optical lens 10A thereon. Preferably, the lens-barrel 60Aand the molded base 23A are integrally molded by a molding process. Forexample, when the array camera module is implemented as a dual lenscamera module, the array camera module comprises only one driver 30A andone lens barrel 60A.

FIG. 27A illustrates a fourth alternative mode of the embodiment of thearray camera module, wherein the array camera module comprises at leasttwo lens barrels 60A, wherein each of the lens barrels 60A is integrallyextended from the top surface of the molded base 23, and the opticallenses 10A are mounted on the lens barrels 60A respectively. Preferably,the lens barrels 60A and the molded base 23A are molded integrallyduring the molding process.

FIG. 27B illustrates a fifth alternative mode of the embodiment of thearray camera module, wherein the array camera module comprises at leasttwo lens barrels 60A. After the molded photosensitive assembly 20A ismolded, the lens barrels 60A are respectively mounted on differentpositions on the top surface of the molded base 23A, and the opticallenses 10A are respectively mounted on the lens barrels 60A, so that theoptical lenses 10A are held in the photosensitive paths of thephotosensitive elements 21A respectively. It should be mentioned thateach of the lens-barrels 60A may be a threaded lens barrel or anunthreaded lens barrel, and the present invention should not be limitedto the types of lens-barrel.

In addition, two embodiments of the array camera module as shown in FIG.27A and FIG. 27B are exemplary descriptions, and in other examples, atleast one of the lens barrels 60A may be integrally molded with themolded base 23A by the molding process, and the other lens-barrel 60Acan be mounted on the top surface of the molded base 23A. For example,when the array camera module is embodied as a two-lens camera module,one of the lens barrels 60A may be integrally molded with the moldedbase 23A by the molding process, and the other lens barrel 60A may bemounted on the top surface of the molded base 23A for focus adjusting.

FIG. 28A illustrates an alternative mode of the embodiment of the moldedphotosensitive assembly 20A of the array camera module, wherein thesupporting body 251A covers a part of the periphery area 223A of thecircuit board 22A, the chip-inner portion 2131A, the chip-connectingportion 2132A, and at least a part of the chip-outer portion 2133A ofthe non-photosensitive area 213A of the photosensitive element 21A toform the molded base 23A. After molding, a part of the periphery area223A of the circuit board 22A and the outer surface 2503A and at least apart of the top surface 2501A of the supporting body 251A are covered bythe molded body 232A of the molded base 23A.

It is worth mentioning that the supporting body 251A can cover all ofthe wires 24A to fix each of the wires 24A before the molded base 23A isformed, wherein during the molding process, the supporting body 251A canprevent the wires 24A from contacting with the molding material, therebypreventing the impact force generated by the molding material added andfilled in the molding cavity 103A from causing deformation of the wires24A. In addition, the supporting body 251A may also have a good heatinsulating property, so that after the molding material is added to themolding cavity 103A, heat is insulated from transmitting through thesupporting body 251A during the curing of the molding material to thewires 24A so as to further ensure good electrical conductivity of thewires 24A.

Furthermore, the supporting body 251A is simultaneously formed on a partof the periphery area 223A of the circuit board 22A and at least a partof the non-photosensitive area 213A of the photosensitive element 21Afor fixing the photosensitive element 21A and with the circuit board22A, so that the supporting body 251A can prevent the photosensitiveelement 21A and the circuit board 22A from being displaced during theclosing and clamping process of the molding process. The flatness of thephotosensitive element 21A is also ensured.

Furthermore, the supporting body 251A is simultaneously formed on a partof the periphery area 223A of the circuit board 22A and at least a partof the non-photosensitive area 213A of the photosensitive element 21A toprevent any gap formed between the photosensitive element 21A and themounting position of the circuit board 22A by means of the supportingbody 251A, so that the supporting body 251A can prevent the moldingmaterial from entering the photosensitive element 21A between thecircuit boards 22A during the molding process. The flatness of thephotosensitive element 21A is ensured, thereby further improving theimaging quality of the array camera module.

FIG. 28B illustrates another alternative mode of the embodiment of themolded photosensitive assembly 20A of the array camera module of thepresent invention, wherein the supporting body 251A covers a part of theperiphery area 223A of the circuit board 22A, at least a part of thechip-connecting portion 2132A and the chip-outer portion 2133A of thenon-photosensitive area 213A of the photosensitive element 21A to formthe molded base 23A. After molding, a part of the periphery area 223A ofthe circuit board 22A and the outer surface 2503A and at least a part ofthe top surface 2501A of the supporting body 251A are covered by themolded body 232A of the molded base 23A.

Similarly, FIG. 28C illustrates another alternative mode of theembodiment of the molded photosensitive assembly 20A of the array cameramodule of the present invention, wherein the supporting body 251A coversa part of the periphery area 223A of the circuit board 22A and a part ofthe chip-inner portion 2131A of the non-photosensitive area 213A of thephotosensitive element 21A to form the molded base 23A. After molding, apart of the periphery area 223A of the circuit board 22A and the outersurface 2503A and at least a part of the top surface 2501A of thesupporting body 251A are covered by the molded body 232A of the moldedbase 23A.

One skilled in the art should understand that, in the two embodiments ofthe molded photosensitive assembly 20A as shown in FIG. 28B and FIG.28C, the supporting body 251A may not cover the chip-inner portion 2131Aof the non-photosensitive area 213A of the photosensitive element 21A,wherein the chip-inner portion 2131A of the photosensitive element 21Acan be designed in a smaller size, such that the photosensitive element21A having the same size can receive more light, thereby the imagingquality of the array camera module can be improved under controlling thesize of the array camera module.

In addition, the supporting body 251A may not cover the chip-innerportion 2131A of the photosensitive element 21A, so that before the glueis applied and cured on a part of the non-photosensitive area 213A ofthe photosensitive element 21A to form the supporting body 251A, theglue flows away from the photosensitive area 212A of the photosensitiveelement 21A, so that even if the glue flows, the glue only flows to thechip-inner portion 2131A of the photosensitive element 21A, but not tothe photosensitive area 212A of the photosensitive element 21A, therebypreventing the photosensitive area 212A of the photosensitive element21A from being contaminated. That is, the chip-inner portion 2131A canmaintain a safe distance between the supporting body 251A and thephotosensitive area 212A of the photosensitive element 21A.

FIG. 28D illustrates another alternative mode of the embodiment of themolded photosensitive assembly 20A of the array camera module of thepresent invention, wherein the supporting body 251A covers a part of theperiphery area 223A of the circuit board 22A to form the molded base23A. After molding, a part of the periphery area 223A of the circuitboard 22A and the outer surface 2503A and at least part of the topsurface 2501A of the supporting body 251A are covered by the molded body232A of the molded base 23A.

FIG. 28E illustrates another alternative mode of the embodiment of themolded photosensitive assembly 20A of the array camera module of thepresent invention, wherein the number of the supporting member 25A isone. The supporting body 251A of the supporting member 25A covers a partof the periphery area 223A of the circuit board 22A such that thephotosensitive areas 212A of the photosensitive elements 21A arearranged simultaneously corresponding to the same through hole 252A ofthe supporting member 25A. After the molded base 23A is molded, anotherportion of the periphery area 223A of the circuit board 22A and theouter surface 2503A and at least a part of the top surface 2501A of thesupporting body 251A are covered by the molded body 232A of the moldedbase 23A.

In the two embodiments of the molded photosensitive assembly 20A of thearray camera module of the present invention as shown in FIGS. 28D and28E, the supporting body 251A may not cover any position of thenon-photosensitive area 213A of the photosensitive element 21A. Thesupporting body 251A is arranged away from the photosensitive area 212Aof the photosensitive element 21A, thereby avoiding any glue or othermaterial forming the supporting body 251A to contaminate thephotosensitive area 212A of the photosensitive element 21A duringmolding. Preferably, in the two embodiments of the molded photosensitiveassembly 20A of the array camera module of the present invention asshown in FIGS. 28D and 28E, the supporting body 251A may coverconnection positions of the wires 24A and the circuit connector 221A ofthe circuit board 22A, so that the supporting body 251A can prevent themolding material from contacting the connection position of each of thewires 24A and the circuit board 22A during the molding process toprevent the wires 24A from being deformed and detached.

One skilled in the art would understand that, although a plurality ofembodiments of the molded photosensitive assembly 20A of the arraycamera module is illustrated in FIGS. 28A to 28E, they are merelyexamples of features and advantages of the invention. The supportingbody 251A may cover the circuit-connecting portion 2232A, thecircuit-inner portion 2231A and the circuit-outer portion 2233A of thecircuit board 22A, and at least a part of at least one of the chip-outerportion 2133A, the chip-connecting portion 2132A and the chip-innerportion 2131A of the photosensitive element 21A. For example, thesupporting body 251A may cover a part of the circuit-connecting portion2232A of the circuit board 22A or all the circuit-connecting portions2232A. Therefore, although the position where the supporting body 251Ais covered by the covering body is not described in the followingdescription of the present invention, one skilled in the art canunderstand that the scope of the array camera module of the presentinvention can include that the supporting body 251A is provided to coverany position and a combination of any position of the periphery area223A of the circuit board 22A and the non-photosensitive area 213A ofthe photosensitive element 21A.

In addition, FIG. 29 illustrates another alternative mode of theembodiment of the molded photosensitive assembly 20A of the array cameramodule of the present invention, wherein the pressing surface 1011A ofthe upper mold 101A and at least a part of the top surface 2501A of thesupporting body 251A are contacted to covering at least a part of thetop surface 2501A of the supporting body 251A by the molded body 232Aafter the molded base 23A is formed.

It is worth to mention that, according to an embodiment of theinvention, the array camera module comprises at least two optical lenses10A and one molded photosensitive assembly 20A, wherein the opticallenses 10A are respectively set on the photosensitive paths of thephotosensitive elements 21A of the molded photosensitive assembly 20A asdescribed above in the present invention. In another embodiment, asshown in FIG. 30, the array camera module may also comprise at least twooptical lenses 10A, one molded photosensitive element 20A and at leastone additional photosensitive element 21B, wherein each of theadditional photosensitive elements 21B is mounted on the circuit board22A of the molded photosensitive assembly 20A, and the optical lenses10A are provided along the photosensitive path of the at least oneadditional photosensitive element 21B and the photosensitive element 21Aof the molded photosensitive element 20A respectively to form the arraycamera module. In addition, the array camera module further comprises atleast one additional supporter 27B and at least one additional driver30B or at least one additional lens-barrel 60B, wherein the at least oneadditional supporter 27B is mounted on the circuit board 22A of themolded photosensitive unit 20A. The at least one additional driver 30Bor the at least one additional lens-barrel 60B is mounted on the circuitboard 22A, and each of the optical lenses 10A is mounted on the driver30A or lens-barrel 60A or the additional driver 30B or the additionallens-barrel 60B, such that the optical lenses 10A are respectively heldalong the photosensitive paths of the additional photosensitive element21B and the photosensitive element 21A of the molded photosensitiveassembly 20A. In addition, the additional photosensitive element 21B maynot be mounted on the circuit board 22A of the molded photosensitiveassembly 20A, but an additional circuit board 22B may be provided by thearray camera module for mounting the additional photosensitive element21B.

FIG. 31 illustrates another alternative mode of the embodiment of thearray camera module in which the filter member 40A is not directlymounted on the molded body 232A of the molded base 23A, but that thearray camera module further provides at least one holder 70A, whereinthe filter members 40A are mounted on the at least one holder 70A, andthen the at least one holder 70A is mounted on the top surface of themolded body 232A such that the filter members 40A are respectively heldbetween the optical lenses 10A and the photosensitive elements 21A, sothat the size of the array camera module is reduced that reduces themanufacturing cost of the array camera module.

It is worth to mention that, in one embodiment, the number of theholders 70A equals to the number of the filter members 40A. That is, theholders 70A and the filter members 40A are matched and aligned one byone. For example, when the number of the filter members 40A is one, thenumber of the holders 70A is also one. In another embodiment, the numberof the holders 70A, the number of the filter members 40A, and the numberof the optical lenses 10A are preferred the same. For example, in theexample as shown in FIG. 21, the number of the holders 70A, the numberof the filter members 40A and the number of the optical lenses 10A aretwo.

In another embodiment, the number of the holders 70A may also bedifferent from the number of the filter members 40A. For example, thenumber of the holders 70A may be only one, and the number of the filtermembers 40A may be more than one, wherein the filter members 40A can bemounted on different positions of the holder 70A.

With further referencing to FIG. 31, the top surface of the molded body232A can be a flat surface, so that after the molded base 23A is molded,the holder 70A is firstly mounted on the top surface of the molded body232A, and then the driver 30A or the lens barrel 60A is mounted on theholder 70A. That is, the driver 30A or the lens barrel 60A may not bedirectly mounted on the top surface of the molded body 232A, and may bemounted on the holder 70A.

FIG. 32 illustrates another alternative mode of the embodiment of thecamera module, wherein the top surface of the molded body 232A has arecess 235A, wherein the holder 70A mounted on the top surface of themolded body 232A is received in the recess 235A to further reduce theheight of the camera module. In this situation, the driver 30A or thelens barrel 60A can be directly mounted on the top surface of moldedbody 232A.

However, it will be understood by one skilled in the art that in otheralternative modes of the array camera module of the present inventionthat, the optical lens 10A may also be directly mounted on the topsurface of the molded body 232A or the optical lens 10A can also bedirectly mounted on the top surface of the holder 70A.

According to another aspect of the present invention, referring to FIG.33, the present invention further provides an electronic device equippedwith array camera module, wherein the electronic device with arraycamera module comprises an electronic device body 200A and at least onearray camera module, wherein the at least one array camera modules isdisposed on the electronic device body 200A for acquiring images.

According to another aspect of the present invention, the presentinvention further provides a manufacturing method of a moldedphotosensitive assembly 20A, wherein the manufacturing method comprisesthe steps of:

(a) connecting a photosensitive element 21A and a circuit board 22Athrough a set of wires 24A;

(b) placing the photosensitive element 21A and the circuit board 22A inan upper mold 101A or a lower mold 102A of a molding-die 100A;

(c) by closing and clamping the upper mold 101A and the lower mold 102A,supporting the upper mold 101A upwardly by a supporting member 25A toprevent the pressing surface 1011A of the upper mold 101A from beingpressed against the set of wires 24A; and

(d) adding and filling a fluid molding material into a molding cavity103A formed between the upper mold 101A and the lower mold 102A to forma molded base 23A after the molding material is solidified and cured,wherein the molded base 23A comprises a molded body 232A and has a lightwindow 231A, wherein at least a part of an periphery area 223A of thecircuit board 22A and at least a part of the supporting member 25A arecovered by the molded body 232A, wherein the photosensitive area 212 ofthe photosensitive elements 21A is positioned corresponding to the lightwindow 231A.

Referring to FIG. 34A to FIG. 36F of the drawings, a camera moduleaccording to a preferred embodiment of the present invention isillustrated, wherein the camera module comprises at least one opticallens 10C, at least one photosensitive element 21C, at least one circuitboard 22C, at least one protective frame 300C, and at least oneintegrated package holder 400C.

It is worth mentioning that the camera module of the present inventionmay be a fixed focus camera module or a zoom camera module. In otherwords, whether or not the camera module of the present invention allowsfocusing does not limit the scope of the present invention.

More specifically, the camera module of the present invention may be asingle-lens camera module or a multi-lens camera module. For example, ina specific example, the camera module may be embodied as an array cameramodule. In other words, the number of the optical lens 10C of the cameramodule of the present invention does not limit the scope of the presentinvention.

Specifically, in the camera module of the present invention as shown inFIG. 34A, the protective frame 300C is convexly provided on the outerperipheral side of the photosensitive area of the photosensitive element21C. It is worth mentioning that the protective frame 300C is similarwith the supporting member 25 of the above embodiments of the presentinvention. The photosensitive element 21C is electrically connected tothe circuit board 22C, and the integrated package holder 400C isprovided to wrap at least a part of the circuit board 22C and at least apart of the protective frame 300C. Furthermore, the integrated packageholder 400C may further cover at least a part of the non-photosensitivearea of the photosensitive element 21C after being molded, so that theintegrated package holder 400C, the photosensitive element 21C and thecircuit board 22C are integrated to form a single piece. It is worthmentioning that the integral package holder 400C is similar with themolded base 23 of the above embodiments of the present invention. Theoptical lens 10C is disposed in a photosensitive path of thephotosensitive element 21C. Light reflected by the object can beconcentrated by the optical lens 10C to the inside of the camera moduleand be further received and photoelectrically converted by thephotosensitive element 21C to generate an image related to the object.

In a specific example of the camera module of the present invention, thephotosensitive element 21C is mounted on the circuit board 22C and thephotosensitive element 21C is electrically connected with the circuitboard 22C. For example, the photosensitive element 21C may beelectrically connected to the circuit board 22C by a wire bondingprocess. For example, a gold wire is connected between thenon-photosensitive area of the photosensitive element 21C and thecircuit board 22C to electrically connect the photosensitive element 21Cand the circuit board 22C by the gold wire as shown in FIG. 34A.

In another specific example of the camera module of the presentinvention, the photosensitive element 21C is electrically connected tothe circuit board 22C while being mounted on the circuit board 22C. Forexample, the non-photosensitive area of the photosensitive element 21Cis provided with a chip pad, and the circuit board 22C is provided witha circuit board pad. When the photosensitive element 21C is mounted onthe circuit board 22C, the chip pad of the photosensitive element 21C iselectrically connected with the circuit board pad of the circuit board22C.

The protective frame 300C is a hollow structure that the protectiveframe 300C can be looped on the outer peripheral of the photosensitivearea of the photosensitive element 21C. Preferably, the size of theinner side of the protective frame 300C is greater than or equal to thesize of the photosensitive area of the photosensitive element 21C, sothat when the protective frame 300C is protrudedly formed on thephotosensitive element 21C, the protective frame 300C can be held on theouter peripheral side of the photosensitive area of the photosensitiveelement 21C so that the protective frame 300C does not block thephotosensitive area of the photosensitive element 21C.

Preferably, the size of the outer side of the protective frame 300C issmaller than the size of the photosensitive element 21C, so that whenthe protective frame 300C is protrudedly formed on the photosensitiveelement 21C, the outer side of the non-photosensitive area of thephotosensitive element 21C can be electrically conducted with thephotosensitive element 21C and the circuit board 22C by a wire bondingprocess. However, it will be understood by one skilled in the art thatwhen the photosensitive element 21C and the circuit board 22C areelectrically connected through the chip pad and the circuit board pad,the size of the outer side of the protective frame 300C may be the sameas the size of the photosensitive element 21C.

The integrated package holder 400C wraps the circuit board 22C and thenon-photosensitive area of the photosensitive element 21C after beingmolded, for integrating the integrated package holder 400C, the circuitboard 22C and the photosensitive element 21C into an integral body. Inthis way, the structural stability of the camera module can beincreased, and the size of the camera module can be reduced, so that thecamera module can be applied to an electronic device which is thin andin lightweight.

Furthermore, the integrated package holder 400C is arranged to wrap theouter peripheral side of the protective frame 300C, so that theintegrated package holder 400C, the circuit board 22C, the protectiveframe 300C, and the photosensitive element 21C are integrated into anintegral body. It can be understood that the integrated package holder400C can also be arranged to wrap at least a part of the top surface ofthe protective frame 300C.

Furthermore, as shown in FIG. 34A, the camera module comprises at leastone lens holding member 500C, wherein the lens holding member 500C isprovided above an upper portion of the integrated package holder 400C,and the optical lens 10C is disposed on the lens holding member 500C tohold the optical lens 10C in the photosensitive path of thephotosensitive element 21C by the lens holding member 500C.

In a specific example of the camera module of the present invention, thelens holding member 500C is disposed on an upper portion of theintegrated package holder 400C after molded. In another specific exampleof the camera module of the present invention, the lens holding member500C can be integrally formed with the integrated package holder 400C.In this way, the packaging error of manufacturing the camera module canbe reduced to improve the imaging quality of the camera module.

Preferably, the lens holding member 500C may be embodied as a driver,such as a motor. That is, the optical lens 10C is operatively providedon the lens holding member 500C to be driven by the lens holding member500C. The optical lens 10C moves back and forth along the photosensitivepath of the photosensitive element 21C for adjusting the focal length ofthe camera module by changing the position between the optical lens 10Cand the photosensitive element 21C. It is worth mentioning that the lensholding member 500C may be a variety of drivers for driving the opticallens 10C to move reciprocatedly along the photosensitive path of thephotosensitive element 21C. For example, in this preferred embodiment ofthe invention, the lens holding member 500C may be implemented as avoice coil motor.

One skilled in the art will understand that once the lens holding member500C is embodied as a motor, the lens holding member 500C iselectrically connected to the circuit board 22C.

Furthermore, as shown in FIG. 34A, the camera module comprises a filtermember 40C, wherein the filter member 40C is disposed between theoptical lens 10C and the photosensitive element 21C. When lightreflected by an object is collected from the optical lens 10C to theinside of the camera module, the light is filtered by the filter member40C and received and photoelectrically converted by the photosensitiveelement 21C to improve the imaging quality of the camera module. Inother words, the filter member 40C can function as a noise reduction toimprove the imaging quality of the camera module.

It is worth to mention that the type of the filter member 40C can beunrestricted. For example, in a specific example of the camera module ofthe present invention, the filter member 40C can be embodied as aninfrared cutoff filter for filtering infrared portion of the light bythe filter member 40C, and in another specific example of the cameramodule of the present invention, the filter member 40C is embodied as afull-transmission spectral filter.

According to an alternative mode of the embodiment of the camera moduleof the present invention as shown in FIG. 34B, the filter member 40C mayalso be provided on the photosensitive element 21C in an overlappingmanner, and the protective frame 300C is formed on the outer peripheralside of the filter member 40C.

The integrated package holder 400C forms at least one mounting platform410C for mounting the filter member 40C. For example, the mountingplatform 410C may be a mounting recess formed in an upper portion of theintegrated package holder 400C or the mounting platform 410C may be aflat surface formed on an upper portion of the integrated package holder400C. In other words, the filter member 40C can be directly mounted onthe upper portion of the integrated package holder 400C.

FIG. 36A to 36F are sectional views illustrating a manufacturing methodof the camera module according to the present invention, wherein in theFIGS. 36A to 36F, the description of the camera module is shown in asectional view for convenience of description of the structuralrelationship between the optical lens 10C, the photosensitive element21C, the protective frame 300C, the circuit board 22C, and theintegrated package holder 400C.

In the step shown in FIG. 36A, the photosensitive element 21C isconducted with the circuit board 22C. One skilled in the art willunderstand that, in the step as illustrated in FIG. 36A, after thephotosensitive element 21C is mounted on the circuit board 22C, thephotosensitive element 21C is electrically conducted with the circuitboard 22C by a wire bonding process. The manner of which thephotosensitive element 21C being electrically connected with the circuitboard 22C is merely exemplified. The manner in which the photosensitiveelement 21C and the circuit board 22C are electrically connected doesnot constitute a limitation on the scope of the present invention. Inanother example of the camera module of the present invention, thephotosensitive element 21C and the circuit board 22C may also bedirectly electrically connected through the chip pad and the circuitboard pad.

In the step as illustrated in FIG. 36B, the protective frame 300C isprotrudedly provided on the outer peripheral side of the photosensitivearea of the photosensitive element 21C. Specifically, in themanufacturing method of the camera module of the present invention,after the protective frame 300C is provided, the protective frame 300Cis protrudedly formed on the outer peripheral side of the photosensitivearea of the photosensitive element 21C. Preferably, a cementing layer600C is formed between the protective frame 300C and the outerperipheral side of the photosensitive area of the photosensitive element21C, and the cementing layer 600C is used to connect the protectiveframe 300C and the outer peripheral side of the photosensitive area thephotosensitive element 21C.

For example, in an example of the camera module of the presentinvention, the glue is disposed on the outer peripheral side of thephotosensitive frame 300C and/or the photosensitive area of thephotosensitive element 21C to form the adhesive layer 600C between theprotective frame 300C and/or the outer peripheral side of thephotosensitive area of the photosensitive element 21C. That is, at leastone of the surfaces of the protective frame 300C and the outerperipheral side of the photosensitive area of the photosensitive element21C forms the cementing layer 600C. Subsequently, the cementing layer600C is used to connect the protective frame 300C and the outerperipheral side of the photosensitive area of the photosensitive element21C.

Preferably, after the glue is disposed on the outer peripheral side ofthe photosensitive frame 300C and the photosensitive area of thephotosensitive element 21C, the glue may be rapidly solidified and curedto form the cementing layer 600C by heat curing or UV light curing forconnecting the protective frame 300C and the outer peripheral side ofthe photosensitive area of the photosensitive element 21C. In anotherexample of the camera module of the present invention, the protectiveframe 300C may be provided with the cementing layer 600C, so that theprotective frame 300C may be directly used in the process of packagingthe camera module. It is provided on the outer peripheral side of thephotosensitive area of the photosensitive element 21C.

In addition, the protective frame 300C may be formed by an injectionmolding process or a stamping process. For example, the protective frame300C may be a plastic product formed by an injection molding process.

As shown in FIG. 35, the protective frame 300C is a hollow structuresuch that the protective frame 300C can be protrudedly formed on theouter peripheral side of the photosensitive area of the photosensitiveelement 21C for isolating the photosensitive area of the photosensitiveelement 21C with the external environment, so that during the subsequentencapsulation of the camera module, the protective frame 300C canprevent contaminants from entering the photosensitive area of thephotosensitive element 21C to cause a bad stain point.

In the step as illustrated in FIG. 36C, the integral package holder 400Cis formed by a molding-die 100C during the process of packaging thecamera module, wherein the molding-die 100C comprises an upper mold101C. A pressing surface 1011C of the upper mold 101C is pressed againstthe protective frame 300C to isolate the photosensitive area of thephotosensitive element 21C and the external environment.

One skilled in the art would understand that the protective frame 300Cis protrudedly formed on the outer peripheral side of the photosensitivearea of the photosensitive element 21C, so that when the pressingsurface 1011C of the upper mold 101C is pressed, the protective frame300C can prevent the pressing surface 1011C of the upper mold 101C fromcontacting the photosensitive area of the photosensitive element 21C, sothat the protective frame 300C can stop the pressing surface 1011C ofthe upper mold 101C causing damages or scratches to the photosensitivearea of the photosensitive element 21C.

Furthermore, an alternative mode of the manufacturing method of thecamera module as illustrated in FIG. 38, wherein a recess 105C is formedin a concave manner in an inner surface of the upper mold 101C withrespect to a part of the photosensitive area of the photosensitiveelement 21C, so that the recess 105C can maintain a safe distancebetween the photosensitive area of the photosensitive element 21C andthe inner surface of the upper mold 101C during the process of moldingthe integral package holder 400C by the molding-die 100C. The safedistance further reduces the influence of the upper mold 101C on thephotosensitive element 21C to prevent the photosensitive element 21Cfrom being damaged or scratched by the inner surface of the upper mold101C.

Preferably, the protective frame 300C has a predetermined elasticitysuch that when the pressing surface 1011C of the upper mold 101C ispressed against the protective frame 300C, the protective frame 300C canserve as a buffer to prevent the impact force generated by the uppermold 101C when contacting the protective frame 300C to damage thephotosensitive element 21C. In addition, limited to the manufacturingmethod of the photosensitive element 21C and the manufacturing method ofthe circuit board 22C and the mounting process of the photosensitiveelement 21C and the circuit board 22C, there may be a mounting tiltafter the photosensitive element 21C is mounted on the circuit board22C. Accordingly, when the pressing surface 1011C of the upper mold 101Cis pressed against the protective frame 300C, the protective frame 300Ccan be deformed and the photosensitive area of the photosensitiveelement 21C is isolated from the external environment to prevent themolding material for forming the integral package holder 400C fromentering the photosensitive area of the photosensitive element 21C.

In the step as illustrated in FIG. 36D, the molding material is addedand filled into the upper mold 101C, and the integral package holder400C is formed after the molding material is cured, wherein the integralpackage holder 400C wraps the circuit board 22C and thenon-photosensitive area of the photosensitive element 21C, such that theintegrated package holder 400C, the circuit board 22C, and thephotosensitive element 21C are integrated to form an integral body.Preferably, the integrated package holder 400C further wraps the outerperipheral side of the protective frame 300C to integrate the integratedpackage holder 400C, the circuit board 22C, the protective frame 300C,and the photosensitive element 21C to form an integral body. It is worthmentioning that the molding material is fluid or granular. After themolding-die 100C is removed, the integrally packaged holder 400C, thecircuit board 22C, the protective frame 300C, and the photosensitiveelement 21C are integrally connected as shown in FIG. 36E.

One skilled in the art would understand that the photosensitive area ofthe photosensitive element 21C and the external environment areisolated, so that the molding material will not flow to thephotosensitive area of the photosensitive element 21C after the moldingmaterial is added to the upper mold 101C, so that the protective frame300C can prevent the molding material from damaging the photosensitivearea of the photosensitive element 21C. In addition, the protectiveframe 300C has a predetermined elasticity such that there is no gapbetween the protective frame 300C and the upper mold 101C pressedagainst the protective frame 300C. Therefore, during the curing of themolding material added to the upper mold 101C, the phenomenon of“flashing” does not happen to ensure the image quality of the cameramodule.

Furthermore, according to an alternative mode of the manufacturingmethod of the camera module as illustrated in FIGS. 37A and 37B, whereinthe pressing surface 1011C of the upper mold 101C is provided with acovering film 104C. When the pressing surface 1011C of the upper mold101C is pressed against the protective frame 300C, the covering film104C provided on the upper mold 101C is in direct contact with theprotective frame 300C, so that the covering film 104C provides furtherprotection to the photosensitive element 21C. In addition, it can beunderstood that the covering film 104C can reduce the difficulty ofdemolding and increase the sealing property by preventing the phenomenon“flash” appearing of the molding material on the inner side of theintegrated package holder 400C during curing.

In addition, in the embodiment in which the pressing surface 1011C ofthe upper mold 101C is provided with the covering film 104, theprotective frame 300C may also have no elasticity, so that the impactforce generated when the mold 101C is pressed against the protectiveframe 300C is absorbed by the covering film 104C to avoid damaging thephotosensitive element 21C.

In the step as illustrated in FIG. 36F, the filter member 40C and theoptical lens 10C are respectively arranged in the photosensitive path ofthe photosensitive element 21C to manufacture the camera module.Preferably, the filter member 40C is mounted on the integral packageholder 400C and the optical lens 10C is held along the photosensitivepath of the photosensitive element 21C by the lens holding member 500Cprovided to the integrated package holder 400C.

FIGS. 39A to 39G are sectional views illustrating another manufacturingmethod of the camera module according to the present invention. In thestep as illustrated in FIG. 39A, the photosensitive element 21C iselectrically connected with the circuit board 22C.

In the step as illustrated in FIG. 39B, the protective frame 300C isprotrudedly formed on the outer peripheral side of the photosensitivearea of the photosensitive element 21C. Preferably, the upper portion ofthe protective frame 300C is provided with a protective film 700C tofacilitate the suction of the protective frame 300C by vacuum adsorptionand the mounting of the protective frame 300C to the periphery of thephotosensitive area of the photosensitive element 21C. It is understoodby one skilled in the art that, after the protective frame 300C isdisposed on the outer peripheral side of the photosensitive area of thephotosensitive element 21C, the protective film 700C correspondinglycovers the upper portion of the photosensitive area of thephotosensitive element 21C to isolate the photosensitive area of thephotosensitive element 21C and the external environment by theprotective film 700C and the protective frame 300C, thereby preventingthe molding material from flowing to the photosensitive area of thephotosensitive element 21C in the subsequent steps.

In the step as illustrated in FIG. 39C, the pressing frame 1011C of theupper mold 101C of the molding-die 100C is pressed against theprotective frame 300C to further isolate the photosensitive area of thephotosensitive element 21C and the external environment.

In the step as illustrated in FIG. 39D, the molding material is added tothe molding-die 100C, and the integral package holder 400C is formedafter the molding material is solidified and cured, wherein theintegrated package holder 400C wraps the circuit board 22C and anon-photosensitive area of the photosensitive element 21C, so that theintegrated package holder 400C, the circuit board 22C and thephotosensitive element 21C are integrated to form an integral body.Preferably, the integrated package holder 400C further wraps the outerperipheral side of the protective frame 300C to integrate the integratedpackage holder 400C, the circuit board 22C, the protective frame 300C,and the photosensitive element 21C. After the molding-die 100C isopened, an integral body of the integrated package holder 400C, thecircuit board 22C, the protective frame 300C, and the photosensitiveelement 21C can be obtained as shown in FIG. 39E, wherein the film 700Cis still disposed on the protective frame 300C.

In the step as illustrated in FIG. 39F, the protective film 700C isremoved from the protective frame 300C to obtain an integral body of theintegrated package holder 400C, the circuit board 22C, the protectiveframe 300C, and the photosensitive element 21C.

In the step as illustrated in FIG. 39G, the filter member 40C and theoptical lens 10C are aligned and disposed along the photosensitive pathof the photosensitive element 21C to manufacture the camera module.

Referring to FIG. 40 to FIG. 42G of the drawings, the camera moduleaccording to another preferred embodiment of the present invention isillustrated, wherein the camera module comprises at least one opticallens 10D, at least one photosensitive element 21D, at least one aprotective frame 300D, at least one circuit board 22D, at least oneintegrated package holder 400D, and at least one filter member 40D,wherein the photosensitive element 21D and the circuit board 22D areelectrically connected and the at least one filter member 40D isoverlapped on the photosensitive element 21D, wherein the protectiveframe 300D is disposed on the outer periphery of the filter member 40Dsuch that the protective frame 300D does not block the photosensitivearea of the photosensitive element 21D. The integrated package holder400D is arranged to wrap the outer periphery of the circuit board 22Dand the filter member 40D to integrate the integrated package holder400D, the filter member 40D, the photosensitive element 21D, and thecircuit board 22D to form an integral body. The optical lens 10D isdisposed in a photosensitive path of the photosensitive element 21D.Light reflected by the object is collected by the optical lens 10D intothe inside of the camera module and received by the photosensitiveelement 21D for photoelectrically conversion to generate an imagerelated to the object.

Preferably, the integrated package holder 400D wraps the outer peripheryof the circuit board 22D and the filter member 40D during molding, sothat the integrated package holder 400D, the filter member 40D, and thephotosensitive element 21D are integrally combined with the circuitboard 22D.

More preferably, the integral package holder 400D further wraps theouter side of the protective frame 300D to make the integrated packageholder 400D, the filter member 40D, the photosensitive element 21D, thecircuit board 22D, and the protective frame 300D being integrallycombined.

The protective frame 300D is protrudedly formed on the outer peripheryof the filter member 40D, so that when the inner surface of the uppermold 101D of a molding-die 100D is pressed against the protective frame300D, the inner surface of the upper mold 101D does not contact with thesurface of the filter member 40D, thereby preventing the inner surfaceof the upper mold 101D from being damaged or scratching the filtermember 40D. That is, the protective frame 300D that is protrudedlyformed on the outer periphery of the filter member 40D to maintain asafe distance between the surface of the filter member 40D and the innersurface of the upper mold 101D to prevent the inner surface of the uppermold 101D causing damages or scratches on the filter member 40D.

Furthermore, the camera module comprises at least one lens holdingmember 500D, wherein the lens holding member 500D is disposed on anupper portion of the integrated package holder 400D, and the opticallens 10D is disposed on the lens holding member 500D. The optical lens10D is held in the photosensitive path of the photosensitive element 21Dby the lens holding member 500D.

In a specific example of the camera module of the present invention, thelens holding member 500D is disposed at an upper portion of theintegrated package holder 400D after molded. In another specific exampleof the camera module of the present invention, the lens holding member500D can be integrally formed with the integrated package holder 400D.In this way, the packaging error of the camera module can be reduced inorder to improve the imaging quality of the camera module.

Preferably, the lens holding member 500D may be embodied as a motor,i.e. the optical lens 10D being operatively disposed on the lens holdingmember 500D to be driven by the lens holding member 500D. The opticallens 10D moves back and forth along the photosensitive path of thephotosensitive element 21D, thereby adjusting the focal length of thecamera module by changing the position between the optical lens 10D andthe photosensitive element 21D. It is worth mentioning that the lensholding member 500D may be various drivers for driving the optical lens10D to move back and forth along the photosensitive path of thephotosensitive element 21D, for example, in this preferred embodiment ofthe invention. The lens holding member 500D can be embodied as a voicecoil motor.

One skilled in the art would understand that when the lens holdingmember 500D is embodied as a motor, the lens holding member 500D iselectrically connected to the circuit board 22D.

FIGS. 42A to 42G are sectional views illustrating a manufacturing methodof the camera module of the present invention. In the step asillustrated in FIG. 42A, the photosensitive element 21D is electricallyconnected to the circuit board 22D, wherein the manner of how thephotosensitive element 21D and the circuit board 22D are electricallyconnected is not limited in this invention, similarly to theabove-described preferred embodiments of the present invention.

In the step as illustrated in FIG. 42B, the filter member 40D isoverlappedly disposed on the photosensitive element 21D. One skilled inthe art would understand that the manner that the filter member 40D andthe photosensitive element 21D are overlapped can reduce the back focusof the camera module, thereby facilitating miniaturization of the cameramodule to enable the camera module to be applied to electronic devicesthat are thin and lightweight.

In the step, as illustrated in step 42C, the protective frame 300D isplaced on the outer periphery of the filter member 40D, wherein theprotective frame 300D does not block the photosensitive area of thephotosensitive element 21D. One skilled in the art would understand thatafter the protective frame 300D is provided, the protective frame 300Dcan be disposed on the outer periphery of the filter member 40D througha cementing layer 600D. That is, the cementing layer 600D disposedbetween the protective frame 300D and the filter member 40D is used toconnect the protective frame 300D with the filter member 40D.

In the step as illustrated in FIG. 42D, the protective frame 300D ispressed by the pressing surface 1011D of the upper mold 101D to isolatethe inner region and the outer periphery of the filter member 40D,wherein the size of an inner region of the filter member 40D is greaterthan or equal to the photosensitive area of the photosensitive element21D to prevent the protective frame 300D from blocking thephotosensitive area of the photosensitive element 21D. One skilled inthe art would understand that the protective frame 300D is protrudedlyformed on the outer periphery of the filter member 40D, so that when thepressing surface 1011D of the upper mold 101D is pressed against theprotective frame 300D, the protective frame 300D can prevent thepressing surface 1011D of the upper mold 101D from contacting thephotosensitive area of the filter member 40D, so that the protectiveframe 300D can block the pressing surface 1011D of the upper mold 101Dto cause damages or scratches on the inner region of the filter member40D.

Preferably, the protective frame 300D has a predetermined elasticitysuch that when the pressing surface 1011D of the upper mold 101D ispressed against the protective frame 300D, the protective frame 300D canserve as a buffer to prevent the pressure generated by the upper mold101D damaging the filter member 40D.

In the step as illustrated in FIG. 42E, the molding material is added tothe upper mold 101D, and the integral package holder 400D is formedafter the molding material is solidified and cured, wherein the integralpackage holder 400D wraps the circuit board 22D and thenon-photosensitive area of the photosensitive element 21D, such that theintegrated package holder 400D, the circuit board 22D, and thephotosensitive element 21D are integrated to form an integral body.Preferably, the integrated package holder 400D further wraps the outerperipheral side of the protective frame 300D to integrate the integratedpackage holder 400D, the circuit board 22D, the protective frame 300D,and the photosensitive element 21D to form an integral body. It is worthmentioning that the molding material is fluid or granular. After themolding-die 100D is removed, the integrally packaged holder 400D, thecircuit board 22D, the protective frame 300D, and the photosensitiveelement 21D are integrally connected as shown in FIG. 36E.

One skilled in the art would understand that the photosensitive area ofthe photosensitive element 21D and the external environment areisolated, so that the molding material does not flow to thephotosensitive area of the photosensitive element 21D after the moldingmaterial is added to the upper mold 101D, so that the protective frame300D can prevent the molding material from damaging the photosensitivearea of the photosensitive element 21D. In addition, the protectiveframe 300D has a predetermined elasticity such that there is no gapbetween the protective frame 300D and the upper mold 101D pressedagainst the protective frame 300D. Therefore, during the solidifying andcuring of the molding material added to the upper mold 101D, thephenomenon of “flashing” does not happen to ensure the image quality ofthe camera module.

In the step as illustrated in FIG. 42G, the filter member 40D and theoptical lens 10D are aligned and disposed along the photosensitive pathof the photosensitive element 21D to fabricate the camera module.

Furthermore, the present invention further provides a manufacturingmethod of a camera module, wherein the manufacturing method comprisesthe following steps:

(a) electrically connecting at least one photosensitive element 21C withat least one circuit board 22C;

(b) providing at least one protective frame 300C, wherein the protectiveframe 300C is formed on an outer peripheral side of a photosensitivearea of the at least one photosensitive element 21C;

(c) pressing an inner surface of an upper mold 101C of a molding-die100C against the at least one protective frame 300C to isolate thephotosensitive area and a non-photosensitive area of the at least onephotosensitive element 21C;

(d) wrapping the at least one circuit board 22C and thenon-photosensitive area of the at least one photosensitive element 21Cby a molding material added and cured in the molding-die 100C, whereinafter the molding material is solidified and cured, an integratedpackage holder 400C is integrally formed and coupled with thephotosensitive element 21C and the circuit board 22C; and

(e) providing at least one optical lens 10C, wherein the optical lens10C is disposed in a photosensitive path of the at least onephotosensitive element 21C to form the camera module.

Furthermore, the present invention also provides a manufacturing methodof a camera module, wherein the manufacturing method comprises thefollowing steps:

(A) electrically connecting at least one photosensitive element 21C andat least one circuit board 22C;

(B) overlapping a filter member 40C on the at least one photosensitiveelement 21C;

(C) providing at least one protective frame 300C, wherein the protectiveframe 300C is disposed on an outer peripheral side of the filter member40C;

(D) pressing an inner surface of an upper mold 101C of a molding-die100C against the protective frame 300C to isolate an inner region and anouter peripheral side of the filter member 40C;

(E) wrapping the at least one circuit board 22C and the outer peripheralside of the filter member 20C by a molding material added and cured inthe molding-die 100C, wherein after the molding material is solidifiedand cured, an integrated package holder 400C is integrally formed andcoupled with the photosensitive element 21C and the circuit board 22C;and

(F) providing at least one optical lens 10C, wherein the at least oneoptical lens 10C is aligned and disposed in a photosensitive path of theat least one photosensitive element 21C to form the camera module.

Referring to FIGS. 43 and 44, the present invention provides a cameramodule and a manufacturing method thereof, wherein the camera module canbe installed in an electronic device for capturing information,including image or video, of the environment around the electronicdevice.

It is worth mentioning that type of such electronic device is notlimited in the invention. For example, the electronic device can be acivil electronic device, such as a smartphone, a tablet, a media player,a laptop, a PDA, a remote controller, a medical electronic device suchas an endoscope, or any other electronic device that can equip with thearray camera module in other fields.

The camera module of the present invention as shown in FIG. 43 can beembodied as a fixed focus module, wherein the camera module includes atleast one optical lens 10E, at least one photosensitive element 21E suchas a photosensitive chip, at least one insulating member 800E, a circuitboard 22E, and an integral encapsulating support structure 400E. Thephotosensitive element 21E is conductively and electrically connectedwith the circuit board 22E. The insulating member 800E is provided toinsulate a photosensitive area of the photosensitive element 21E withthe encapsulating support structure that, in one embodiment, theinsulating member 800E is provided around the periphery around at leastthe photosensitive area of the photosensitive element 21E. It isembodied that the insulating member 800E has a ring-shape and ispositioned in a non-photosensitive area of the photosensitive element21E. The integral encapsulating support structure 400E is molded on thecircuit board 22E to enclose, case, and/or wrap up everynon-photosensitive area of the photosensitive element 21E and an outerperipheral surface 801E of the insulating member 800E. The optical lens10E is supported along a photosensitive path of the photosensitiveelement 21E. Light reflected from an object enters the camera modulethrough the optical lens 10E, and then is captured by the photosensitiveelement 21E to conduct a photoelectric conversion to generatecorresponding image of the object.

The insulating member 800E is adapted for insulating the encapsulatingsupport structure 400E from blocking the photosensitive area of thephotosensitive element 21E. For example, the insulating member 800E canbe embodied as ring-shaped, such as a circular or square frame shape. Inother words, the middle of the insulating member 800E is hollow, so asto avoid the insulating member 800E from blocking the photosensitivearea of the photosensitive element 21E.

It is worth mentioning that although FIG. 43 illustrates that the cameramodule of the present invention only includes one optical lens 10E andone photosensitive element 21E, those skilled in the art should be ableto understand that the camera module of the present invention can alsoinclude two or more optical lenses 10E and two or more photosensitiveelements 20E, so as to have the camera module forming an array cameramodule. Therefore, the camera module of the present invention as shownin FIG. 43 is merely an exemplary description. In fact, the quantitiesand types of the optical lens 10E and the photosensitive element 21E ofthe present invention should not limit the detail and scope of thecamera module of the present invention.

Besides, the photosensitive element 21E of the camera module of thepresent invention as shown in FIG. 43 is mounted on the circuit board22E and conductively and electrically connected to the circuit board 22Ethrough the technology of gold, silver or copper wire bonding.Nevertheless, person skilled in art should understand that the circuitboard 22E may have a circuit board bonding pad and the photosensitiveelement can have a chip bonding pad, so that the photosensitive element21E can be mounted on the circuit board 22E with the chip bonding pad ofthe photosensitive element 21E corresponding to the circuit boardbonding pad of the circuit board 22E, while the photosensitive element21E and the circuit board 22E is conductively and electrically connectedwith each other. In addition, the photosensitive element 21E can alsomerely electrically connected to the circuit board 22E without mountingthereon. As a result, the flatness and smoothness of the photosensitiveelement 21E will not be affected and limited by the flatness andsmoothness of the circuit board 22E. For example, the flatness andsmoothness of the photosensitive element 21E can be ensured by means ofthe integral encapsulating support structure 400E.

Furthermore, the camera module includes at least a camera lens supporter500E, wherein the camera lens supporter 500E is disposed on top of therespective integral encapsulating support structure 400E. The opticallens 10E is supported in the respective camera lens supporter 500E thatsubstantially holds the optical lens 10E in position and be alignedalong the photosensitive path of the photosensitive element 21E. It isworth mentioning that in one embodiment of the camera module of thepresent invention, the camera lens supporter 500E is able to beseparately made and then mounted on the integral encapsulating supportstructure 400E. In one embodiment of the camera module of the presentinvention, the integral encapsulating support structure 400E can be madeintegrally extending to form the camera lens supporter 500E. In otherwords, the camera lens supporter 500E and the integral encapsulatingsupport structure 400E can be integrally formed, wherein the deviationgenerated when mounting an independent camera lens supporter 500E on theintegral encapsulating support structure 400E is eliminated and thus theimaging quality of the camera module is improved by reducing the packagetilt of the camera module.

FIGS. 44 and 45 illustrate an example of the camera module of thepresent invention that is embodied as a zoom lens module, which is ableto change the focal length of the camera module based on specificutility needs of the user, so as to enhance the environmentaladaptability of the camera module. Specifically, the camera module ofthe present invention includes at least a driver, which can be anysimilar driver unit. For example, it can be a voice coil motor 30Eaccording to the present embodiment. Each voice coil motor 30E ismounted on the respective integral encapsulating support structure 400Eand electrically connected with the circuit board 22E. The optical lens10E is drivably mounted on the voice coil motor 30E and kept alignedalong the photosensitive path of the photosensitive element 21E by thevoice coil motor 30E. Besides, the voice coil motor 30E is able to drivethe optical lens 10E to move back and forth along the photosensitivepath of the photosensitive element 21E for adjusting the focal length ofthe camera module.

Person skilled in the art should understand that the voice coil motor30E of the camera module of the present invention can be electricallyconnected to the circuit board 22E through various ways. For example, inone embodiment, the integral encapsulating support structure 400E isable to be built in with at least a wire having one end electricallyconnected to the circuit board 22E and the other end forming a bondingpad on the surface of the integral encapsulating support structure 400Eor the other end connected to a bonding pad provided on the surface ofthe integral encapsulating support structure 400E. Therefore, as thevoice coil motor 30E is mounted on the integral encapsulating supportstructure 400E, the bonding pad of the voice coil motor 30E and thebonding pad of the surface of the integral encapsulating supportstructure 400E are bonded together so as to electrically connect thevoice coil motor 30E with the circuit board 22E. For example, in anotherembodiment, the voice coil motor 30E can be conductively connected tothe circuit board 22E by coating a conductive layer on the surface ofthe integral encapsulating support structure 400E.

Further, the camera module of the present invention includes at leastone filter member 40E. The filter member 40E is supported between theoptical lens 10E and the photosensitive element 21E. Light reflectedfrom an object enters the camera module through the optical lens 10E.Then the light is filtered by the filter member 40E and received by thephotosensitive element 21E to conduct a photoelectric conversion. Thefilter member 40E is able to reduce noise effect and improve the imagingquality of the camera module.

It is worth mentioning that types of the filter member 40E is notlimited in the invention. For example, in a preferred embodiment of thecamera module of the present invention, the filter member 40E can beembodied as an IR-Cut Filter. As a result, the filter member 40E can beused to filter infrared ray in the light. Also, in another preferredembodiment of the camera module of the present invention, the filtermember 40E can be embodied as a piece of fully-transparent spectrumfilter.

The integral encapsulating support structure 400E forms at least oneplatform for mounting the filter member 40E in position. For example,the platform may have a mounting slot formed on the top of the integralencapsulating support structure 400E or form no mounting slot on the topand the filter member 40E is mounted thereon directly. When the cameramodule of the present invention is embodied as the array camera module,the quantity of the filter member 40E can be embodied as one piece, andall the optical lenses 10E and the photosensitive elements 20E arerespectively provided corresponding to different portions of the filtermember 40E. Nevertheless, quantity of the filter member 40E of thepresent invention is preferably equal to the quantity of thephotosensitive element 21E and the optical lens 10E, so that each filtermember 40E, each optical lens 10E, and each photosensitive element 21Eare arranged to one another correspondingly.

FIGS. 46 and 47 illustrate another preferred embodiment of the cameramodule of the present invention, wherein the insulating member 800E isnot disposed on the photosensitive element 21E. Particularly, in theembodiment as shown in FIGS. 46 and 47, the filter member 40E isembodied to disposed overlappingly on top of the photosensitive element21E which is electrically connected to the circuit board 22E. Theinsulating member 800E is disposed on the peripheral edge of the filtermember 40E to divide an inner area and an outer area of the filtermember 40E by the insulating member 800E. The integral encapsulatingsupport structure 400E is formed to enclose and cover the circuit board22E and the outer area of the filter member 40E and the circuit board22E, so as to integrally couple the integral encapsulating supportstructure 400E, the filter member 40E, the photosensitive element 21E,and the circuit board 22E to form an integral structure.

By overlapping the filter member 40E on the photosensitive element 21Eand then forming the integral encapsulating support structure 400E asdescribed above, the photosensitive area of the photosensitive element21E can be prevented from being damaged or polluted by the moldingmaterial during the molding of the integral encapsulating supportstructure 400E, so as to ensure the reliability of the photosensitiveelement 21E.

It is worth mentioning that the portion of the filter member 40Ecorresponding to the photosensitive area of the photosensitive element21E is defined as the inner area of the filter member 40E. The portionof the filter member 40E corresponding to the non-photosensitive area ofthe photosensitive element 21E is defined as the outer area of thefilter member 40E. The insulating member 800E, adapted for insulatingthe photosensitive area of the photosensitive element 21E from theintegral capitulating support structure 400E, is disposed between theinner area and the outer area on the filter member 40E according to thepresent embodiment. After the integral encapsulating support structure400E is formed by such as compression molding, the integralencapsulating support structure 400E encloses, cases, and wraps up theouter area of the filter member 40E to ensure the integral encapsulatingsupport structure 400E do not block the photosensitive area of thephotosensitive element 21E as well as the corresponding inner area ofthe filter member 40E. It is worth mentioning that the periphery of thephotosensitive area of the photosensitive element 21E between thephotosensitive element 21E and the filter member 40E can be applied withadhesive to further provide an insulating structure.

Besides, according to the present embodiment of the camera module of thepresent invention, the filter member 40E is directly overlapped with thephotosensitive element 21E that can decrease a back focal length of thecamera module. By so, it is more likely to reduce the height size of thecamera module that renders the camera module of the present inventionadapted to be more applicable to electronic devices to meet the lighterand thinner demands thereof.

Referring to FIGS. 48 to 50, a manufacture process of the camera moduleof the present invention is illustrated. FIG. 48 illustrates a step ofthe manufacturing process of the camera module as an embodiment, whereinthe photosensitive element 21E is mounted on the circuit board 22E.Besides, the photosensitive element 21E is electrically connected withthe circuit board 22E with bonding wires by applying wire bondingtechnology. The insulating member 800E is attached on the peripheryaround the photosensitive area of the photosensitive element 21E.

Optionally, in one embodiment of the camera module, the photosensitiveelement 21E and the circuit board 22E can be conductively connected witheach other by means of bonding pad soldering. Hence, the example asshown in FIG. 48 that the photosensitive element 21E and the circuitboard 22E are conductively connected with each other by gold bondingwires is merely a particular embodiment.

Besides, the photosensitive element 21E can be conductively connectedwith the circuit board 22E before attaching the insulating member 800Eon the photosensitive element 21E. On the other hand, the insulatingmember 800E can also be disposed on the photosensitive element 21Ebefore electrically connecting the photosensitive element 21E with thecircuit board 22E.

In one embodiment of the present invention, after the photosensitiveelement 21E is electrically connected with the circuit board 22E, anadhesive element in form of adhesive film, adhesive gel form or sprayingglue is applied at least around the periphery of the photosensitiveelement 21E, which forms the insulating member 800E. It is worthmentioning that because the adhesive element is directly applied toattach on the photosensitive element 21E in adhesive gel form orspraying glue form, the insulating member 800E formed aftersolidification protrudes from the surface of the photosensitive element21E. Person skilled in the art should appreciate that the adhesiveelement can also be made from elastic material such as rubber, silicon,or polyester material and when the adhesive element having apredetermined stickiness is applied by drawing or spraying on theperiphery around the photosensitive element 21E, a certain height of theadhesive element is protruded to form the insulating member 800E whileit is prevented from flowing to the photosensitive area of thephotosensitive element 21E that ensures the photosensitive area of thephotosensitive element 21E from being polluted by the adhesive element.

Furthermore, after the adhesive element is applied by drawing orspraying on the periphery of the photosensitive element 21E, theadhesive element can be solidified on the photosensitive element 21E toform the insulating member 800E through solidifying reaction such asheat drying or UV (Ultraviolet) ray exposure. Nonetheless, personskilled in the art should understand that the adhesive element can alsobe solidified through other methods or be solidified naturally. Hence,the damp, heat treatment or UV exposure may accelerate thesolidification process of the adhesive element, but it is not the onlymethod and condition to solidify the adhesive element. It is worthmentioning that the adhesive element may or may not have stickinessafter solidification. However, in some embodiments, when the adhesiveelement has stickiness, it can provide a resilient ability with respectto the compression die during molding and a sticking ability to attachdusts to reduce the dark spot defective of the camera module.

FIG. 47 illustrates another step of the manufacturing process of thecamera module according to a preferred embodiment of the presentinvention, wherein the circuit board 22E, the photosensitive element 21Eand the insulating member 800E are received in a molding-die such as acompression mold and pressed against an upper mold of the molding-die.It is appreciated that the insulating member 800E protruded from thephotosensitive element 21E ensures the upper mold of the molding-die tomerely contact with the insulating member 800E and avoids any directcontact between the upper mold of the molding-die and the photosensitiveelement 21E, especially the photosensitive area thereof, so as toprevent the photosensitive element 21E from being damaged under pressurefrom the upper mold of the molding-die.

It is worth mentioning that the insulating member 800E formed by thesolidified adhesive element is preferred to have an elasticity orflexibility, so that the insulating member 800E may absorb any overpressure from the upper mold of the molding-die and compensate any tiltoccurred in the attachment of the photosensitive element 21E and thecircuit board 22E. In other words, the insulating member 800E isdeformable to insulate and isolate the photosensitive area of thephotosensitive element 21E from the outside environment, that provides arelative sealing effect to prevent any liquid form molding material fromflowing to the photosensitive area of the photosensitive element 21Eduring the molding process.

As show in FIG. 50, a step of forming the integral encapsulating supportstructure 400E in the manufacturing process of the camera module isillustrated, wherein the molding material, for example in solid form orin small particles or powder form, is placed in a molding-die, such as acompression mold, insert mold and die mold, and then heated to melt toliquid form material to flow to mold the encapsulating support structure400E. Then, after the integral encapsulating support structure 400E issolidified, the encapsulating support structure 400E encloses and wrapsup at least the top surface of the circuit board 22E and thenon-photosensitive area of the photosensitive element 21E to integrallyconnect the integral encapsulating support structure 400E, the circuitboard 22E, and the photosensitive element 21E to form an integralstructure.

It is appreciated that the integral encapsulating support structure 400Ealso covers the peripheral surface 801E of the insulating member 800E sothat the integral encapsulating support structure 400E, the circuitboard 22E, the insulating member 800E, and the photosensitive element21E are integrally connected together to form an integral structure.

It is worth mentioning that since the insulating member 800E isolatesand insulates the photosensitive area of the photosensitive element 21Efrom the outside environment, the molding material heated to becomeliquid in the molding-die is not able to flow to the photosensitive areaof the photosensitive element 21E. That is the insulating member 800Estops the molding material for forming the integral encapsulatingsupport structure 400E from flowing to the photosensitive area of thephotosensitive element 21E from the non-photosensitive area thereof,that also prevents burrs be formed at the side, facing thephotosensitive area of the photosensitive element 21E, of the integralencapsulating support structure 400E so as to ensure the imaging qualityof the camera module and increase the product yield rate of the cameramodule.

It is worth mentioning that the integral encapsulating support structure400E, the circuit board 22E and the photosensitive element 21E areintegrally connected together to from an integral structure thatsubstantially enforces the strength of the circuit board 22E. Inaddition, the flatness and smoothness of the photosensitive element 21Ewill no longer be restricted to the flatness and smoothness of thecircuit board 22E, but to be maintained by the integral encapsulatingsupport structure 400E. Accordingly, the circuit board 22E canselectively be a flexible printed circuit board with less thickness. Byso, it can further reduce the height size of the camera module so as tomore applicable electronic device with the demands of being lighter andthinner.

It is worth mentioning that the camera module of the present inventionfurther includes a set of electrical elements including one or moreresistance-capacitance components 90E, wherein theresistance-capacitance components 90E are mounted on the circuit board22E. During the molding process, the heated liquid form molding materialis compressed to flow and fill between the resistance-capacitancecomponents 90E on the circuit board 22E automatically, so as to form thesolidified integral encapsulating support structure 400E with all theresistance-capacitance components 90E being enclosed and coveredtherein. Therefore, the integral encapsulating support structure 400Ecan not only insulate the resistance-capacitance component 90E from thephotosensitive element 21E, but also overlap the integral encapsulatingsupport structure 400E with the resistance-capacitance components 90E tosave space that results in further reduction of the height size, lengthsize and width size of the camera module.

The molding material is an insulation material such as resin or plastic.According to the preferred embodiment, resin material is preferred to beused as molding material to form the integral encapsulating supportstructure 400E, which not only has good strength and electricalinsulation ability, but also provides a good heat dissipation abilitythat has relatively high melting point after solidification and canconduct heat generated from the photosensitive element 21E in functionto outside. Person skilled in the art should appreciate that thesefeatures and properties of the integral encapsulating support structure400E of the present invention are especially effective in enhancing theperformance of the camera module that is embodied as an array cameramodule having multiple camera modules built with a large piece ofintegral encapsulating support structure 400E encapsulated multiplecircuit boards and photosensitive elements for coupling with multipleoptical lenses respectively as disclosed in the above embodiment.

It is worth mentioning that the insulating member 800E formed by theadhesive element may have stickiness after solidification so as to stickpollutant like dust that was generated during the manufacturing processof the camera module, and thus to stop pollutant like dust frompolluting the photosensitive area of the photosensitive element, inorder to enhance the imaging quality of the camera module by preventingdark spots of the camera module from occurring.

After the above manufacturing steps, the optical lens 10E is supportedabove the integral encapsulating support structure 400E and positionedalong the photosensitive path of the photosensitive element 21E toproduce the camera module. When the camera module is used, lightreflected from an object enters the camera module through the opticallens 10E, and then the light is filtered by the filter member 40E andreceived by the photosensitive element 21E to conduct a photoelectricconversion and generate image corresponding to the object.

In one embodiment of the camera module of the present invention, theoptical lens 10E is held in the photosensitive path of thephotosensitive element 21E by being installed on the integralencapsulating support structure 400E or on the camera lens supporter500E integrally formed with the integral encapsulating support structure400E. In another embodiment of the camera module of the presentinvention, the optical lens 10E is held in the photosensitive path ofthe photosensitive element 21E by being installed on the voice coilmotor 30E mounted on the integral encapsulating support structure 400E.

Referring to FIGS. 51 to 53, an alternative manufacture process of thecamera module of the present invention is illustrated. FIG. 51illustrates an example of a specific step of the manufacturing processof the camera module, wherein the photosensitive element 21E is mountedand electrically connected to the circuit board 22E, and the filtermember 40E is overlappingly disposed above the photosensitive element21E, so as to position the inner area of the filter member 40E incorrespondence with the photosensitive area of the photosensitiveelement 21E and to position the outer area of the filter member 40E incorrespondence with the non-photosensitive area of the photosensitiveelement 21E. The insulating member 800E is formed after an adhesiveelement applied on the filter member 40E by drawing or spraying issolidified.

FIG. 52 illustrates another step of the manufacturing process of thecamera module according to one embodiment, wherein the circuit board22E, the photosensitive element 21E, the filter member 40E, and theinsulating member 800E are received in the molding-die and beingcompressed against the upper mold of the molding-die. It is appreciatedthat due to the protruded insulating member 800E formed on the filtermember 40E, the upper mold of the molding-die can only contact with theinsulating member 800E that avoids any direct contact between the uppermold of the molding-die and the filter member 40E, so as to ensure thefilter member 40E from being damaged by pressure from the upper mold ofthe molding-die.

It is worth mentioning that the insulating member 800E formed by theadhesive element is preferred to have elasticity and flexibility aftersolidification, so that when tilt exist in the attachment of thephotosensitive element 21E and the circuit board 22E, the insulatingmember 800E is able to compensate. In other words, the insulating member800E insulates and isolates the inner area of the filter member 40E fromother components of the camera module, so as to prevent the liquid formmolding material from entering the inner area of the filter member 40Eduring the molding process of the integral encapsulating supportstructure 400E.

FIG. 53 illustrates a step of the formation of the integralencapsulating support structure 400E in the manufacturing process of thecamera module, wherein the molding material is received in themolding-die and heated to form the integral encapsulating supportstructure 400E after the molding material is solidified. The integralencapsulating support structure 400E will wrap up the circuit board 22Eand the outside area of the filter member 40E, so as to integrallycombine the integral encapsulating support structure 400E, the filtermember 40E, the photosensitive element 21E, and the circuit board 22Etogether.

It is appreciated that since the insulating member 800E insulates theinner area of the filter member 40E from the outer area thereof, themolding material added in the molding-die is prevented to flow to theinner area of the filter member 40E, that avoids burrs forming at theside facing the inner area of the filter member 40E of the integralencapsulating support structure 400E, so as to ensure the imagingquality of the camera module and increase the product yield rate of thecamera module.

And then, the optical lens 10E is supported in the photosensitive pathof the photosensitive element 21E to produce the camera module. When thecamera module is used, light reflected from an object enters the cameramodule through the optical lens 10E, and then the light is filtered bythe filter member 40E and received by the photosensitive element 21E toconduct a photoelectric conversion and generate image of thecorresponding object.

Referring to FIGS. 54 to 55, another manufacture process of the presentinvention is illustrated. FIG. 54 illustrates the conductive connectionof the circuit board 22E and the photosensitive element 21E of thecamera module, wherein the insulating member 800E is provided on thephotosensitive element 21E to divide the photosensitive area and thenon-photosensitive area of the photosensitive element 21E. When thecircuit board 22E, the photosensitive element 21E, and the insulatingmember 800E are placed in the molding-die, a covering film 104E providedon the bottom surface of the upper mold of the molding-die to protectthe upper mold from directly contacting with the photosensitive element21E or interacts with the insulating member 800E, such that the coveringfilm 104E and the insulating member 800E are in contact to protect theupper mold of the molding-die from directly pressing on thephotosensitive element 21E.

It is worth mentioning that, nevertheless FIG. 54 illustrates thephotosensitive element 21E of the present invention with the insulatingmember 800E provided thereon as an example to show the covering film104E interacting with the insulating member 800E, the covering film 104Eis able to be provided on a mold pressing surface of the upper mold ofthe molding-die 100E. Therefore, the difficulty of demolding has beenreduced and, due to the cushion effect and the connection between theinsulating member 800E and the covering film 104E, the tightness thereofis also enhanced.

FIG. 55 illustrates a step of forming the integral encapsulating supportstructure 400E in the manufacturing process of the camera module,wherein the molding-die, with the molding material placed therein, isadapted to form the integral encapsulating support structure 400E afterthe molding material is solidified, wherein the integral encapsulatingsupport structure 400E encapsulates at least the top surface of thecircuit board 22E, at least portion of the non-photosensitive area ofthe photosensitive element 21E, and the outer peripheral surface of theinsulating member 800E, so as to combine the integral encapsulatingsupport structure 400E, the photosensitive element 21E, and the circuitboard 22E to form an integral structure.

And then, the optical lens 10E is supported along the photosensitivepath of the photosensitive element 21E to produce the camera module.When the camera module is in used, light reflected from an object entersthe camera module through the optical lens 10E, and then the light isfiltered by the filter member 40E and received by the photosensitiveelement 21E to conduct photoelectric conversion and generate image ofthe respective object.

As shown in FIG. 56, the molding-die 100E forms an inner recess 105,corresponding to the photosensitive area of the photosensitive element21E, in the bottom surface of the molding-die 100E, so as to provide asafety gap between the photosensitive element 21E and the bottom surfaceof the molding-die 100E, that further reduces the adverse effect to thephotosensitive area of the photosensitive element 21E and prevents itfrom being damaged and scratched. It is appreciated that such innerrecess 105 may also utilize in the embodiments as illustrated in FIGS.54 and 55. In other words, the bottom surface of the molding-die in thepresent embodiment can also further provided with the covering film104E.

One skilled in the art will understand that the embodiment of thepresent invention as shown in the drawings and described above isexemplary only and not intended to be limiting.

It will thus be seen that the objects of the present invention have beenfully and effectively accomplished. The embodiments have been shown anddescribed for the purposes of illustrating the functional and structuralprinciples of the present invention and is subject to change withoutdeparture from such principles. Therefore, this invention comprises allmodifications encompassed within the spirit and scope of the followingclaims.

What is claimed is:
 1. A molded photosensitive assembly manufactured bya molding process via an upper mold having a pressing surface and alower mold, comprising: at least one circuit board having at least onechip mounting area; at least one photosensitive element, provided onsaid at least one chip mounting area of said at least one circuit board,having a photosensitive area and a non-photosensitive area; at least aset of wires, wherein two ends of each of said set of wires arerespectively connected to said at least one photosensitive element andsaid at least one circuit board; at least one supporting member formedby a first substance to seal said end of each of said set of wires atsaid at least one photosensitive element, wherein said supporting memberhas a through hole, a top surface, an inner surface and an outersurface, wherein said through hole is formed within said inner surface;and at least one molded base formed by a second substance to seal saidend of each of said set of wires at said at least one circuit board,wherein said at least one base comprises a molded body and has at leastone light window communicated with said through hole of said supportingmember, wherein said set of wires, said at least one circuit board andsaid at least one photosensitive element are protected by said at leastone supporting member when and after said at least one molded body ismolded, wherein said at least one molded body is integrally coupled tocover at least a part of said at least one circuit board and at least apart of said non-photosensitive area of said at least one photosensitiveelement, wherein said photosensitive area of said at least onephotosensitive element is positioned corresponding said at least onelight window of said at least one molded base, wherein a partial portionof said top surface of said supporting member is arranged for contactingwith the pressing surface of the upper mold to form a sealed environmentwithin said inner surface of said supporting member, wherein saidsupporting member blocks a molding material of said molded base enteringinto said through hole, such that said partial portion of said topsurface of said supporting member is unsealed and uncovered from saidmolded body, a remainder portion of said top surface of said supportingmember that is arranged for not contacting with the pressing surface ofthe upper mold is sealed and covered by said molded body, said outersurface of said supporting body is sealed and covered by said moldedbody while said inner surface of said supporting body is unsealed anduncovered to form said light window thereat above said top surface ofsaid supporting body.
 2. The molded photosensitive assembly, as recitedin claim 1, further comprising one or more electronic componentsintegrally encapsulated by said molded base, wherein said at least onecircuit board has a periphery area, wherein said periphery area and saidchip mounting area are integrally molded, wherein said one or moreelectronic components are provided on said periphery area, wherein saidat least one supporting member is positioned between said one or moreelectrical components and said photosensitive area of said at least onephotosensitive element, wherein said at least one supporting membercomprises a frame-shaped supporting body, wherein said supporting bodyis provided outside of said photosensitive area of said photosensitiveelement, wherein said photosensitive area of said at least onephotosensitive element is disposed corresponding to said through holewhile at least a part of said supporting body is covered by said atleast one molded body.
 3. The molded photosensitive assembly, as recitedin claim 1, wherein said top surface is extended inwardly and outwardlyto said inner surface and said outer surface respectively.
 4. The moldedphotosensitive assembly, as recited in claim 2, wherein said top surfaceis extended inwardly and outwardly to said inner surface and said outersurface respectively.
 5. The molded photosensitive assembly, as recitedin claim 1, wherein said mold photosensitive assembly comprises at leasttwo of said photosensitive elements, at least two sets of said wires andat least two of said supporting members, wherein said at least onecircuit board has two said chip mounting areas, wherein said at leasttwo photosensitive elements are provided on said two chip mounting areasof said at least one circuit board, wherein said at least two sets ofwires respectively and electrically connect said at least twophotosensitive elements with said at least one circuit board, whereinsaid at least one molded base has at least two of said light windowspositioned corresponding to said photosensitive areas of said twophotosensitive elements respectively, wherein said at least one circuitboard and said at least two photosensitive elements are protected bysaid at least two supporting members when and after said at least onemolded body is molded.
 6. The molded photosensitive assembly, as recitedin claim 5, further comprising one or more electronic components,wherein said at least one circuit board has a periphery area, whereinsaid periphery area and said at least two chip mounting areas areintegrally molded, wherein said one or more electronic components areprovided on said periphery area, wherein said at least two supportingmembers are positioned between said one or more electrical componentsand said photosensitive areas of said at least two photosensitiveelements, wherein each of said at least two supporting member comprisesa frame-shaped supporting body, wherein said supporting bodies areprovided outside of said photosensitive areas of said at least twophotosensitive elements respectively, wherein said photosensitive areasof said at least two photosensitive elements are disposed correspondingto said through holes respectively while at least a part of each of saidtwo supporting body is covered by said at least one molded body.
 7. Themolded photosensitive assembly, as recited in claim 5, wherein said topsurface is extended inwardly and outwardly to said inner surface andsaid outer surface respectively.
 8. The molded photosensitive assembly,as recited in claim 6, wherein said top surface is extended inwardly andoutwardly to said inner surface and said outer surface respectively. 9.The molded photosensitive assembly, as recited in claim 1, wherein saidnon-photosensitive area of said at least one photosensitive elementcomprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein said at least one photosensitive element hasa chip connector for electrically connecting with said set of wires,wherein said chip connector of said at least one photosensitive elementis disposed on said chip-connecting portion, wherein said chip-innerportion and said chip-outer portion are respectively positioned on aninside and an outside of said chip-connecting portion, wherein at leasta part of said chip-inner portion of said at least one photosensitiveelement is covered by said supporting body of said at least onesupporting member.
 10. The molded photosensitive assembly, as recited inclaim 2, wherein said non-photosensitive area of said at least onephotosensitive element comprises a chip-inner portion, a chip-connectingportion and a chip-outer portion, wherein said at least onephotosensitive element has a chip connector for electrically connectingwith said set of wires, wherein said chip connector of said at least onephotosensitive element is disposed on said chip-connecting portion,wherein said chip-inner portion and said chip-outer portion arerespectively positioned on an inside and an outside of saidchip-connecting portion, wherein at least a part of said chip-innerportion of said at least one photosensitive element is covered by saidsupporting body of said at least one supporting member.
 11. The moldedphotosensitive assembly, as recited in claim 2, wherein saidnon-photosensitive area of said at least one photosensitive elementcomprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein said at least one photosensitive element hasa chip connector for electrically connecting with said set of wires,wherein said chip connector of said at least one photosensitive elementis disposed on said chip-connecting portion, wherein said chip-innerportion and said chip-outer portion are respectively positioned on aninside and an outside of said chip-connecting portion, wherein at leasta part of said chip-inner portion and at least a part of saidchip-connecting portion of said non-photosensitive area of said at leastone photosensitive element are covered by said at least one supportingmember.
 12. The molded photosensitive assembly, as recited in claim 6,wherein each of said non-photosensitive areas of said at least twophotosensitive elements comprises a chip-inner portion, achip-connecting portion and a chip-outer portion, wherein each of saidat least two photosensitive elements has a chip connector forelectrically connecting with said set of wires, wherein said chipconnector of each of said at least two photosensitive elements isdisposed on said chip-connecting portion thereof, wherein saidchip-inner portion and said chip-outer portion are respectivelypositioned on an inside and an outside of said chip-connecting portionthereof, wherein at least a part of said chip-inner portion of each ofsaid at least two photosensitive elements is covered by said supportingbody of said at least one supporting member.
 13. The moldedphotosensitive assembly, as recited in claim 6, wherein each of saidnon-photosensitive areas of said at least two photosensitive elementscomprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein each of said at least two photosensitiveelements has a chip connector for electrically connecting with said setof wires, wherein said chip connector of each of said at least twophotosensitive elements is disposed on said chip-connecting portionthereof, wherein said chip-inner portion and said chip-outer portion arerespectively positioned on an inside and an outside of saidchip-connecting portion thereof, wherein at least a part of saidchip-inner portion and at least a part of said chip-connecting portionof each of said at least two photosensitive elements are covered by oneof said supporting bodies of said supporting member.
 14. A manufacturingmethod of a molded photosensitive assembly, comprising the steps of: (a)electrically connecting at least one photosensitive element with atleast one circuit board through a set of wires, wherein said at leastone photosensitive element is provided on a chip mounting area of saidat least one circuit board, wherein the step (a) comprises the steps of:(a.1) connecting one end of said set of wires at said at least onephotosensitive element; (a.2) connecting another end of said set ofwires at said at least one circuit board; and (a.3) sealing at least asupporting member at said end of said set of wires at said at least onephotosensitive element, wherein said supporting member is upwardlyprotruded from said at least one photosensitive element, wherein saidsupporting member has an inner surface, an outer surface, and a throughhole defined within said inner surface; (b) placing said at least onephotosensitive element and said at least one circuit board in a moldingcavity of a molding-die which comprises an upper mold and a lower mold,wherein said molding cavity is formed between said lower mold and saidupper mold when said upper mold and said lower mold are closed andclamped, wherein the step (b) comprises the steps of: (b.1) placing saidat least one photosensitive element and said at least one circuit boardon said lower mold; (b.2) closing said lower mold by said upper moldwhen said supporting body is pressed by a pressing surface of said uppermold to form a sealed environment at said inner surface of saidsupporting body and to prevent said set of wires being pressed by saidpressing surface of said upper mold, wherein said pressing surface ofsaid upper mold is pressed against a partial portion of a top surface ofsaid supporting member; (c) when a molding material is added in saidmolding cavity, reducing an impact force generated by said moldingmaterial with said supporting member provided in said molding cavity toblock said molding material entering into said closed environment, suchthat said supporting member blocks said molding material entering intosaid through hole; and (d) forming at least one molded base after saidmolding material is solidified and cured to seal said end of each ofsaid set of wires at said at least one circuit board, wherein said atleast one molded base comprises a molded body and has a light windowpositioned corresponding to a photosensitive area of said at least onephotosensitive element, wherein a periphery area of said at least onecircuit board, said at least one supporting member and at least a partof a non-photosensitive area of said at least one photosensitive elementare covered by said molded body, wherein said outer surface ofsupporting member is sealed and covered by said molded body while saidinner surface of said supporting member is unsealed to form said lightwindow thereat, wherein said partial portion of said top surface of saidsupporting member is unsealed and uncovered from said molded body whilea remainder portion of said top surface of said supporting member thatis arranged for not contacting with the pressing surface of the uppermold is sealed and covered by said molded body.
 15. The manufacturingmethod, as recited in claim 14, wherein said supporting member isdisposed to cover at least a part of said set of wires.
 16. Themanufacturing method, as recited in claim 15, further comprising a stepof integrally molding one or more electronic components provided on aperiphery area and said chip mounting area of said at least one circuitboard, wherein said at least one supporting member is positioned betweensaid one or more electrical components and said photosensitive area ofsaid at least one photosensitive element, wherein said at least onesupporting member comprises a frame-shaped supporting body, wherein saidsupporting body is provided outside of said photosensitive area of saidphotosensitive element, wherein said photosensitive area of said atleast one photosensitive element is disposed corresponding to saidthrough hole while at least a part of said supporting body is covered bysaid at least one molded body.
 17. The manufacturing method, as recitedin claim 16, wherein said top surface being pressed by said pressingsurface of said upper mold, wherein said top surface is extendedinwardly and outwardly to said inner surface and said outer surfacerespectively, wherein said through hole is formed by said inner surfaceand is uncovered by said molded body, and at least said outer surface ofsaid supporting body is covered by said molded body.
 18. Themanufacturing method, as recited in claim 16, wherein said top surfacebeing pressed by said pressing surface of said upper mold, wherein saidtop surface is extended inwardly and outwardly to said inner surface andsaid outer surface respectively, wherein said through hole is formed bysaid inner surface and is uncovered by said molded body, wherein saidouter surface of said supporting body and at least a part of said topsurface are covered by said molded body.
 19. The manufacturing method,as recited in claim 17, wherein said non-photosensitive area of said atleast one photosensitive element comprises a chip-inner portion, achip-connecting portion and a chip-outer portion, wherein said at leastone photosensitive element has a chip connector for electricallyconnecting with said set of wires, wherein said chip connector of saidat least one photosensitive element is disposed on said chip-connectingportion, wherein said chip-inner portion and said chip-outer portion arerespectively positioned on an inside and an outside of saidchip-connecting portion, wherein at least a part of said chip-innerportion of said at least one photosensitive element is covered by saidsupporting body of said at least one supporting member.
 20. Themanufacturing method, as recited in claim 18, wherein saidnon-photosensitive area of said at least one photosensitive elementcomprises a chip-inner portion, a chip-connecting portion and achip-outer portion, wherein said at least one photosensitive element hasa chip connector for electrically connecting with said set of wires,wherein said chip connector of said at least one photosensitive elementis disposed on said chip-connecting portion, wherein said chip-innerportion and said chip-outer portion are respectively positioned on aninside and an outside of said chip-connecting portion, wherein at leasta part of said chip-inner portion and at least a part of saidchip-connecting portion of said non-photosensitive area of said at leastone photosensitive element are covered by said at least one supportingmember.